Patents by Inventor Tatsuya HASHIZUME

Tatsuya HASHIZUME has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11119004
    Abstract: A strain estimation device according to an aspect of the present disclosure is a strain estimation device that estimates strain of a component provided in a fluid and includes a pressure acquisition unit that acquires a pressure signal including time-series pressure values at a predetermined position in a vicinity of the component, an estimation unit that estimates, based on the pressure signal, a strain signal including time-series strain values occurring at the component, and an output unit that outputs the strain signal. The estimation unit converts the pressure signal into the strain signal using an estimation filter determined based on a power spectral density of pressure and a power spectral density of strain occurring at the component when the pressure is applied to the position.
    Type: Grant
    Filed: December 28, 2016
    Date of Patent: September 14, 2021
    Assignee: IHI Corporation
    Inventor: Tatsuya Hashizume
  • Publication number: 20190212137
    Abstract: A strain estimation device according to an aspect of the present disclosure is a strain estimation device that estimates strain of a component provided in a fluid and includes a pressure acquisition unit that acquires a pressure signal including time-series pressure values at a predetermined position in a vicinity of the component, an estimation unit that estimates, based on the pressure signal, a strain signal including time-series strain values occurring at the component, and an output unit that outputs the strain signal. The estimation unit converts the pressure signal into the strain signal using an estimation filter determined based on a power spectral density of pressure and a power spectral density of strain occurring at the component when the pressure is applied to the position.
    Type: Application
    Filed: December 28, 2016
    Publication date: July 11, 2019
    Applicant: IHI Corporation
    Inventor: Tatsuya HASHIZUME