Patents by Inventor Tatsuya Yamaguchi

Tatsuya Yamaguchi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230070274
    Abstract: A film forming system includes: a film forming apparatus which includes a processing container, a stage provided in the processing container, a structure provided in the processing container and having recesses, and a window provided on a wall surface of the processing container; a measurement device which includes a light emitter, a light receiver, and a measurer configured to measure a light reflectance for each wavelength in the structure based on an intensity of light emitted to the structure and an intensity of light reflected from the structure; and a control device which includes an estimator configured to estimate a thickness of a film formed on a substrate based on the light reflectance for each wavelength in the structure, and a controller configured to stop film formation on the substrate when the estimated thickness of the film reaches a predetermined thickness.
    Type: Application
    Filed: August 24, 2022
    Publication date: March 9, 2023
    Inventors: Syuji NOZAWA, Tatsuya YAMAGUCHI
  • Publication number: 20230067094
    Abstract: A substrate processing apparatus including: a processing container; a stage installed in the processing container and configured to place a substrate thereon; a ceiling plate installed at a position facing the stage in the processing container; a driver configured to raise and lower the stage; an exhaust port formed in a side wall of the processing container and configured to exhaust a gas in the processing container; and a controller configured to control conductance of a space between the exhaust port and a processing space between the stage and the ceiling plate by controlling the driver to adjust a distance between a peripheral edge portion of the stage and a facing member disposed at a position facing the peripheral edge portion in the processing container.
    Type: Application
    Filed: August 18, 2022
    Publication date: March 2, 2023
    Inventors: Tatsuya YAMAGUCHI, Syuji NOZAWA
  • Publication number: 20230049327
    Abstract: An object of the present invention is to provide a compound that can be used as a more superior therapeutic agent for central nervous system diseases.
    Type: Application
    Filed: February 14, 2022
    Publication date: February 16, 2023
    Applicant: OTSUKA PHARMACEUTICAL CO., LTD.
    Inventors: Hiroshi YAMASHITA, Tetsuya SATO, Takuya MINOWA, Yusuke HOSHIKA, Hidekazu TOYOFUKU, Tatsuya YAMAGUCHI, Masahiro SOTA, Shuuji KAWANO, Takayuki NAKAMURA, Ryohei ETO, Takuma IKEBUCHI, Kei MORIYAMA, Nobuaki ITO
  • Publication number: 20230051822
    Abstract: A film forming apparatus includes a stage on which a substrate is mounted, a first container configured to accommodate the stage, a gas supply configured to supply gases containing two types of monomers into the first container to form a polymer film on the substrate mounted on the stage, a porous member arranged radially outward from a processing space, which is a space above the substrate, and configured to draw in polymers formed by the gases containing two types of monomers exhausted from the first container, and a heater configured to heat the porous member to a first temperature when the polymer film is formed on the substrate.
    Type: Application
    Filed: August 9, 2022
    Publication date: February 16, 2023
    Inventor: Tatsuya YAMAGUCHI
  • Patent number: 11581201
    Abstract: A heat treatment apparatus includes: a processing container configured to accommodate and process a plurality of substrates in multiple tiers under a reduced-pressure environment; a first heater configured to heat the plurality of substrates accommodated in the processing container; a plurality of gas supply pipes configured to supply a gas to positions having different heights in the processing container; and a second heater provided on a gas supply pipe that supplies a gas to a lowermost position among the plurality of gas supply pipes, and configured to heat the gas in the gas supply pipe.
    Type: Grant
    Filed: March 17, 2020
    Date of Patent: February 14, 2023
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Kazuteru Obara, Tatsuya Yamaguchi, Yasuaki Kikuchi, Ryuji Kusajima, Shinya Nasukawa, Kazuyuki Kikuchi
  • Patent number: 11569098
    Abstract: A heat treatment apparatus includes: a processing container extended in a vertical direction; and a heater provided to surround the processing container. The heater includes: a first insulator of a cylindrical shape that has a ceiling surface and an opening at a lower end; a heat generator provided along a circumferential direction on an inner circumferential side of the first insulating member; and a second insulator arranged along the circumferential direction of the first insulating member at a position adjacent to the heat generating elements.
    Type: Grant
    Filed: April 30, 2019
    Date of Patent: January 31, 2023
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Tatsuya Yamaguchi, Yasuaki Kikuchi
  • Publication number: 20230009720
    Abstract: A method of forming a film is performed in a heat treatment apparatus that includes a processing container, a tubular member provided in the processing container, a heater configured to heat an inside of the processing container, and a gas supply. The method includes: providing a substrate in the tubular member; adjusting a temperature inside the tubular member by the heater; and after adjusting the temperature, supplying a gas containing a film-forming gas from the gas supply into the processing container to form a film on the substrate. In the adjusting the temperature, a gas containing a heat transfer gas is supplied from the gas supply into the processing container.
    Type: Application
    Filed: July 5, 2022
    Publication date: January 12, 2023
    Inventors: Yasuaki KIKUCHI, Tsubasa YOKOI, Tatsuya YAMAGUCHI, Keisuke SUZUKI
  • Publication number: 20230010649
    Abstract: A method of manufacturing a semiconductor device, includes forming a sacrificial film made of a polymer having a urea bond on a substrate by supplying an amine and an isocyanate to a surface of the substrate, wherein the sacrificial film is provided in a specific region of the substrate; performing a predetermined process on the substrate on which the sacrificial film is formed; and removing the sacrificial film by heating the substrate to depolymerize the polymer, wherein a carbon bonded to a nitrogen atom contained in an isocyanate group of the isocyanate is a secondary or tertiary non-aromatic carbon.
    Type: Application
    Filed: June 30, 2022
    Publication date: January 12, 2023
    Inventor: Tatsuya YAMAGUCHI
  • Publication number: 20220392813
    Abstract: A control method of a film forming apparatus includes (a) acquiring a first temperature measured by a first temperature sensor in a tubular member in a processing container of the film forming apparatus; (b) calculating a first power to be output to a heating unit disposed in the processing container; (c) acquiring a second temperature measured by a second temperature sensor provided outside the tubular member in the processing container; (d) calculating a second power to be output to the heating unit; (e) calculating a predicted value of the second temperature at a predetermined time ahead, from the second temperature based on a prediction model; (f) outputting either the first power or the second power to the heating unit according to the predicted value of the second temperature; and (g) repeating (a) to (f) in a predetermined cycle.
    Type: Application
    Filed: May 31, 2022
    Publication date: December 8, 2022
    Inventors: Akira HIRATA, Tatsuya YAMAGUCHI
  • Publication number: 20220373260
    Abstract: A heat treatment apparatus including: a cylindrical processing container; a heater configured to heat the processing container; and a cooler configured to cool the processing container, wherein the cooler includes: discharge holes provided at intervals in a longitudinal direction of the processing container, the discharge holes being configured to discharge a cooling medium toward the processing container; a branch configured to divide the cooling medium into a plurality of flowing paths that communicate with the discharge holes; and blowers provided for respective ones of the flowing paths, the blowers being configured to send the cooling medium to the discharge holes that communicate with the respective ones of the flowing paths.
    Type: Application
    Filed: May 10, 2022
    Publication date: November 24, 2022
    Inventors: Kazuteru OBARA, Tatsuya YAMAGUCHI
  • Patent number: 11495490
    Abstract: A semiconductor device manufacturing method of forming a trench and a via in a porous low dielectric constant film formed on a substrate as an interlayer insulating film, includes: embedding a polymer having a urea bond in pores of the porous low dielectric constant film by supplying a raw material for polymerization to the porous low dielectric constant film; forming the via by etching the porous low dielectric constant film; subsequently, embedding a protective filling material made of an organic substance in the via; subsequently, forming the trench by etching the porous low dielectric constant film; subsequently, removing the protective filling material; and after the forming a trench, removing the polymer from the pores of the porous low dielectric constant film by heating the substrate to depolymerize the polymer, wherein the embedding a polymer having a urea bond in pores is performed before the forming a trench.
    Type: Grant
    Filed: December 30, 2020
    Date of Patent: November 8, 2022
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Koichi Yatsuda, Tatsuya Yamaguchi, Yannick Feurprier, Frederic Lazzarino, Jean-Francois de Marneffe, Khashayar Babaei Gavan
  • Publication number: 20220307770
    Abstract: A heat treatment apparatus according to one aspect of the present disclosure includes a vertically long process chamber, a heater configured to heat the process chamber, and a cooler configured to cool the process chamber. The cooler includes a plurality of discharge holes provided at intervals along a longitudinal direction of the process chamber to discharge cooling fluid toward the process chamber and a plurality of shutters provided corresponding to the plurality of discharge holes. At least one of the plurality of shutters is configured to move to an open position independently of other shutters.
    Type: Application
    Filed: March 17, 2022
    Publication date: September 29, 2022
    Inventors: Tatsuya YAMAGUCHI, Toshiyuki ITO
  • Patent number: 11456184
    Abstract: A method is provided. In the method, a substrate having a first region and a second region on a substrate surface is provided. A film deposition material to form a first chemical bond in the first region and a second chemical bond in the second region is supplied to the substrate surface. The second bond has a second bond energy lower than a first bond energy of the first chemical bond. A film is selectively formed in the first region by supplying an energy lower than the first bond energy of the first chemical bond and higher than the second bond energy of the second chemical bond.
    Type: Grant
    Filed: October 23, 2020
    Date of Patent: September 27, 2022
    Assignee: Tokyo Electron Limited
    Inventors: Ryuichi Asako, Tatsuya Yamaguchi
  • Publication number: 20220297665
    Abstract: A motor control system includes an MG, a battery, an SMR, and an MG-ECU. The MG-ECU is configured to control the MG in accordance with an instruction provided through communication. The MG-ECU is configured to execute autonomous power generation control of the MG in an event of a fault in the communication. The autonomous power generation control is control in which the MG-ECU causes the MG to generate a predetermined voltage not in accordance with the instruction. The MG-ECU is configured to, when a fault is detected in the communication, start the autonomous power generation control after the SMR has finished switching from an off state to an on state.
    Type: Application
    Filed: March 3, 2022
    Publication date: September 22, 2022
    Inventors: Koji MURAKAMI, Tatsuya YAMAGUCHI, Kensuke NAKANISHI
  • Patent number: 11424143
    Abstract: Provided is a heat insulation structure used for a vertical heat treatment apparatus that performs a heat treatment on a substrate. The vertical heat treatment apparatus includes: a processing container having a double tube structure including an inner tube and an outer tube closed upward, the processing container having an opening at a lower end thereof; a gas supply section and exhaust section provided on a lower side of the processing container; a lid configured to introduce or discharge the substrate into or from the opening and to open/close the opening; and a heating section provided to cover the processing container from an outside. The heat insulation structure is provided between the inner tube and the outer tube.
    Type: Grant
    Filed: March 11, 2019
    Date of Patent: August 23, 2022
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Koji Yoshii, Tatsuya Yamaguchi, Hiroyuki Hayashi, Mitsuhiro Okada, Satoshi Takagi, Toshihiko Takahashi, Masafumi Shoji, Kazuya Kitamura
  • Publication number: 20220250879
    Abstract: Provided is a work vehicle that can be transported by being loaded onto a trailer without having the outriggers removed. The work vehicle (rough terrain crane) is transported by being loaded onto a low bed trailer including a low bed and a high portion (first high bed, second high bed) higher than the low bed in at least one of the front and the rear of the low bed, and includes: outrigger units (front outrigger unit, rear outrigger unit) that are mounted to the front and rear of a vehicle body; and a lift unit that lifts and lowers the outrigger units (front outrigger unit, rear outrigger unit with respect to the vehicle body.
    Type: Application
    Filed: June 24, 2020
    Publication date: August 11, 2022
    Applicant: TADANO LTD.
    Inventors: Yoshitaka SAIJO, Masanori OSHIMA, Seiji TAKEDA, Tatsuya YAMAGUCHI, Yudai MASUDA
  • Patent number: 11387139
    Abstract: A method of manufacturing a semiconductor device, the method including: a first film deposition process of stacking a polymer film on a substrate on which a recess is formed, wherein the polymer film is a film of a polymer having a urea bond and is formed by polymerizing a plurality of kinds of monomers; a second film deposition process of stacking a sealing film on the substrate in a state in which at least a bottom and a sidewall of the recess are covered with the polymer film; and a desorbing process of desorbing and diffusing the polymer film under the sealing film through the sealing film by depolymerizing the polymer film by heating the substrate to a first temperature.
    Type: Grant
    Filed: March 3, 2020
    Date of Patent: July 12, 2022
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Syuji Nozawa, Tatsuya Yamaguchi, Sunghil Lee
  • Patent number: 11373874
    Abstract: An etching method for etching a silicon-containing film formed in a substrate by supplying an etching gas to the substrate is provided. The method includes supplying an amine gas to the substrate, in which the silicon-containing film, a porous film, and a non-etching target film that is a film not to be etched but is etchable by the etching gas are sequentially formed adjacent to each other, so that amine is adsorbed onto walls of pores of the porous film. The method further includes supplying the etching gas for etching the silicon-containing film to the substrate in which the amine is adsorbed onto the walls of the pores of the porous film.
    Type: Grant
    Filed: March 20, 2020
    Date of Patent: June 28, 2022
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Nobuhiro Takahashi, Ayano Hagiwara, Yasuo Asada, Tatsuya Yamaguchi
  • Patent number: 11367633
    Abstract: A heat treatment apparatus includes: a vertically-extended processing container configured to accommodate a substrate; a gas supply including a gas supply pipe that extends along an inner wall surface of the processing container in a vertical direction; a heater having a heat insulating material provided around the processing container, and a heating element provided along the inner wall surface of the heat insulating material; and a cooler having a fluid flow path formed outside the heat insulating material, and a blowing-out hole penetrating the heat insulating material and configured to blow out a cooling fluid toward the gas supply pipe, the blowing-out hole having one end that communicates with the fluid flow path and a remaining end that communicates with a space between the processing container and the heat insulating material. A plurality of blowing-out holes is provided in the gas supply pipe in a longitudinal direction.
    Type: Grant
    Filed: July 18, 2019
    Date of Patent: June 21, 2022
    Assignee: TOKYO ELECTRON LIMITED
    Inventor: Tatsuya Yamaguchi
  • Publication number: 20220163260
    Abstract: A blast furnace fault determination apparatus includes a processor configured to: calculate a fault index indicative of a degree of fault in a blast furnace; calculate a ventilation index of the blast furnace; and determine a fault condition in the blast furnace using the fault index and the ventilation index.
    Type: Application
    Filed: March 31, 2020
    Publication date: May 26, 2022
    Applicant: JFE STEEL CORPORATION
    Inventors: Hiroyuki SHIMAMOTO, Tomohiko ITO, Tatsuya YAMAGUCHI, Nozomu NISHIMURA