Patents by Inventor Tatsuya NAKATSUGAWA

Tatsuya NAKATSUGAWA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12254608
    Abstract: There are provided a sample acquisition information management device, a sample acquisition information management system, and a sample acquisition information management method that allow a subject who is to collect a sample by oneself to reliably perform a sample acquisition operation. Each of the sample acquisition information management device and the sample acquisition information management system includes an image acquisition unit (16) that acquires an image and a video of a sample acquisition operation of a subject using a sample examination kit, an output unit (18) that outputs acquisition means information and operation check information, and a processing unit (20) that determines whether or not the image or the video acquired by the image acquisition unit (16) corresponds to a correct sample acquisition operation and controls display of the acquisition means information and the operation check information.
    Type: Grant
    Filed: September 25, 2020
    Date of Patent: March 18, 2025
    Assignee: FUJIFILM Corporation
    Inventors: Haruyasu Nakatsugawa, Seiji Yamashita, Tatsuya Ishizaka
  • Patent number: 10998108
    Abstract: An electrical contact material (10) having: a conductive substrate (1) formed from copper or a copper alloy; a first intermediate layer (2) provided on the conductive substrate (1); a second intermediate layer (3) provided on the first intermediate layer (2); and an outermost layer (4) formed from tin or a tin alloy and provided on the second intermediate layer (3), wherein the first intermediate layer (2) is constructed as one layer of grains extending from the conductive substrate (1) side to the second intermediate layer (3) side, and wherein, in the first intermediate layer (2), the density of grain boundaries (5b) extending in a direction in which the angle formed by the grain boundary in interest and the interface between the conductive substrate and the first intermediate layer is 45° or greater, is 4 ?m/?m2 or less; a method of producing the same; and a terminal.
    Type: Grant
    Filed: November 29, 2016
    Date of Patent: May 4, 2021
    Assignees: FURUKAWA ELECTRIC CO., LTD., FURUKAWA AUTOMOTIVE SYSTEMS INC.
    Inventors: Yoshikazu Okuno, Yoshiaki Kobayashi, Tatsuya Nakatsugawa, Kengo Mitose, Akira Tachibana, Shingo Kawata
  • Publication number: 20170076834
    Abstract: An electrical contact material (10) having: a conductive substrate (1) formed from copper or a copper alloy; a first intermediate layer (2) provided on the conductive substrate (1); a second intermediate layer (3) provided on the first intermediate layer (2); and an outermost layer (4) formed from tin or a tin alloy and provided on the second intermediate layer (3), wherein the first intermediate layer (2) is constructed as one layer of grains extending from the conductive substrate (1) side to the second intermediate layer (3) side, and wherein, in the first intermediate layer (2), the density of grain boundaries (5b) extending in a direction in which the angle formed by the grain boundary in interest and the interface between the conductive substrate and the first intermediate layer is 45° or greater, is 4 ?m/?m2 or less; a method of producing the same; and a terminal.
    Type: Application
    Filed: November 29, 2016
    Publication date: March 16, 2017
    Applicants: FURUKAWA ELECTRIC CO., LTD., FURUKAWA AUTOMOTIVE SYSTEMS INC.
    Inventors: Yoshikazu OKUNO, Yoshiaki KOBAYASHI, Tatsuya NAKATSUGAWA, Kengo MITOSE, Akira TACHIBANA, Shingo KAWATA