Abstract: An optical element including a first substrate, a second substrate, a first optical film, a second optical film, and a spacer is provided. The first optical film is disposed on the first substrate and has a first surface and a plurality of first optical microstructures. The first optical microstructures are disposed on the first surface. The second optical film is disposed on the second substrate and has a second surface and a plurality of second optical microstructures. The second surface is opposite to the first surface. The second optical microstructures are disposed on the second surface. The orthogonal projection of the first optical microstructures on the first substrate does not overlap with the orthogonal projection of the second optical microstructures on the first substrate. The spacer is disposed between the first substrate and the second substrate. A wafer level optical module adopting the optical element is also provided.

Abstract: An optical element including a substrate, a first optical film and a second optical film. The first optical film and the second optical film are disposed on at least one side of the substrate and are both formed on the substrate. The first optical film has a first surface facing away from the substrate and a plurality of first optical microstructures disposed on the first surface. The second optical film has a second surface facing away from the substrate and a plurality of second optical microstructures disposed on the second surface. The orthogonal projection of the first optical microstructures on the substrate does not overlap the orthogonal projection of the second optical microstructures on the substrate. A wafer level optical module adopting the optical element is also provided.

Abstract: The optical component includes a first substrate, a first diffractive layer formed on the first substrate, a second substrate, a second diffractive layer formed on the second substrate, and a bonding material disposed between the first substrate and the second substrate and connecting the first substrate and the second substrate. The second diffractive layer is disposed opposite to the first diffractive layer, and both the first diffractive layer and the second diffractive layer are located between the first substrate and the second substrate. A gap is formed between the first diffractive layer and the second diffractive layer.

Abstract: An optical element including a substrate, a first optical film and a second optical film. The first optical film and the second optical film are disposed on at least one side of the substrate and are both formed on the substrate. The first optical film has a first surface facing away from the substrate and a plurality of first optical microstructures disposed on the first surface. The second optical film has a second surface facing away from the substrate and a plurality of second optical microstructures disposed on the second surface. The orthogonal projection of the first optical microstructures on the substrate does not overlap the orthogonal projection of the second optical microstructures on the substrate. A wafer level optical module adopting the optical element is also provided.

Abstract: An optical element including a first substrate, a second substrate, a first optical film, a second optical film, and a spacer is provided. The first optical film is disposed on the first substrate and has a first surface and a plurality of first optical microstructures. The first optical microstructures are disposed on the first surface. The second optical film is disposed on the second substrate and has a second surface and a plurality of second optical microstructures. The second surface is opposite to the first surface. The second optical microstructures are disposed on the second surface. The orthogonal projection of the first optical microstructures on the first substrate does not overlap with the orthogonal projection of the second optical microstructures on the first substrate. The spacer is disposed between the first substrate and the second substrate. A wafer level optical module adopting the optical element is also provided.

Abstract: The optical component includes a first substrate, a first diffractive layer formed on the first substrate, a second substrate, a second diffractive layer formed on the second substrate, and a bonding material disposed between the first substrate and the second substrate and connecting the first substrate and the second substrate. The second diffractive layer is disposed opposite to the first diffractive layer, and both the first diffractive layer and the second diffractive layer are located between the first substrate and the second substrate. A gap is formed between the first diffractive layer and the second diffractive layer.

Abstract: A wafer-level homogeneous bonding optical structure includes two optical lens sets disposed on an optically transparent wafer and a spacer disposed on the optically transparent wafer and between the two optical lens sets. The spacer is homogeneously bonded to and integrated with the optically transparent wafer in the absence of a heterogeneous adhesive.

Abstract: The present invention provides a method for fabricating small right angle prism mirrors, projecting system, and small right angle prism mirrors fabricated by a semiconductor process. The method comprises: coating a reflecting layer on a top surface of a glass substrate; forming an optical glue layer on a bottom surface of the glass substrate; utilizing a mold to form a 3D shape on the optical glue layer; exposing the optical glue layer having the 3D shape to solidify the optical glue layer having the 3D shape and combine the glass substrate having the reflecting layer and the optical glue layer having the 3D shape; removing the mold to form a small prism array; and dicing the small prism array to generate a plurality of small right angle prism mirrors.

Abstract: A wafer-level optical structure includes at least two optical lens sets disposed on an optically transparent wafer, at least one trench disposed between two adjacent optical lens sets to divide the two adjacent optical lens sets, at least one spacer disposed between two adjacent optical lens sets to be correspondingly and partially disposed in the trench, and an adhesive disposed inside the trench.

Abstract: A wafer-level optical structure includes at least two optical lens sets disposed on an optically transparent wafer, at least one trench disposed between two adjacent optical lens sets to divide the two adjacent optical lens sets, at least one spacer disposed between two adjacent optical lens sets to be correspondingly and partially disposed in the trench, and an adhesive disposed inside the trench.

Abstract: A wafer-level homogeneous bonding optical structure includes two optical lens sets disposed on an optically transparent wafer and a spacer disposed on the optically transparent wafer and between the two optical lens sets. The spacer is homogeneously bonded to and integrated with the optically transparent wafer in the absence of a heterogeneous adhesive.

Abstract: The present invention provides a method for fabricating small right angle prism mirrors, projecting system, and small right angle prism mirrors fabricated by a semiconductor process. The method comprises: coating a reflecting layer on a top surface of a glass substrate; forming an optical glue layer on a bottom surface of the glass substrate; utilizing a mold to form a 3D shape on the optical glue layer; exposing the optical glue layer having the 3D shape to solidify the optical glue layer having the 3D shape and combine the glass substrate having the reflecting layer and the optical glue layer having the 3D shape; removing the mold to form a small prism array; and dicing the small prism array to generate a plurality of small right angle prism mirrors.

Abstract: The present invention provides a method for fabricating a high sag lens array a high sag lens array fabricated by a semiconductor process. The method comprises: individually jetting an optical glue material into a plurality of lens mold cavities of a mold to form a plurality of lens parts independently; exposing the lens parts to harden the optical glue material in the lens mold cavities; jetting an optical glue layer on the lens parts; forming a transparent substrate on the optical glue layer; exposing the optical glue layer to harden the optical glue layer and combine the transparent substrate, the optical glue layer, and the lens parts; and removing the mold to form the high sag lens array.