Abstract: A semiconductor device includes: a first terminal inputting a first voltage from outside; a drive unit using the first voltage as a power supply voltage and outputting a drive signal; a switching device driven by the drive signal; a second terminal separated from the first terminal and inputting a second voltage from outside; a comparator using a voltage generated from the second voltage as a power supply voltage and outputting an output signal when a voltage generated from the first voltage is less than or equal to a reference potential; and a shut-off switch shutting off a transmission of the drive signal to the switching device from the drive unit in response to the output signal.

Abstract: A semiconductor device includes: a package to seal a semiconductor element; a lead frame having one end portion connected to the semiconductor element and the other end portion protruding from a side surface of the package; a plurality of threaded holes formed in the package to enable the package to be fixed to the substrate; and a resin part capable of closing each of the plurality of threaded holes. A type name of the semiconductor device is represented by open and closed states of the respective threaded holes.

Abstract: Examples of a power module include a resin housing including a main body and at least one projection protruding from the main body, and a lead terminal extending outwardly from the main body, wherein a through-hole is provided so as to penetrate the main body and the projection protruding from the main body.

Abstract: Examples of a power module include a resin housing including a main body and at least one projection protruding from the main body, and a lead terminal extending outwardly from the main body, wherein a through-hole is provided so as to penetrate the main body and the projection protruding from the main body.

Abstract: A display panel for displaying an image, a drive circuit for driving the display panel and a rear plate for supporting the display panel are provided. The drive circuit includes a circuit board fixed on the rear plate, semiconductor devices surface-mounted on the circuit board to be connected to a plurality of electrodes formed on the display panel and radiator plates attached to the other surfaces of the semiconductor devices opposite to the surfaces mounted on the circuit board so as to be almost in parallel with the rear plate.

Abstract: A display panel for displaying an image, a drive circuit for driving the display panel and a rear plate for supporting the display panel are provided. The drive circuit includes a circuit board fixed on the rear plate, semiconductor devices surface-mounted on the circuit board to be connected to a plurality of electrodes formed on the display panel and radiator plates attached to the other surfaces of the semiconductor devices opposite to the surfaces mounted on the circuit board so as to be almost in parallel with the rear plate.

Abstract: In a movable space, a boundary (CN1) between a ceiling surface and a wall surface of a cap (CA) has a curved plane. When stress is exerted on the cap (CA), this stress is dispersed accordingly around the boundary (CN1) having a high probability of generation of a crack. Therefore, generation of a crack in the cap (CN) is unlikely.

Abstract: In a movable space, a boundary (CN1) between a ceiling surface and a wall surface of a cap (CA) has a curved plane. When stress is exerted on the cap (CA), this stress is dispersed accordingly around the boundary (CN1) having a high probability of generation of a crack. Therefore, generation of a crack in the cap (CN) is unlikely.

Abstract: A sensor chip connected to a signal processing IC is provided on a die pad, a stationary electrode and a movable electrode are arranged on a semiconductor substrate of the sensor chip, the stationary electrode and movable electrode are covered with a protective cap, a shield electrode layer is embedded in a top face part of a semiconductor substrate, and these elements are sealed with a sealing resin, thus, a potential of the movable electrode is obtained from an output potential of a capacity/voltage conversion circuit of a signal processing IC, and at least one of the shield electrode layer and protective cap is electrically connected to the movable electrode to thereby make identical to each other in potential.

Abstract: A sensor chip connected to a signal processing IC is provided on a die pad, a stationary electrode and a movable electrode are arranged on a semiconductor substrate of the sensor chip, the stationary electrode and movable electrode are covered with a protective cap, a shield electrode layer is embedded in a top face part of a semiconductor substrate, and these elements are sealed with a sealing resin, thus, a potential of the movable electrode is obtained from an output potential of a capacity/voltage conversion circuit of a signal processing IC, and at least one of the shield electrode layer and protective cap is electrically connected to the movable electrode to thereby make identical to each other in potential.

Abstract: An acceleration sensor which can improve precision during self-diagnosis operation. The acceleration sensor includes an amplifier circuit which amplifies a detection signal obtained by converting changes in capacitance between a movable electrode and a self-diagnosis electrode into an electric signal to output the amplified signal as a self-diagnosis signal. The amplifier factor of the amplifier circuit during self-diagnosis operation is controlled to be greater than the factor during non-self-diagnosis operation.

Abstract: The invention provides an acceleration sensor which can improve precision during self-diagnosis operation. The acceleration sensor comprises an amplifier circuit which amplifies a detection signal obtained by converting changes in capacitance between a movable electrode and a self-diagnosis electrode into an electric signal to output the amplified signal as a self-diagnosis signal. The amplifier factor of the amplifier circuit during self-diagnosis operation is controlled to be greater than the factor during non-self-diagnosis operation.

Abstract: The size reduction of an acceleration sensor having an acceleration detecting chip (ACa) and a signal processing chip (SCa), can be attained with an improvement in arrangement of both chips. Specifically, the acceleration detecting chip (ACa) is disposed in a through-hole (HL1) formed in the signal processing chip (SCa). A cap (CPa) is provided in order to prevent resin flowing into an acceleration detecting part (AS), when forming a resin encapsulation package.

Abstract: A semiconductor acceleration sensor in which the acceleration sensor chip is protected from the resin molding of the package to assure good detection precision. A semiconductor acceleration sensor in which functional elements including an acceleration sensor chip and signal-processing chip are sealed in a resin package, has a damping member disposed along an outside surface of the acceleration sensor chip to alleviate stress from the resin package on the acceleration sensor chip, and a plate-like covering member which cover a top edge part of the damping member and a top edge of the acceleration sensor chip. Resin is thus prevented from penetrating the gap between the sensor chip and damping member during the packaging process. The sensor chip is thus protected from stresses from the resin molding, and the semiconductor acceleration sensor can assure good detection precision.

Abstract: A semiconductor acceleration sensor comprises a semiconductor sensor chip for detecting acceleration and an IC chip for processing the signal from this sensor chip, the IC chip is bonded to the sensor chip, the sensor chip is mounted to a die pad, electrical connection is established by lead wires connected to lead terminals, and a package is formed by molding with resin wherein the die pad is electrically connected to a particular lead terminal by a lead wire and is grounded by the particular lead terminal, and the die pad is positioned remote from the mounting surface of the package.

Abstract: A physical parameter sensor that can detect changes in data that is stored beforehand in the data storage section for adjustments when the changes in the data are not corrected by a majority-decision circuit section. The physical parameter sensor can prevent the use of an output signal obtained by adjustments based on incorrect data. The physical parameter sensor has a self-diagnosis circuit section that detects whether a plurality of data words stored in a data storage section is identical or not and outputs an error signal, if the identical data words have been altered to become nonidentical.

Abstract: A semiconductor acceleration sensor for detecting accelerations applied in two orthogonal directions includes a semiconductor body having a peripheral frame, a central weight disposed within the peripheral frame, and first and second beams extending from and connecting the peripheral frame and the weight. At least four piezoresistors are disposed on each of the first and second beams and are electrically connected in first and second bridge circuits. Each bridge circuit includes two piezoresistors from each of the two beams so that accelerations applied perpendicular and parallel to the semiconductor body can be individually detected with a single semiconductor acceleration sensor.

Abstract: A semiconductor acceleration detecting apparatus having a cylinder fixed to a automobile, a piston having a predetermined mass, the piston being inserted in the cylinder and being slidable in an axial direction of the cylinder, a semiconductor pressure sensor disposed so as to face towards a closed space formed by an inner wall of the cylinder and an end wall of the piston, wherein the semiconductor pressure sensor converts pressure in the closed space to an electric potential difference, and an acceleration detecting apparatus including an amplifier and a comparator for detecting acceleration of the automobile in accordance with the electric potential difference outputted from the semiconductor pressure sensor.

Abstract: A semiconductor acceleration sensor capable of sensing acceleration in two orthogonal directions has an acceleration sensor beam which is provided with a diaphragm 9 formed in the reverse side thereof. The diaphragm is narrowed by, for example, etching also in Z-axis direction which is the widthwise direction of the acceleration sensor beam, so that the acceleration sensor beam is easily deflectable also in the Z-axis direction. A first group of gauge resistors forming a bridge circuit are arranged on a first side of the diaphragm 9 at portions adjacent to the pedestal which cantilevers the acceleration sensor beam. A second group of resistors forming another bridge circuit are arranged on the first side of the diaphragm 9 at portions adjacent to the corners of the diaphragm. Alternatively, the second group of gauge resistors may be arranged on a narrowed portion of the acceleration sensor beam, formed at a location other than that of the diaphragm.