Abstract: Provided is a surface-treated carbon nanotube having few surface fractures, not reducing the molecular weight of the resin to be mixed and having excellent extrudability. In the surface-treated carbon nanotube, the thermal reduction amount at 600° C. in a nitrogen atmosphere is 0.2 to 40%, the surface oxygen concentration measured by X-ray photoelectron spectroscopy (XPS) is 1.5 to 40 atm % and the surface sulfur concentration is less than 0.1 atm %.

Abstract: A polyamide resin composition including a polyamide resin (A), a copper compound (B), a bromide of an alkali metal and/or a bromide of an alkaline earth metal (C), and at least one fatty acid compound (D) selected from the group consisting of fatty acid esters, fatty acid amides, and fatty acid metal salts, wherein the fatty acid compound (D) has an acid value of 5 mgKOH/g or less.

Abstract: A polyamide resin composition comprising a polyamide resin (A), a copper compound (B), a bromide of an alkali metal and/or a bromide of an alkaline earth metal (C), and at least one phosphorus compound (D) selected from the group consisting of tris(2,4-di-t-butylphenyl)phosphite, bis(2,4-di-t-butylphenyl)pentaerythritol diphosphite, bis(2,6-di-t-butyl-4-methylphenyl)pentaerythritol diphosphite, bis(2,4-dicumylphenyl)pentaerythritol diphosphite, 2,2?,2?-nitrilo(triethyl-tris(3,3?,5,5?-tetra-t-butyl-1,1?-biphenyl-2,2?-diyl))phosphite, tetrakis(2,4-di-t-butylphenyl)-4,4?-biphenylene diphosphonite, tetrakis(2,4-di-t-butylphenyl)-4,3?-biphenylene diphosphonite, and tetrakis(2,4-di-t-butylphenyl)-3,3?-biphenylene diphosphonate, in an amount of 0.01 to 10% by mass with respect to 100% by mass of the polyamide resin composition, at least one fatty acid compound (E), and an inorganic filler (F).

Abstract: The polyamide resin composition of the present invention contains (A) a polyamide resin, (B) a glass fiber including a compound having a carboxylic anhydride-containing unsaturated vinyl monomer, the compound being on at least a part of a surface of the glass fiber, and (C) a copolymer including a carboxylic anhydride-containing unsaturated vinyl monomer and having a glass transition temperature Tg of higher than 0° C.

Abstract: A polyamide resin composition including a polyamide resin (A), a copper compound (B), a bromide of an alkali metal and/or a bromide of an alkaline earth metal (C), and a secondary amine compound (D).

Abstract: [Object] It is intended to obtain a polyamide resin composition that is excellent in heat aging resistance and exhibits suppressed metal corrosive properties and copper-depositing properties. [Means of solving the problems] A polyamide resin composition comprising a polyamide resin (A), a copper compound (B), a bromide of an alkali metal and/or a bromide of an alkaline earth metal (C), and at least one phosphorus compound (D) selected from the group consisting of phosphite compounds represented by the following general formula (1), and phosphonite compounds represented by the following general formula (2): phosphite compound: (RO)mP(OH)3-m??(1) and phosphonite compound: (RO)nO(OH)2-n(R)??(2) wherein m represents 1, 2, or 3; n represents 1 or 2; R represents an alkyl group, a phenyl group, or a partially substituted alkyl group or phenyl group; and if each of m and n is 2 or more, a plurality of (RO) groups in the general formulas (1) and (2) are the same or different from each other.

Abstract: [Object] It is intended to obtain a polyamide resin composition that is excellent in heat aging resistance and exhibits suppressed metal corrosive properties and copper-depositing properties. [Means of Solving the Problems] A polyamide resin composition including a polyamide resin (A), a copper compound (B), a bromide of an alkali metal and/or a bromide of an alkaline earth metal (C), and a secondary amine compound (D).

Abstract: The polyamide resin composition of the present invention contains (A) a polyamide resin, (B) a glass fiber including a compound having a carboxylic anhydride-containing unsaturated vinyl monomer, the compound being on at least a part of a surface of the glass fiber, and (C) a copolymer including a carboxylic anhydride-containing unsaturated vinyl monomer and having a glass transition temperature Tg of higher than 0° C.

Abstract: A polyamide resin composition including a polyamide resin (A), a copper compound (B), a bromide of an alkali metal and/or a bromide of an alkaline earth metal (C), and an amphoteric compound and/or a basic compound (D).

Abstract: A polyamide resin composition including a polyamide resin (A), a copper compound (B), a bromide of an alkali metal and/or a bromide of an alkaline earth metal (C), and at least one fatty acid compound (D) selected from the group consisting of fatty acid esters, fatty acid amides, and fatty acid metal salts, wherein the fatty acid compound (D) has an acid value of 5 mg/g or less.

Abstract: The present invention relates to a polyamide obtainable by polymerizing an (a) dicarboxylic acid comprising at least 50 mol % of an alicyclic dicarboxylic acid and a (b) diamine comprising at least 50 mol % of a diamine having a substituent branched from a main chain.

Abstract: Provided is a surface-treated carbon nanotube having few surface fractures, not reducing the molecular weight of the resin to be mixed and having excellent extrudability. In the surface-treated carbon nanotube, the thermal reduction amount at 600° C. in a nitrogen atmosphere is 0.2 to 40%, the surface oxygen concentration measured by X-ray photoelectron spectroscopy (XPS) is 1.5 to 40 atm % and the surface sulfur concentration is less than 0.1 atm %.

Abstract: The present invention relates to a polyamide obtainable by polymerizing an (a) dicarboxylic acid comprising at least 50 mol % of an alicyclic dicarboxylic acid and a (b) diamine comprising at least 50 mol % of a diamine having a substituent branched from a main chain.

Abstract: The present invention relates to a polyamide obtainable by polymerizing an (a) dicarboxylic acid comprising at least 50 mol % of an alicyclic dicarboxylic acid and a (b) diamine comprising at least 50 mol % of a diamine having a substituent branched from a main chain.

Abstract: To provide a polyamide copolymer that is excellent in terms of rigidity after water absorption (water absorption rigidity) and rigidity under high temperature use (thermal rigidity). A polyamide copolymer comprising a dicarboxylic acid component unit containing an (a) adipic acid unit, a (b) isophthalic acid unit and a (c) 1,4-cyclohexanedicarboxylic acid unit, and a diamine component unit, wherein a relationship between a content (mol %) of the (b) and a content (mol %) of the (c) in a total of 100 mol % of the dicarboxylic acid component unit containing the (a), the (b) and the (c) satisfies following formula (1): (c)>(b)?0.1??(1).

Abstract: The present invention relates to a polyamide obtainable by polymerizing an (a) dicarboxylic acid comprising at least 50 mol % of an alicyclic dicarboxylic acid and a (b) diamine comprising at least 50 mol % of a diamine having a substituent branched from a main chain.

Abstract: A resin composition comprising a polyphenylene ether produced by polymerizing a monomer component consisting of 100 parts by weight of 2,6-dimethylphenol and 0.5 to 7.5 parts by weight of o-cresol in the presence of both a catalyst and an oxygen-containing gas and a flame retardant. When the polyphenylene ether has a molecular weight distribution of 2.8 to 8.0, the resulting resin composition is more excellent in flame retardance, particularly anti-dripping properties in burning. The resin composition is applicable to not only electric and electronic applications necessitating high flame retardance but also other fields of application of polyphenylene ether resins.

Abstract: A resin composition comprising a polyphenylene ether and a flame retardant, wherein said polyphenylene ether is obtained by polymerizing a monomer comprising 100 parts by weight of 2,6-dimethylphenol and 0.5 to 7.5 parts by weight of ortho cresol in the presence of a catalyst and an oxygen-containing gas, especially that having a molecular weight distribution of 2.8 to 8.0.. The resin composition is excellent in flame retardancy, particularly in anti-dripping properties in burning. The resin composition thereof is applicable not only in the electric and electronic fields which require high flame retardancy, but also to other various fields needing polyphenylene ether resins.