Abstract: A new test method to quantify capillary flow solderability on a printed wiring board surface finish. The test is based on solder flow from a pad onto narrow strips or lines. A test procedure and video image analysis technique were developed for conducting the test and evaluating the data. Feasibility tests revealed that the wetted distance was sensitive to the ratio of pad radius to line width (l/r), solder volume, and flux predry time.

Abstract: The present invention is a method and an apparatus for the precise quantitative measurement of the magnitude of force exerted at the points of contact on a high density electrical interconnect that quantitatively determines the magnitude of the force. The invention includes the steps of establishing a pressing relationship between a photoelastic material and the high density interconnect, coupling plane-polarized light into the photoelastic material stressed as a result of the pressing relationship with the high density interconnect, coupling of the polarized light being at 45 degrees with the direction of pressing, capturing an image of the fringe pattern of the plane polarized light exiting the stressed photoelastic material, the fringe pattern comprising of fringes wherein the number of fringes varies with the magnitude of the pressing force, and counting the number of fringes produced to determine the magnitude of force exerted on the photoelastic member.

Abstract: A powder coating composition is disclosed. The composition comprises at least one 1, 2 epoxy compound combined with a functionally terminated elastomer and a curing agent mixture. The curing agent mixture comprises an imidazoline derivative combined with an adduct of (a) a polyhydroxyl compound and (b) a diglycidyl ether of the polyhydroxyl compound, where reactant (b) is present in a less than equimolar amount to reactant (a).