Patents by Inventor Terukazu Ohtsuki

Terukazu Ohtsuki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7320604
    Abstract: Provided is an electronic circuit module using a board having no cavity and a method for efficiently fabricating it. Electronic components are mounted on the front face of a module board 1, and an LSI chip 5 is die-bonded on the bottom face thereof in a bare-chip state with gold wires 8. Around the LSI chip 5, metal blocks 9 made of copper are mounted by soldering. The LSI chip 5, the gold wires 8, and the metal blocks 9 provided on the bottom face of the module board 1 are sealed with resin 10 with a motherboard-facing face 9a of each metal block 9 and a face 18 thereof flush with the corresponding side face of the module board 1 exposed from the resin 10. These exposed portions serve as electrode terminals when the module 11 is soldered to a motherboard. The module board 1 is obtained by cutting a sheet circuit board into individual unit module boards 1.
    Type: Grant
    Filed: November 14, 2006
    Date of Patent: January 22, 2008
    Assignee: Sharp Kabushiki Kaisha
    Inventor: Terukazu Ohtsuki
  • Publication number: 20070178729
    Abstract: Provided is an electronic circuit module using a board having no cavity and a method for efficiently fabricating it. Electronic components are mounted on the front face of a module board 1, and an LSI chip 5 is die-bonded on the bottom face thereof in a bare-chip state with gold wires 8. Around the LSI chip 5, metal blocks 9 made of copper are mounted by soldering. The LSI chip 5, the gold wires 8, and the metal blocks 9 provided on the bottom face of the module board 1 are sealed with resin 10 with a motherboard-facing face 9a of each metal block 9 and a face 18 thereof flush with the corresponding side face of the module board 1 exposed from the resin 10. These exposed portions serve as electrode terminals when the module 11 is soldered to a motherboard. The module board 1 is obtained by cutting a sheet circuit board into individual unit module boards 1.
    Type: Application
    Filed: November 14, 2006
    Publication date: August 2, 2007
    Applicant: SHARP KABUSHIKI KAISHA
    Inventor: Terukazu Ohtsuki
  • Patent number: 6415531
    Abstract: A plane-shaped lighting device has a light-directing plate and a light source that is placed in contact with or in the proximity of the light-incident surface of the light-directing plate, and the light source is constituted of a plurality of LED lamps each of which has an LED chip for emitting light and a semispherical lens for directing the light from the LED chip into the light-directing plate. Here, the distance from the LED chip to the top of the semispherical lens is set to be 1.8 times as long as the radius of curvature of the semispherical lens. This arrangement allows the light emitted from the LED chip to be efficiently incident on the light-incident surface of the light-directing plate, thereby improving the light-incidence efficiency to the light-directing plate. Further, the application of this plane-shaped lighting device to display devices makes it possible to improve the efficiency of light utilization, and consequently to provide thinner display devices with high visibility.
    Type: Grant
    Filed: February 22, 2000
    Date of Patent: July 9, 2002
    Assignee: Sharp Kabushiki Kaisha
    Inventors: Terukazu Ohtsuki, Masahiko Kimoto, Hiroshi Minematsu, Nobuyuki Tominaga, Takahiro Funakoshi, Yasuhiro Wada, Hitoshi Azuma
  • Patent number: 6036328
    Abstract: A plane-shaped lighting device has a light-directing plate and a light source that is placed in contact with or in the proximity of the light-incident surface of the light-directing plate, and the light source is constituted of a plurality of LED lamps each of which has an LED chip for emitting light and a semispherical lens for directing the light from the LED chip into the light-directing plate. Here, the distance from the LED chip to the top of the semispherical lens is set to be 1.8 times as long as the radius of curvature of the semispherical lens. This arrangement allows the light emitted from the LED chip to be efficiently incident on the light-incident surface of the light-directing plate, thereby improving the light-incidence efficiency to the light-directing plate. Further, the application of this plane-shaped lighting device to display devices makes it possible to improve the efficiency of light utilization, and consequently to provide thinner display devices with high visibility.
    Type: Grant
    Filed: May 1, 1998
    Date of Patent: March 14, 2000
    Assignee: Sharp Kabushiki Kaisha
    Inventors: Terukazu Ohtsuki, Masahiko Kimoto, Hiroshi Minematsu, Nobuyuki Tominaga, Takahiro Funakoshi, Yasuhiro Wada, Hitoshi Azuma
  • Patent number: 5786665
    Abstract: A plane-shaped lighting device has a light-directing plate and a light source that is placed in contact with or in the proximity of the light-incident surface of the light-directing plate, and the light source is constituted of a plurality of LED lamps each of which has an LED chip for emitting light and a semispherical lens for directing the light from the LED chip into the light-directing plate. Here, the distance from the LED chip to the top of the semispherical lens is set to be 1.8 times as long as the radius of curvature of the semispherical lens. This arrangement allows the light emitted from the LED chip to be efficiently incident on the light-incident surface of the light-directing plate, thereby improving the light-incidence efficiency to the light-directing plate. Further, the application of this plane-shaped lighting device to display devices makes it possible to improve the efficiency of light utilization, and consequently to provide thinner display devices with high visibility.
    Type: Grant
    Filed: May 23, 1996
    Date of Patent: July 28, 1998
    Assignee: Sharp Kabushiki Kaisha
    Inventors: Terukazu Ohtsuki, Masahiko Kimoto, Hiroshi Minematsu, Nobuyuki Tominaga, Takahiro Funakoshi, Yasuhiro Wada, Hitoshi Azuma
  • Patent number: 5696607
    Abstract: An image reader is equipped with a light source having a plurality of LEDs arrayed in a row, a light-guiding transparent board, a concave mirror, a condenser lens and a photoelectric converter. The transparent board is disposed between the light source and the concave mirror, and has an illuminating light output surface to be in contact with a document, an illuminating light input surface which is tilted at an angle relative to the output surface and on which light from the light source is to be incident, and first and second side surfaces located in opposition to each other between the illuminating light input and output surfaces. In operation, since the output surface is tightly in contact with the document, light dissipation is prevented. Since the input surface and the output surface are sufficiently separated from each other, rays of light emitted by the individual LEDs are mixed up inside the transparent board.
    Type: Grant
    Filed: October 4, 1995
    Date of Patent: December 9, 1997
    Assignee: Sharp Kabushiki Kaisha
    Inventors: Shinji Yamana, Terukazu Ohtsuki, Hitoshi Ikeda, Takehiro Yamamoto
  • Patent number: 5418384
    Abstract: A light-source device includes a light source and a light-pervious flat board, the light source being optically connected to one side of the flat board for introduction of light into the flat board so that the incoming light is caused to be reflected from other side of the flat board therewithin for being directed outward from the flat board, the light reflecting side of the flat board being indented to provide a surface having a serrated sectional configuration.
    Type: Grant
    Filed: March 5, 1993
    Date of Patent: May 23, 1995
    Assignee: Sharp Kabushiki Kaisha
    Inventors: Shinji Yamana, Terukazu Ohtsuki