Patents by Inventor Tatsuya Kawaji

Tatsuya Kawaji has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10217652
    Abstract: Disclosed is a heat treatment apparatus for performing a heat treatment on a coating film formed on a substrate. The apparatus includes a placing unit provided within a processing container, and configured to place the substrate thereon; a heating unit configured to heat the substrate placed on the placing unit; a gas supply port provided along a circumferential direction outside the substrate on the placing unit in a plan view, and configured to supply gas into the processing container; an outer circumferential exhaust port provided along the circumferential direction outside the substrate on the placing unit in a plan view, and configured to exhaust an inside of the processing container; and a central exhaust port provided above a central portion of the substrate on the placing unit, and configured to exhaust the inside of the processing container.
    Type: Grant
    Filed: December 3, 2015
    Date of Patent: February 26, 2019
    Assignee: Tokyo Electron Limited
    Inventors: Masato Mizuta, Tatsuya Kawaji, Keigo Nakano
  • Publication number: 20160172218
    Abstract: Disclosed is a heat treatment apparatus for performing a heat treatment on a coating film formed on a substrate. The apparatus includes a placing unit provided within a processing container, and configured to place the substrate thereon; a heating unit configured to heat the substrate placed on the placing unit; a gas supply port provided along a circumferential direction outside the substrate on the placing unit in a plan view, and configured to supply gas into the processing container; an outer circumferential exhaust port provided along the circumferential direction outside the substrate on the placing unit in a plan view, and configured to exhaust an inside of the processing container; and a central exhaust port provided above a central portion of the substrate on the placing unit, and configured to exhaust the inside of the processing container.
    Type: Application
    Filed: December 3, 2015
    Publication date: June 16, 2016
    Inventors: Masato Mizuta, Tatsuya Kawaji, Keigo Nakano
  • Patent number: 8186077
    Abstract: A disclosed heating apparatus for heating a substrate on which a film is coated includes a process chamber having a gas supply opening for supplying a first gas to the process chamber and a gas evacuation opening for evacuating the first gas from the process chamber; a heating plate that is arranged in the process chamber and includes a heating element for heating the substrate; plural protrusions arranged on the heating plate so as to support the substrate; plural suction holes formed in the heating plate so as to attract by suction the substrate toward the heating plate; and a gas inlet adapted to supply a second gas to a gap between the heating plate and the substrate supported by the plural protrusions.
    Type: Grant
    Filed: June 6, 2011
    Date of Patent: May 29, 2012
    Assignee: Tokyo Electron Limited
    Inventors: Tatsuya Kawaji, Yuichi Sakai, Masatoshi Kaneda
  • Publication number: 20110233187
    Abstract: A disclosed heating apparatus for heating a substrate on which a film is coated includes a process chamber having a gas supply opening for supplying a first gas to the process chamber and a gas evacuation opening for evacuating the first gas from the process chamber; a heating plate that is arranged in the process chamber and includes a heating element for heating the substrate; plural protrusions arranged on the heating plate so as to support the substrate; plural suction holes formed in the heating plate so as to attract by suction the substrate toward the heating plate; and a gas inlet adapted to supply a second gas to a gap between the heating plate and the substrate supported by the plural protrusions.
    Type: Application
    Filed: June 6, 2011
    Publication date: September 29, 2011
    Applicant: TOKYO ELECTRON LIMITED
    Inventors: Tatsuya KAWAJI, Yuichi SAKAI, Masatoshi KANEDA
  • Patent number: 7992318
    Abstract: A disclosed heating apparatus for heating a substrate on which a film is coated includes a process chamber having a gas supply opening for supplying a first gas to the process chamber and a gas evacuation opening for evacuating the first gas from the process chamber; a heating plate that is arranged in the process chamber and includes a heating element for heating the substrate; plural protrusions arranged on the heating plate so as to support the substrate; plural suction holes formed in the heating plate so as to attract by suction the substrate toward the heating plate; and a gas inlet adapted to supply a second gas to a gap between the heating plate and the substrate supported by the plural protrusions.
    Type: Grant
    Filed: January 17, 2008
    Date of Patent: August 9, 2011
    Assignee: Tokyo Electron Limited
    Inventors: Tatsuya Kawaji, Yuichi Sakai, Masatoshi Kaneda
  • Publication number: 20080175999
    Abstract: A disclosed heating apparatus for heating a substrate on which a film is coated includes a process chamber having a gas supply opening for supplying a first gas to the process chamber and a gas evacuation opening for evacuating the first gas from the process chamber; a heating plate that is arranged in the process chamber and includes a heating element for heating the substrate; plural protrusions arranged on the heating plate so as to support the substrate; plural suction holes formed in the heating plate so as to attract by suction the substrate toward the heating plate; and a gas inlet adapted to supply a second gas to a gap between the heating plate and the substrate supported by the plural protrusions.
    Type: Application
    Filed: January 17, 2008
    Publication date: July 24, 2008
    Inventors: Tatsuya Kawaji, Yuichi Sakai, Masatoshi Kaneda