Abstract: The disclosure provides an electronic device and a manufacturing method thereof. The electronic device includes a package structure, a circuit structure, a bonding structure and an external element. The circuit structure is disposed on the package structure and is electrically connected to the package structure. The circuit structure has a recess. The bonding structure includes a first bonding pad and a second bonding pad. The second bonding pad is disposed in the recess, and the second bonding pad is disposed on the first bonding pad. The bonding structure is disposed between the circuit structure and the external element. The external element is electrically connected to the circuit structure through the bonding structure. A width of the first bonding pad is smaller than a width of the second bonding pad.

Abstract: A highly-closed headphone apparatus with wearing comfort mainly includes a headphone main body and a headband pivotally attached onto the headphone main body. The headphone main body includes a housing formed by a front housing member and a rear housing member as well as a speaker arranged inside the housing. The headband includes two ends connected to the housing and a covering pad enclosing an inner surface of the housing thereon. The covering pad is made of a tensile silicon rubber of 30˜50 degrees. The covering pad has a bottom edge portion has a greater thickness and extends upward therefrom to a surface with a decreasing thickness. Accordingly, with the covering pad with the decreasing thickness for positioning, a contact surface thereof is comfortable for wearing to achieve the highly-closed effect without the feeling of compression. Consequently, the headphone apparatus can sufficiently isolate external sounds and provide excellent listening quality.

Abstract: Integrated circuit chips and chip packages are disclosed that include an over-passivation scheme at a top of the integrated circuit chip and a bottom scheme at a bottom of the integrated circuit chip using a top post-passivation technology and a bottom structure technology. The integrated circuit chips can be connected to an external circuit or structure, such as ball-grid-array (BGA) substrate, printed circuit board, semiconductor chip, metal substrate, glass substrate or ceramic substrate, through the over-passivation scheme or the bottom scheme. Related fabrication techniques are described.

Abstract: A device is described which includes a waveguide structure for signal transmission and power/ground delivery The waveguide structure includes a signal transmission part for transmitting an optical signal from an illuminant device to a detector. The signal transmission part may include transparent polymer, diamond or glass. The signal transmission part is used for a waveguide. The waveguide structure further includes a power/ground delivery part surrounding the signal transmission part. The power/ground delivery part is composed of at least one metal layer. Thus, the waveguide structure can provide an optical-signal transmission with high speed and high volume through the signal transmission part, while a stable power or ground reference can be provided to multiple units through the power/ground delivery part.

Abstract: Integrated circuit chips and chip packages are disclosed that include an over-passivation scheme at a top of the integrated circuit chip and a bottom scheme at a bottom of the integrated circuit chip using a top post-passivation technology and a bottom structure technology. The integrated circuit chips can be connected to an external circuit or structure, such as ball-grid-array (BGA) substrate, printed circuit board, semiconductor chip, metal substrate, glass substrate or ceramic substrate, through the over-passivation scheme or the bottom scheme. Related fabrication techniques are described.

Abstract: Integrated circuit chips and chip packages are disclosed that include an over-passivation scheme at a top of the integrated circuit chip and a bottom scheme at a bottom of the integrated circuit chip using a top post-passivation technology and a bottom structure technology. The integrated circuit chips can be connected to an external circuit or structure, such as ball-grid-array (BGA) substrate, printed circuit board, semiconductor chip, metal substrate, glass substrate or ceramic substrate, through the over-passivation scheme or the bottom scheme. Related fabrication techniques are described.

Abstract: Multichip packages or multichip modules may include stacked chips and through silicon/substrate vias (TSVs) formed using enclosure-first technology. Enclosure-first technology may include forming an isolation enclosure associated with a TSV early in the fabrication process, without actually forming the associated TSV. The TSV associated with the isolation enclosure is formed later in the fabrication process. The enclosure-first technology allows the isolation enclosures to be used as alignment marks for stacking additional chips. The stacked chips can be connected to each other or to an external circuit such that data input is provided through the bottom-most (or topmost) chip, data is output from the bottom-most (or topmost) chip. The multichip package may provide a serial data connection, and a parallel connection, to each of the stacked chips.

Abstract: A device is described which includes a waveguide structure for signal transmission and power/ground delivery The waveguide structure includes a signal transmission part for transmitting an optical signal from an illuminant device to a detector. The signal transmission part may include transparent polymer, diamond or glass. The signal transmission part is used for a waveguide. The waveguide structure further includes a power/ground delivery part surrounding the signal transmission part. The power/ground delivery part is composed of at least one metal layer. Thus, the waveguide structure can provide an optical-signal transmission with high speed and high volume through the signal transmission part, while a stable power or ground reference can be provided to multiple units through the power/ground delivery part.

Abstract: A removable hard disk device includes a handle, a first holder, a hard disk drive located between the handle and the first holder, and two second holders pivotally connected to ends of the first holder and detachably connected to ends of the handle with the two second holders firmly holding the hard disk drive there between and detachably connected to the disk drive. When the second holders are forced to pivotally move outwardly relative to each other, the second holders will be separated from the first holder and the handle such that the hard disk drive can be dismounted from the first holder without using any tool.

Abstract: Integrated circuit chips and chip packages are disclosed that include an over-passivation scheme at a top of the integrated circuit chip and a bottom scheme at a bottom of the integrated circuit chip using a top post-passivation technology and a bottom structure technology. The integrated circuit chips can be connected to an external circuit or structure, such as ball-grid-array (BGA) substrate, printed circuit board, semiconductor chip, metal substrate, glass substrate or ceramic substrate, through the over-passivation scheme or the bottom scheme. Related fabrication techniques are described.

Abstract: A case unit for a storage device includes a main case having an accommodation chamber, a subsidiary case detachably and drawably mounted in the accommodation chamber of the main case, and a circuit board mounted with the subsidiary case. As long as the subsidiary case is taken out of the accommodation chamber of the main case, the circuit board can be repaired, thereby enhancing convenience of assembly and repair works.

Abstract: A handle assembly for use in cooperation with a hard disk case includes a base with a first retaining portion, a handle pivotally connected with the base, a movable member mounted to a connecting end of the handle. The movable member is movable between a first position where a second retaining portion of the movable member is engaged with the first retaining portion of the base such that the handle cannot be pivotable relative to the base, and a second position where the second retaining portion of the movable member is disengaged from the first retaining portion of the base such that the handle can be pivotable relative to the base. An elastic member has two ends respectively connected to the handle and the movable member for providing a rebound force to the movable member.

Abstract: A removable hard disk device includes a handle, a first holder, a hard disk drive located between the handle and the first holder, and two second holders pivotally connected to the handle and detachably connected to the first holder and the hard disk drive respectively for firmly holding the hard disk drive between the handle and the first holder. When the second holders are forced to pivotally move outwardly relative to each other, the second holders will be separated from the first holder and the handle such that the hard disk drive can be dismounted from the first holder without using any tool.

Abstract: An apparatus includes a first bracket and a second bracket detachably receivable in the first bracket for holding a hard disk drive therein. The first bracket has a first coupling portion with a block, and a second coupling portion with a groove. The second bracket has a third coupling portion with a slot detachably receivable with the block of the first bracket, and a fourth coupling portion with a pivotable positioning rod member detachably engageable into the groove of the first bracket. Disengaging the slot and the pivotable positioning rod of the second bracket from the block and the groove of the first bracket allows dismounting of the second bracket from the first bracket without using any tools.

Abstract: A hard disk drive drawer includes a fixed casing mountable inside a computer housing, and a drawable carrier moveably and detachably receivable in the fixed casing. The fixed casing having two opposite lateral panels, each of which is provided with a track and a retaining portion located at the track adjacent to a free end of the track. The drawable carrier is elastically deformable for holding a hard disk drive therein. The drawable carrier has two sliding rails disposed at two opposite lateral sidewalls thereof and detachably, slidably and respectively coupled to the tracks, a handle at one side thereof, and two positioning portions engageable with the retaining portions of the fixed casing.

Abstract: A hard disk drive drawer includes a fixed casing mountable inside a computer housing, and a drawable carrier, which is elastically deformable for holding a hard disk drive therein and detachably and slidably received in the fixed casing. The fixed casing has a retaining portion. A handle is pivotally connected with the drawable carrier and provided with a locating member, which is engageable with the retaining portion of the fixed casing when the drawable carrier is received in the fixed casing and the handle is turned relative to the drawable carrier to a vertical locking position.

Abstract: An electric wire protector installed in a connector to protect the electric wires is disclosed. The electric wire protector has a body provided with an accommodation chamber for accommodating the connector, a top disposed at a top side of the body for protecting the electric wires, and clamping portions extended from a lower side of the body for clamping on the connector to secure the body to the connector.