Patents by Inventor Teppei Kurokawa

Teppei Kurokawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210114347
    Abstract: This invention provides a roll-bonded laminate for an electronic device that exhibits high rigidity and a high elastic modulus and is suitable for housing applications. More specifically, this invention concerns a roll-bonded laminate for an electronic device composed of a stainless steel layer and an aluminum alloy layer, wherein thickness TAl (mm) and surface hardness HAl (HV) of the aluminum alloy layer and thickness TSUS (mm) and surface hardness HSUS (HV) of the stainless steel layer satisfy the correlation represented by Formula (1): HSUSTSUS2?(34.96+0.03×(HAlTAl2)2?3.57×HAlTAl2)/(?0.008×(HAlTAl2)2+0.061×HAlTAl2+1.354). This invention also concerns an electronic device housing.
    Type: Application
    Filed: March 29, 2018
    Publication date: April 22, 2021
    Applicant: TOYO KOHAN CO., LTD.
    Inventors: Kota SADAKI, Teppei KUROKAWA, Yusuke HASHIMOTO, Takafumi HATAKEDA, Takashi KOSHIRO
  • Publication number: 20210101364
    Abstract: This invention provides a relatively thick roll-bonded laminate that exhibits a high Erichsen value and excellent molding workability. Such roll-bonded laminate is composed of a stainless steel layer and a non-stainless steel metal layer, and it is characterized in that thickness T is 0.2 mm to 3 mm and a correlation between a proportion PSUS of thickness TSUS of the stainless steel layer relative to thickness T and a half width FWHM200 of a peak exhibiting a crystal plane orientation (200) determined by X-ray diffraction analysis of the stainless steel layer side satisfies the correlation represented by the formula: FWHM200?0.0057PSUS+0.4.
    Type: Application
    Filed: March 29, 2018
    Publication date: April 8, 2021
    Applicant: TOYO KOHAN CO., LTD
    Inventors: Yusuke HASHIMOTO, Kota SADAKI, Teppei KUROKAWA, Takashi KOSHIRO, Takafumi HATAKEDA
  • Publication number: 20210023648
    Abstract: It is an object of the present invention to provide a roll-bonded laminate controlled in warping and a method for producing the same. The method produces the roll-bonded laminate having a two-layer structure of a first metal layer and a second metal layer, by roll-bonding a first metal plate and a second metal plate, wherein the surface hardness Hv of the first metal plate is lower than the surface hardness Hv of the second metal plate; and the method comprises roll-bonding so as to satisfy the following expression (1): 0<(?L1/?L2)/T?38??(1) wherein ?L1 (mm) represents an elongation amount of the first metal layer with respect to the first metal plate; ?L2 (mm) represents an elongation amount of the second metal layer with respect to the second metal plate; and T (mm) represents the total thickness of the roll-bonded laminate.
    Type: Application
    Filed: April 1, 2019
    Publication date: January 28, 2021
    Applicant: TOYO KOHAN CO., LTD
    Inventors: Takafumi HATAKEDA, Yusuke HASHIMOTO, Teppei KUROKAWA
  • Patent number: 10864596
    Abstract: It is an objective of the present invention to provide a metal laminate material, which has sufficient strength as well as molding processability, lightweight properties, and radiation performance, which is a metal laminate material that has a two-layer structure of a stainless steel layer and an aluminum layer or a three-layer structure of a 1st stainless steel layer, an aluminum layer, and a 2nd stainless steel layer, wherein tensile strength TS is 200?TS?550 (MPa), elongation EL is not less than 15%, and a surface hardness Hv of the stainless steel layer is not more than 300 for the metal laminate material.
    Type: Grant
    Filed: September 30, 2016
    Date of Patent: December 15, 2020
    Assignee: Toyo Kohan Co., Ltd.
    Inventors: Kouji Nanbu, Teppei Kurokawa, Takashi Koshiro, Hironao Okayama
  • Patent number: 10748678
    Abstract: This invention provides a substrate for a superconducting wire used for manufacturing a superconducting wire with excellent superconductivity and a method for manufacturing the same. Such substrate for a superconducting wire exhibits the crystal orientation of metals on the outermost layer, such as a c-axis orientation rate of 99% or higher, a ?? of 6 degrees or less, and a percentage of an area in which the crystal orientation is deviated by 6 degrees or more from the (001) [100] per unit area of 6% or less.
    Type: Grant
    Filed: October 23, 2015
    Date of Patent: August 18, 2020
    Assignees: Toyo Kohan Co., Ltd., Sumitomo Electric Industries, Ltd.
    Inventors: Teppei Kurokawa, Yusuke Hashimoto, Hironao Okayama, Tatsuoki Nagaishi, Kotaro Ohki, Genki Honda
  • Publication number: 20200101558
    Abstract: [Problem] To provide: a roil-bonded body which is able to be suppressed in waviness in the surface; and a method for producing this roil-bonded body. [Solution] A roll-bonded body according to the present invention is obtained by bonding a first metal layer and a second metal layer with each other by means of rolling, and is characterized in that the surface of the first metal layer has an arithmetic average waviness (Wa1) 0.01-0.96 and a maximum waviness height (Wz1) of 0.2-5.0 ?m.
    Type: Application
    Filed: May 14, 2018
    Publication date: April 2, 2020
    Inventors: Yusuke HASHIMOTO, Teppei KUROKAWA, Takashi KOSHIRO, Kota SADAKI
  • Publication number: 20200031096
    Abstract: This invention provides a metal laminate that maintains functionality such as radiation performance and is excellent in dimensional accuracy after press work. Such metal laminate is a roll-bonded laminate composed of 2 or more metal layers, which exhibits a ratio ?/T of the standard deviation ? of thickness T1 of the outermost layer to thickness T of the roll-bonded laminate of 0% of 4.0%, the thickness T of 2 mm or less, and the deviation of the thickness T of 4.0% or less.
    Type: Application
    Filed: February 7, 2018
    Publication date: January 30, 2020
    Applicant: Toyo Kohan Co., Ltd.
    Inventors: Kota Sadaki, Teppei Kurokawa, Yusuke Hashimoto, Takafumi Hatakeda
  • Patent number: 10259073
    Abstract: An object of the present invention is to provide a production method for efficiently producing a metal laminate having high bonding strength. A method for producing a metal laminate material comprising the steps of: sputter etching faces to be bonded of a stainless steel and an aluminum such that an oxide layer remains on each face; temporarily bonding the faces to be bonded of the stainless steel and the aluminum by roll pressure bonding; and thermally treating the temporarily bonded laminate material at a temperature lower than the recrystallization temperature of the stainless steel to thermally diffuse at least a metal element comprised in the stainless steel into the aluminum.
    Type: Grant
    Filed: March 27, 2015
    Date of Patent: April 16, 2019
    Assignee: Toyo Kohan Co., Ltd.
    Inventors: Kouji Nanbu, Teppei Kurokawa, Takashi Koshiro, Hironao Okayama
  • Patent number: 10174420
    Abstract: This invention provides a method for forming an oxide layer on a metal substrate, which enables manufacture of an oxide layer with improved crystal orientation in comparison with that of the outermost layer of a metal substrate. The method for forming an oxide layer on a metal substrate 20 via RF magnetron sputtering comprises a step of subjecting the crystal-oriented metal substrate 20 exhibiting a c-axis orientation of 99% on its outermost layer to RF magnetron sputtering while adjusting the angle ? formed by a perpendicular at a film formation position 20a on the metal substrate 20 and a line from the film formation position 20a to a point 10a at which the perpendicular magnetic flux density is zero on the target 10 located at the position nearest to the film formation position 20a to 15 degrees or less.
    Type: Grant
    Filed: August 25, 2014
    Date of Patent: January 8, 2019
    Assignee: Toyo Kohan Co., Ltd.
    Inventors: Yusuke Hashimoto, Teppei Kurokawa, Takashi Koshiro, Hironao Okayama, Tatsuoki Nagaishi, Kotaro Ohki, Genki Honda
  • Patent number: 10115501
    Abstract: This invention provides a substrate for a superconducting wire used for manufacturing a superconducting wire with excellent superconductivity and a method for manufacturing the same. Such substrate for a superconducting wire has crystal orientation of metals on the outermost layer, such as a c-axis orientation rate of 99% or higher and a ?? of 6 degrees or less, and a percentage of an area in which the crystal orientation is deviated by 6 degrees or more from the (001) [100] per unit area is 6% or less.
    Type: Grant
    Filed: August 6, 2014
    Date of Patent: October 30, 2018
    Assignees: Toyo Kohan Co., Ltd., Sumitomo Electric Industries, Ltd.
    Inventors: Teppei Kurokawa, Takashi Koshiro, Hironao Okayama
  • Publication number: 20180297327
    Abstract: It is an object to provide a method for producing a substrate for epitaxial growth having a higher degree of biaxial crystal orientation without forming an irregular part a3. The method for producing a substrate for epitaxial growth comprising a step of laminating a metal base material and a copper layer having an fcc rolling texture by surface-activated bonding, a step of applying mechanical polishing to the copper layer, and a step of carrying out orientation heat treatment of the copper layer, wherein the copper layer is laminated in such a way that, when ratios of the (200) plane of the copper layer before laminated and of the copper layer after laminated when measured by XRD are I0Cu and I0CLAD, respectively and ratios of the (220) plane of the copper layer before laminated and of the copper layer after laminated are I2Cu and I2CLAD, respectively, I0Cu<20%, I2Cu=70 to 90%, and I0CLAD<20%, I2CLAD=70 to 90% and I0CLAD?I0Cu<13%.
    Type: Application
    Filed: October 21, 2016
    Publication date: October 18, 2018
    Applicants: Toyo Kohan Co., Ltd., Sumitomo Electric Industries, Ltd.
    Inventors: Teppei Kurokawa, Yusuke Hashimoto, Hironao Okayama
  • Publication number: 20180281103
    Abstract: It is an objective of the present invention to provide a metal laminate material, which has sufficient strength as well as molding processability, lightweight properties, and radiation performance, which is a metal laminate material that has a two-layer structure of a stainless steel layer and an aluminum layer or a three-layer structure of a 1st stainless steel layer, an aluminum layer, and a 2nd stainless steel layer, wherein tensile strength TS is 200?TS?550 (MPa), elongation EL is not less than 15%, and a surface hardness Hv of the stainless steel layer is not more than 300 for the metal laminate material.
    Type: Application
    Filed: September 30, 2016
    Publication date: October 4, 2018
    Applicant: Toyo Kohan Co., Ltd.
    Inventors: Kouji Nanbu, Teppei Kurokawa, Takashi Koshiro, Hironao Okayama
  • Patent number: 10087552
    Abstract: An objective of the present invention is to provide a copper substrate for epitaxial growth, which has higher biaxial crystal orientation, and a method for manufacturing the same. The substrate for epitaxial growth of the present invention contains a biaxially crystal-oriented copper layer, wherein the full width at half maximum ?? of a peak based on the pole figure of the copper layer is within 5° and the tail width ?? of the peak based on the pole figure is within 15° Such a substrate for epitaxial growth is manufactured by a 1st step of performing heat treatment of a copper layer so that ?? is within 6° and the tail width ?? is within 25°, and after the 1st step, a 2nd step of performing heat treatment of the copper layer at a temperature higher than the temperature for heat treatment in the 1st step, so that ?? is within 5° and the tail width ?? is within 15°.
    Type: Grant
    Filed: August 23, 2013
    Date of Patent: October 2, 2018
    Assignees: Toyo Kohan Co., Ltd., Sumitomo Electric Industries, Ltd.
    Inventors: Takashi Koshiro, Hironao Okayama, Teppei Kurokawa, Kouji Nanbu
  • Publication number: 20170338008
    Abstract: This invention provides a substrate for a superconducting wire used for manufacturing a superconducting wire with excellent superconductivity and a method for manufacturing the same. Such substrate for a superconducting wire exhibits the crystal orientation of metals on the outermost layer, such as a c-axis orientation rate of 99% or higher, a ?? of 6 degrees or less, and a percentage of an area in which the crystal orientation is deviated by 6 degrees or more from the (001) [100] per unit area of 6% or less.
    Type: Application
    Filed: October 23, 2015
    Publication date: November 23, 2017
    Applicants: Toyo Kohan Co., Ltd., Sumitomo Electric Industries, Ltd.
    Inventors: Teppei Kurokawa, Yusuki Hashimoto, Hironao Okayama, Tatsuoki Nagaishi, Kotaro Ohki, Genki Honda
  • Publication number: 20170014942
    Abstract: An object of the present invention is to provide a method for producing a metal laminate material that maintains sufficient bonding strength and has superior production efficiency. A method for producing a metal laminate material by bonding two sheets, one sheet composed of a material M1 and the other sheet composed of a material M2, wherein each of M1 and M2 is a metal or alloy comprising any one or more selected from the group consisting of Mg, Al, Ti, Cr, Mn, Fe, Co, Ni, Cu, Zn, Nb, Mo, Pd, Ag, In, Sn, Hf, Ta, W, Pb, and Bi, comprises the steps of subjecting the faces of the two sheets to be bonded to sputtering treatment with inert gas ions under vacuum such that oxide layers on surface layers remain; temporarily bonding the two sheets by roll pressure bonding; and conducting a thermal treatment to thereby bond the two sheets, and, when Tm1>Tm2 where Tm1 (K) is the melting point of M1 and Tm2(K) is the melting point of M2, the temperature of the thermal treatment is 0.45Tm2 or more and less than 0.
    Type: Application
    Filed: March 27, 2015
    Publication date: January 19, 2017
    Applicant: Toyo Kohan Co., Ltd.
    Inventors: Kouji NANBU, Teppei KUROKAWA, Takashi KOSHIRO, Hironao OKAYAMA
  • Publication number: 20170014941
    Abstract: An object of the present invention is to provide a production method for efficiently producing a metal laminate having high bonding strength. A method for producing a metal laminate material comprising the steps of: sputter etching faces to be bonded of a stainless steel and an aluminum such that an oxide layer remains on each face; temporarily bonding the faces to be bonded of the stainless steel and the aluminum by roll pressure bonding; and thermally treating the temporarily bonded laminate material at a temperature lower than the recrystallization temperature of the stainless steel to thermally diffuse at least a metal element comprised in the stainless steel into the aluminum.
    Type: Application
    Filed: March 27, 2015
    Publication date: January 19, 2017
    Applicant: Toyo Kohan Co., Ltd.
    Inventors: Kouji Nanbu, Teppei Kurokawa, Takashi Koshiro, Hironao Okayama
  • Publication number: 20160217890
    Abstract: This invention provides a substrate for a superconducting wire used for manufacturing a superconducting wire with excellent superconductivity and a method for manufacturing the same. Such substrate for a superconducting wire has crystal orientation of metals on the outermost layer, such as a c-axis orientation rate of 99% or higher and a ?? of 6 degrees or less, and a percentage of an area in which the crystal orientation is deviated by 6 degrees or more from the (001) [100] per unit area is 6% or less.
    Type: Application
    Filed: August 6, 2014
    Publication date: July 28, 2016
    Applicants: TOYO KOHAN CO., LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Teppei Kurokawa, Takashi Koshiro, Hironao Okayama
  • Publication number: 20160194750
    Abstract: This invention provides a method for forming an oxide layer on a metal substrate, which enables manufacture of an oxide layer with improved crystal orientation in comparison with that of the outermost layer of a metal substrate. The method for forming an oxide layer on a metal substrate 20 via RF magnetron sputtering comprises a step of subjecting the crystal-oriented metal substrate 20 exhibiting a c-axis orientation of 99% on its outermost layer to RF magnetron sputtering while adjusting the angle ? formed by a perpendicular at a film formation position 20a on the metal substrate 20 and a line from the film formation position 20a to a point 10a at which the perpendicular magnetic flux density is zero on the target 10 located at the position nearest to the film formation position 20a to 15 degrees or less.
    Type: Application
    Filed: August 25, 2014
    Publication date: July 7, 2016
    Applicant: Toyo Kohan Co., Ltd.
    Inventors: Yusuke Hashimoto, Teppei Kurokawa, Takashi Koshiro, Hironao Okayama, Tatsuoki Nagaishi, Kotaro Ohki, Genki Honda
  • Publication number: 20150299899
    Abstract: An objective of the present invention is to provide a copper substrate for epitaxial growth, which has higher biaxial crystal orientation, and a method for manufacturing the same. The substrate for epitaxial growth of the present invention contains a biaxially crystal-oriented copper layer, wherein the full width at half maximum ?? of a peak based on the pole figure of the copper layer is within 5° and the tail width ?? of the peak based on the pole figure is within 15° Such a substrate for epitaxial growth is manufactured by a 1st step of performing heat treatment of a copper layer so that ?? is within 6° and the tail width ?? is within 25°, and after the 1st step, a 2nd step of performing heat treatment of the copper layer at a temperature higher than the temperature for heat treatment in the 1st step, so that ?? is within 5° and the tail width ?? is within 15°.
    Type: Application
    Filed: August 23, 2013
    Publication date: October 22, 2015
    Applicants: Toyo Kohan Co., Ltd., Sumitomo Electric Industries, Ltd.
    Inventors: Takashi Koshiro, Hironao Okayama, Teppei Kurokawa, Kouji Nanbu
  • Patent number: 8815777
    Abstract: A metal laminated substrate for an oxide superconducting wire is produced by removing, in a state where a copper foil to which rolling is applied at a draft of 90% or more is held at a temperature below a recrystallization temperature, an absorbed material on a surface of the copper foil by applying sputter etching to the surface of the copper foil; removing an absorbed material on a surface of a nonmagnetic metal sheet by applying sputter etching to the surface of the nonmagnetic metal sheet; bonding the copper foil and the metal sheet to each other by reduction rolls at an applied pressure of 300 MPa to 1500 MPa; orienting crystals of the copper by heating a laminated body obtained by bonding at a crystal orientation temperature of copper or above; and forming a protective layer on a copper-side surface of the laminated body by coating.
    Type: Grant
    Filed: July 8, 2010
    Date of Patent: August 26, 2014
    Assignees: Toyo Kohan Co., Ltd., Sumitomo Electric Industries, Ltd.
    Inventors: Hironao Okayama, Teppei Kurokawa, Kouji Nanbu, Yoshihiko Isobe, Takashi Koshiro, Akira Kaneko, Hajime Ota, Kotaro Ohki, Takashi Yamaguchi, Kazuya Ohmastu