Abstract: A semiconductor device production method of the invention includes a step of packaging a semiconductor chip with a transparent material (14) which penetrates a laser beam (13) within a predetermined range of wavelength having sufficient energy to cut part of an adjustable circuit (12), and a step of trimming part of the adjustable circuit (12) to obtain a target value of electric properties for the adjustable circuit by focusing, after the packaging step, the laser beam (13) onto the adjustable circuit from an upper surface of the semiconductor chip through the transparent material.

Abstract: A video signal processor comprises a first filtering circuit, a first and a second emphasis circuits, a noise removing circuit, and a converter. The first filtering circuit filters an input video signal, and extracts a low frequency component. The first emphasis circuit emphasizes the low frequency component, and outputs a first emphasized signal. The second emphasis circuit emphasizes the first emphasized signal, and outputs a second emphasized signal. The noise removing circuit removes a noise component from either the first emphasized signal or the second emphasized signal, and outputs the noise-removed signal. The converter converts the noise-removed signal into a frequency-modulated signal.