Patents by Inventor Te-Sheng Liu

Te-Sheng Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11008451
    Abstract: A fluorocarbon resin composition is applicable to produce a prepreg for use in making a high-frequency circuit board, including a polytetrafluoroethylene resin; a fluorine-containing copolymer of poly fluoroalkoxy or fluorinated ethylene propylene; inorganic powders and an impregnation additive such as hydroxyethyl cellulose; resulted in that the prepreg is capable of increasing a plurality of times for proceeding impregnation-coating, the surface defects prone to occur on a fluorocarbon prepreg during drying, baking and sintering after impregnation are therefore improved at the same time.
    Type: Grant
    Filed: November 28, 2018
    Date of Patent: May 18, 2021
    Assignee: Nan Ya Plastics Corporation
    Inventors: Te-Chao Liao, Ying-Te Huang, Chih-Kai Chang, Hung-Yi Chang, Hao-Sheng Chen, Chia-Lin Liu
  • Publication number: 20190215593
    Abstract: A highly-closed headphone apparatus with wearing comfort mainly includes a headphone main body and a headband pivotally attached onto the headphone main body. The headphone main body includes a housing formed by a front housing member and a rear housing member as well as a speaker arranged inside the housing. The headband includes two ends connected to the housing and a covering pad enclosing an inner surface of the housing thereon. The covering pad is made of a tensile silicon rubber of 30˜50 degrees. The covering pad has a bottom edge portion has a greater thickness and extends upward therefrom to a surface with a decreasing thickness. Accordingly, with the covering pad with the decreasing thickness for positioning, a contact surface thereof is comfortable for wearing to achieve the highly-closed effect without the feeling of compression. Consequently, the headphone apparatus can sufficiently isolate external sounds and provide excellent listening quality.
    Type: Application
    Filed: January 11, 2018
    Publication date: July 11, 2019
    Inventor: Te-Sheng Liu
  • Patent number: 9612615
    Abstract: Integrated circuit chips and chip packages are disclosed that include an over-passivation scheme at a top of the integrated circuit chip and a bottom scheme at a bottom of the integrated circuit chip using a top post-passivation technology and a bottom structure technology. The integrated circuit chips can be connected to an external circuit or structure, such as ball-grid-array (BGA) substrate, printed circuit board, semiconductor chip, metal substrate, glass substrate or ceramic substrate, through the over-passivation scheme or the bottom scheme. Related fabrication techniques are described.
    Type: Grant
    Filed: May 1, 2013
    Date of Patent: April 4, 2017
    Assignee: QUALCOMM INCORPORATED
    Inventors: Mou-Shiung Lin, Jin-Yuan Lee, Hsin-Jung Lo, Ping-Jung Yang, Te-Sheng Liu
  • Patent number: 8837872
    Abstract: A device is described which includes a waveguide structure for signal transmission and power/ground delivery The waveguide structure includes a signal transmission part for transmitting an optical signal from an illuminant device to a detector. The signal transmission part may include transparent polymer, diamond or glass. The signal transmission part is used for a waveguide. The waveguide structure further includes a power/ground delivery part surrounding the signal transmission part. The power/ground delivery part is composed of at least one metal layer. Thus, the waveguide structure can provide an optical-signal transmission with high speed and high volume through the signal transmission part, while a stable power or ground reference can be provided to multiple units through the power/ground delivery part.
    Type: Grant
    Filed: December 27, 2011
    Date of Patent: September 16, 2014
    Assignee: Qualcomm Incorporated
    Inventors: Ping-Jung Yang, Hsin-Jung Lo, Te-Sheng Liu
  • Publication number: 20130242500
    Abstract: Integrated circuit chips and chip packages are disclosed that include an over-passivation scheme at a top of the integrated circuit chip and a bottom scheme at a bottom of the integrated circuit chip using a top post-passivation technology and a bottom structure technology. The integrated circuit chips can be connected to an external circuit or structure, such as ball-grid-array (BGA) substrate, printed circuit board, semiconductor chip, metal substrate, glass substrate or ceramic substrate, through the over-passivation scheme or the bottom scheme. Related fabrication techniques are described.
    Type: Application
    Filed: May 1, 2013
    Publication date: September 19, 2013
    Applicant: Megica Corporation
    Inventors: Mou-Shiung Lin, Jin-Yuan Lee, Hsin-Jung Lo, Ping-Jung Yang, Te-Sheng Liu
  • Patent number: 8456856
    Abstract: Integrated circuit chips and chip packages are disclosed that include an over-passivation scheme at a top of the integrated circuit chip and a bottom scheme at a bottom of the integrated circuit chip using a top post-passivation technology and a bottom structure technology. The integrated circuit chips can be connected to an external circuit or structure, such as ball-grid-array (BGA) substrate, printed circuit board, semiconductor chip, metal substrate, glass substrate or ceramic substrate, through the over-passivation scheme or the bottom scheme. Related fabrication techniques are described.
    Type: Grant
    Filed: March 11, 2010
    Date of Patent: June 4, 2013
    Assignee: Megica Corporation
    Inventors: Mou-Shiung Lin, Jin-Yuan Lee, Hsin-Jung Lo, Ping-Jung Yang, Te-Sheng Liu
  • Publication number: 20120193785
    Abstract: Multichip packages or multichip modules may include stacked chips and through silicon/substrate vias (TSVs) formed using enclosure-first technology. Enclosure-first technology may include forming an isolation enclosure associated with a TSV early in the fabrication process, without actually forming the associated TSV. The TSV associated with the isolation enclosure is formed later in the fabrication process. The enclosure-first technology allows the isolation enclosures to be used as alignment marks for stacking additional chips. The stacked chips can be connected to each other or to an external circuit such that data input is provided through the bottom-most (or topmost) chip, data is output from the bottom-most (or topmost) chip. The multichip package may provide a serial data connection, and a parallel connection, to each of the stacked chips.
    Type: Application
    Filed: January 25, 2012
    Publication date: August 2, 2012
    Applicant: Megica Corporation
    Inventors: Mou-Shiung Lin, Ping-Jung Yang, Hsin-Jung Lo, Te-Sheng Liu, Jin-Yuan Lee
  • Publication number: 20120170887
    Abstract: A device is described which includes a waveguide structure for signal transmission and power/ground delivery The waveguide structure includes a signal transmission part for transmitting an optical signal from an illuminant device to a detector. The signal transmission part may include transparent polymer, diamond or glass. The signal transmission part is used for a waveguide. The waveguide structure further includes a power/ground delivery part surrounding the signal transmission part. The power/ground delivery part is composed of at least one metal layer. Thus, the waveguide structure can provide an optical-signal transmission with high speed and high volume through the signal transmission part, while a stable power or ground reference can be provided to multiple units through the power/ground delivery part.
    Type: Application
    Filed: December 27, 2011
    Publication date: July 5, 2012
    Applicant: MEGICA CORPORATION
    Inventors: Ping-Jung Yang, Hsin-Jung Lo, Te-Sheng Liu
  • Patent number: 7983000
    Abstract: A removable hard disk device includes a handle, a first holder, a hard disk drive located between the handle and the first holder, and two second holders pivotally connected to ends of the first holder and detachably connected to ends of the handle with the two second holders firmly holding the hard disk drive there between and detachably connected to the disk drive. When the second holders are forced to pivotally move outwardly relative to each other, the second holders will be separated from the first holder and the handle such that the hard disk drive can be dismounted from the first holder without using any tool.
    Type: Grant
    Filed: June 3, 2008
    Date of Patent: July 19, 2011
    Assignee: Universal Scientific Industrial Co., Ltd.
    Inventors: Chih-Pin Chen, Te-Sheng Liu, Kuo-Kuang Liu, Shin-Hsun Yang
  • Publication number: 20100246152
    Abstract: Integrated circuit chips and chip packages are disclosed that include an over-passivation scheme at a top of the integrated circuit chip and a bottom scheme at a bottom of the integrated circuit chip using a top post-passivation technology and a bottom structure technology. The integrated circuit chips can be connected to an external circuit or structure, such as ball-grid-array (BGA) substrate, printed circuit board, semiconductor chip, metal substrate, glass substrate or ceramic substrate, through the over-passivation scheme or the bottom scheme. Related fabrication techniques are described.
    Type: Application
    Filed: March 11, 2010
    Publication date: September 30, 2010
    Applicant: Megica Corporation
    Inventors: Mou-Shiung Lin, Jin-Yuan Lee, Hsin-Jung Lo, Ping-Jung Yang, Te-Sheng Liu
  • Publication number: 20090296322
    Abstract: A case unit for a storage device includes a main case having an accommodation chamber, a subsidiary case detachably and drawably mounted in the accommodation chamber of the main case, and a circuit board mounted with the subsidiary case. As long as the subsidiary case is taken out of the accommodation chamber of the main case, the circuit board can be repaired, thereby enhancing convenience of assembly and repair works.
    Type: Application
    Filed: June 2, 2008
    Publication date: December 3, 2009
    Applicant: UNIVERSAL SCIENTIFIC INDUSTRIAL CO., LTD
    Inventors: Shin-Hsun Yang, Te-Sheng Liu, Chih-Pin Chen, Kuo-Kuang Liu, Chien-Ta Lin
  • Publication number: 20090165255
    Abstract: A handle assembly for use in cooperation with a hard disk case includes a base with a first retaining portion, a handle pivotally connected with the base, a movable member mounted to a connecting end of the handle. The movable member is movable between a first position where a second retaining portion of the movable member is engaged with the first retaining portion of the base such that the handle cannot be pivotable relative to the base, and a second position where the second retaining portion of the movable member is disengaged from the first retaining portion of the base such that the handle can be pivotable relative to the base. An elastic member has two ends respectively connected to the handle and the movable member for providing a rebound force to the movable member.
    Type: Application
    Filed: July 14, 2008
    Publication date: July 2, 2009
    Applicant: UNIVERSAL SCIENTIFIC INDUSTRIAL CO., LTD.
    Inventors: Te-Sheng LIU, Yu-Chen Chu
  • Publication number: 20090152415
    Abstract: An apparatus includes a first bracket and a second bracket detachably receivable in the first bracket for holding a hard disk drive therein. The first bracket has a first coupling portion with a block, and a second coupling portion with a groove. The second bracket has a third coupling portion with a slot detachably receivable with the block of the first bracket, and a fourth coupling portion with a pivotable positioning rod member detachably engageable into the groove of the first bracket. Disengaging the slot and the pivotable positioning rod of the second bracket from the block and the groove of the first bracket allows dismounting of the second bracket from the first bracket without using any tools.
    Type: Application
    Filed: May 13, 2008
    Publication date: June 18, 2009
    Applicant: UNIVERSAL SCIENTIFIC INDUSTRIAL CO., LTD.
    Inventors: Shin-Hsun YANG, Te-Sheng Liu, Chih-Pin Chen, Kuo-Kuang Liu
  • Publication number: 20090154006
    Abstract: A removable hard disk device includes a handle, a first holder, a hard disk drive located between the handle and the first holder, and two second holders pivotally connected to the handle and detachably connected to the first holder and the hard disk drive respectively for firmly holding the hard disk drive between the handle and the first holder. When the second holders are forced to pivotally move outwardly relative to each other, the second holders will be separated from the first holder and the handle such that the hard disk drive can be dismounted from the first holder without using any tool.
    Type: Application
    Filed: June 3, 2008
    Publication date: June 18, 2009
    Applicant: UNIVERSAL SCIENTIFIC INDUSTRIAL CO., LTD.
    Inventors: Chih-Pin Chen, Te-Sheng Liu, Kuo-Kuang Liu
  • Publication number: 20080157638
    Abstract: A hard disk drive drawer includes a fixed casing mountable inside a computer housing, and a drawable carrier moveably and detachably receivable in the fixed casing. The fixed casing having two opposite lateral panels, each of which is provided with a track and a retaining portion located at the track adjacent to a free end of the track. The drawable carrier is elastically deformable for holding a hard disk drive therein. The drawable carrier has two sliding rails disposed at two opposite lateral sidewalls thereof and detachably, slidably and respectively coupled to the tracks, a handle at one side thereof, and two positioning portions engageable with the retaining portions of the fixed casing.
    Type: Application
    Filed: December 7, 2007
    Publication date: July 3, 2008
    Applicant: Universal Scientific Industrial Co., LTD.
    Inventors: Kuo-Kuang LIU, Te-Sheng Liu
  • Publication number: 20080160824
    Abstract: An electric wire protector installed in a connector to protect the electric wires is disclosed. The electric wire protector has a body provided with an accommodation chamber for accommodating the connector, a top disposed at a top side of the body for protecting the electric wires, and clamping portions extended from a lower side of the body for clamping on the connector to secure the body to the connector.
    Type: Application
    Filed: May 21, 2007
    Publication date: July 3, 2008
    Applicant: Universal Scientific industrial Co., Ltd.
    Inventors: Te-Sheng LIU, Chien-Ming Hu, Ying-Chih Shen
  • Publication number: 20080158810
    Abstract: A hard disk drive drawer includes a fixed casing mountable inside a computer housing, and a drawable carrier, which is elastically deformable for holding a hard disk drive therein and detachably and slidably received in the fixed casing. The fixed casing has a retaining portion. A handle is pivotally connected with the drawable carrier and provided with a locating member, which is engageable with the retaining portion of the fixed casing when the drawable carrier is received in the fixed casing and the handle is turned relative to the drawable carrier to a vertical locking position.
    Type: Application
    Filed: November 5, 2007
    Publication date: July 3, 2008
    Applicant: Universal Scientific Industrial Co., Ltd.
    Inventors: Kuo-Kuang LIU, Te-Sheng Liu
  • Patent number: D507262
    Type: Grant
    Filed: January 22, 2004
    Date of Patent: July 12, 2005
    Inventor: Te-Sheng Liu