Patents by Inventor Teruo Nakata
Teruo Nakata has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11315064Abstract: Provided is an information processing device to estimate a current work status by using record data including Man data and a work model in which the record data and with work content at a manufacturing site are associated. The information processing device supports a production instruction at the manufacturing site, and includes a data extraction unit that acquires record data including Man data from the manufacturing site, and a work candidate calculation unit that estimates a current work status by using the record data and a work model in which the record data and with a work content at the manufacturing site are associated.Type: GrantFiled: November 29, 2019Date of Patent: April 26, 2022Assignee: HITACHI, LTD.Inventors: Keita Nogi, Teruo Nakata
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Publication number: 20210365851Abstract: The present invention makes it possible to automatically define a work time for creating a model even if a work time distribution in work record data is not uniform. For this purpose, features of work time distributions are extracted for individual product type numbers and individual work codes on the basis of a feature classification library 202 from work record data 201 indicating the times taken for work associated with prescribed work codes for products associated with prescribed product type numbers (101), and if the extracted features of a per-product-type-number and per-work-code work time distribution have distribution features defined in a work-time definition library 203, work-time definition data defining a per-product-type-number and per-work-code work time is created according to an algorithm defined in the work-time definition library in accordance with the distribution features (102).Type: ApplicationFiled: February 21, 2019Publication date: November 25, 2021Applicant: Hitachi, Ltd.Inventors: Yoshihiro WAKISAKA, Teruo NAKATA
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Publication number: 20200193354Abstract: Provided is an information processing device to estimate a current work status by using record data including Man data and a work model in which the record data and with work content at a manufacturing site are associated. The information processing device supports a production instruction at the manufacturing site, and includes a data extraction unit that acquires record data including Man data from the manufacturing site, and a work candidate calculation unit that estimates a current work status by using the record data and a work model in which the record data and with a work content at the manufacturing site are associated.Type: ApplicationFiled: November 29, 2019Publication date: June 18, 2020Inventors: Keita NOGI, Teruo NAKATA
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Patent number: 9507328Abstract: Provided is a method that may quickly and simply select the allocation of the type of wafers to the processing chamber having a higher productivity in a semiconductor processing device in which a plurality of conveyance robots is disposed in a conveyance mechanism to which a processing chamber is connected and an object to be processed is delivered between the plurality of conveyance robots, when processings are performed on a plurality of types of wafers in parallel. From the information on the arrangement of the processing chambers of the semiconductor processing device and input type of wafers to be processed, the processing chamber allocation candidate is comprehensively generated and a simulation that manufactures all processing targets for each of the processing chamber allocation candidates is performed to calculate a productivity and the candidates are displayed in the order from a higher productivity to support the adoption of a user.Type: GrantFiled: April 10, 2013Date of Patent: November 29, 2016Assignee: HITACHI HIGH-TECHNOLOGIES CORPORATIONInventors: Teruo Nakata, Keita Nogi, Satomi Inoue
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Patent number: 9385016Abstract: In a processing system of a linear tool in which plural carrying robots are arranged in carrying mechanical units to which processing modules are coupled and a processing target is delivered and received between the plural carrying robots, in the case where there are plural carrying routes on which the processing target is carried, the present invention provides a technique for determining the carrying route on which the highest throughput can be obtained. In the processing system of a linear tool, in the case where there are plural carrying routes on which the processing target is carried, the throughputs of the respective carrying routes are compared to each other, and the carrying route is determined by a unit for selecting the carrying route with the highest throughput.Type: GrantFiled: December 13, 2010Date of Patent: July 5, 2016Assignee: HITACHI HIGH-TECHNOLOGIES CORPORATIONInventors: Teruo Nakata, Hideaki Kondo, Keita Nogi
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Patent number: 9343340Abstract: A vacuum processing apparatus is disclosed for processing workpieces. The apparatus includes a load lock adapted to store the workpiece inside and to be switched between atmosphere and vacuum. Vacuum transport chambers are connected to the load lock and to the corresponding process chambers in a state where the load lock and each of the process chambers are isolated. The workpiece can be transferred between each of the process chambers and the load lock via the corresponding vacuum transport chamber. The apparatus also includes load lock valves for switching between interrupt and opening between the load lock and the corresponding vacuum transport chambers, and process chamber valves for switching between interrupt and opening between the process chambers and the corresponding vacuum transport chambers. Timing for opening and closing the valves is controlled in synchronization with the transfer of the workpieces.Type: GrantFiled: February 7, 2011Date of Patent: May 17, 2016Assignee: HITACHI HIGH-TECHNOLOGIES CORPORATIONInventors: Keita Nogi, Hideaki Kondo, Susumu Tauchi, Teruo Nakata
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Publication number: 20150194327Abstract: A vacuum processing system of a semiconductor processing substrate and a vacuum processing method using the same comprises an atmospheric transfer chamber having a plurality of cassette stands for transferring a wafer, a lock chamber for storing the wafer transferred from the atmospheric transfer chamber, a first vacuum transfer chamber to which the wafer from the lock chamber is transferred, a transfer intermediate chamber connected to the first vacuum transfer chamber, a second vacuum transfer chamber connected to the transfer intermediate chamber, at least one vacuum processing chamber connected to the first vacuum transfer chamber, and two or more vacuum processing chambers connected to a rear side of the second vacuum transfer chamber, wherein the number of vacuum processing chambers connected to the first vacuum transfer chamber is smaller than the number of vacuum processing chambers connected to the second vacuum transfer chamber, or the number of use of vacuum processing chambers connected to the firType: ApplicationFiled: March 20, 2015Publication date: July 9, 2015Applicant: HITACHI HIGH-TECHNOLOGIES CORPORATIONInventors: Susumu Tauchi, Hideaki Kondo, Teruo Nakata, Keita Nogi, Atsushi Shimoda, Takafumi Chida
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Patent number: 9011065Abstract: A vacuum processing apparatus which includes an atmospheric transfer chamber having a plurality of cassette stands for transferring a wafer, a lock chamber for storing the wafer, a first vacuum transfer chamber to which the wafer from the lock chamber is transferred, a transfer intermediate chamber connected to the first vacuum transfer chamber, and a second vacuum transfer chamber connected to the transfer intermediate chamber. At least one vacuum processing chamber is connected to the first vacuum transfer chamber, and two or more vacuum processing chambers are connected to a rear side of the second vacuum transfer chamber. A plurality of gate valves are disposed between the first vacuum transfer chamber and each of the lock chamber, the transfer intermediate chamber, and the vacuum processing chamber coupled to the first vacuum transfer chamber. A control unit is also provided for controlling operation of the gate valves.Type: GrantFiled: August 30, 2010Date of Patent: April 21, 2015Assignee: Hitachi High-Technologies CorporationInventors: Susumu Tauchi, Hideaki Kondo, Teruo Nakata, Keita Nogi, Atsushi Shimoda, Takafumi Chida
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Patent number: 8849446Abstract: The present invention provides an efficient transferring control method in a vacuum processing apparatus of a linear tool in which plural vacuum robots are arranged in transferring mechanical units to which process chambers are connected and processing-target members are passed and received among the plural vacuum robots. In addition, the present invention provides a vacuum processing apparatus in which there are provided plural controlling methods, and a unit which determines whether rates of the transferring robots are to be controlled or rates of the process chambers are to be controlled on the basis of processing time of each processing-target member and switches the controlling method in accordance with a site whose rate is controlled.Type: GrantFiled: February 7, 2011Date of Patent: September 30, 2014Assignee: Hitachi High-Technologies CorporationInventors: Teruo Nakata, Hideaki Kondo, Susumu Tauchi, Keita Nogi
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Patent number: 8812151Abstract: An efficient method of controlling transportation in a linear tool type vacuum process device in a state that a length of time required for a process is not stable. For each process chamber, the number of unprocessed wafers that are in process or are being transported to the process chamber is counted, and in deciding a transport destination of a wafer, when the number of unprocessed wafers is equal to or larger than a charge limit amount, a transport destination of a wafer is decided excluding the process chamber. Also, a wafer holding mechanism on a transport path to a process chamber is reserved, and a transport destination of a processed member to be transported next is decided according to a status of reservation.Type: GrantFiled: May 24, 2012Date of Patent: August 19, 2014Assignee: Hitachi High-Technologies CorporationInventors: Teruo Nakata, Keita Nogi, Satomi Inoue, Michinori Kawaguchi
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Publication number: 20140099176Abstract: A semiconductor processing apparatus is provided, which includes processing chambers coupled together by transport mechanisms having transfer robots. After having completed wafer processing in each processing chamber, the allowable value of a time permitted for a processing-completed wafer to continue residing within the processing chamber is set up. Then, a time consumed up to the completion of transportation of a wafer scheduled to be next processed is estimated, thereby controlling a transfer robot in a way such that, when the estimated transfer time exceeds the allowable value of the waiting time, priority is given to an operation for unloading a processed wafer from the processing chamber insofar as the processed wafer's transfer destination is already in its state capable of accepting such wafer.Type: ApplicationFiled: September 11, 2013Publication date: April 10, 2014Applicant: HITACHI HIGH-TECHNOLOGIES CORPORATIONInventors: Keita NOGI, Teruo NAKATA, Kenji TAMAI, Michinori KAWAGUCHI, Yoshiro SUEMITSU
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Patent number: 8588962Abstract: Transportation control in a vacuum processing device with high transportation efficiency without lowering throughput is provided. A control unit is configured to update in real time and holds device state information showing an action state of each of a process chamber, a transportation mechanism unit, a buffer room, and a holding mechanism unit, the presence of a process subject member, and a process state thereof; select a transport algorithm from among transport algorithm judgment rules that are obtained by simulating in advance a plurality of transport algorithms for controlling transportation of a process subject member for each condition of a combination of the number and arrangement of the process chambers and process time of a process subject member based on the device state information and process time of the process subject member; and compute a transport destination of the process subject member based on the selected transport algorithm.Type: GrantFiled: October 2, 2012Date of Patent: November 19, 2013Assignee: Hitachi High-Technologies CorporationInventors: Keita Nogi, Teruo Nakata, Yoshiro Suemitsu, Michinori Kawaguchi, Satomi Inoue
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Publication number: 20130274908Abstract: Provided is a method that may quickly and simply select the allocation of the type of wafers to the processing chamber having a higher productivity in a semiconductor processing device in which a plurality of conveyance robots is disposed in a conveyance mechanism to which a processing chamber is connected and an object to be processed is delivered between the plurality of conveyance robots, when processings are performed on a plurality of types of wafers in parallel. From the information on the arrangement of the processing chambers of the semiconductor processing device and input type of wafers to be processed, the processing chamber allocation candidate is comprehensively generated and a simulation that manufactures all processing targets for each of the processing chamber allocation candidates is performed to calculate a productivity and the candidates are displayed in the order from a higher productivity to support the adoption of a user.Type: ApplicationFiled: April 10, 2013Publication date: October 17, 2013Applicant: Hitachi High-Technologies CorporationInventors: Teruo NAKATA, Keita NOGI, Satomi INOUE
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Patent number: 8538573Abstract: Provided is a method for controlling efficient transferring operations in a vacuum processing apparatus with a linear tool. In the apparatus, plural transferring robots are arranged in transferring mechanism units in which plural process chambers are connected with each other, and to-be-processed wafers are received and passed between plural transferring robots. As the transferring robots is far from the load lock, the number of transferring operations to the process chambers is set larger, the number of times of continuous transferring operations to the process chambers is set as small as possible, and an odd number of times of continuous transferring operations to buffer rooms is set, by a destination determination unit and operation control rules. Further, transferring operations are performed based on the destination determination unit and the operation control rules.Type: GrantFiled: February 7, 2011Date of Patent: September 17, 2013Assignee: Hitachi High-Technologies CorporationInventors: Teruo Nakata, Hideaki Kondo, Susumu Tauchi, Keita Nogi
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Publication number: 20120303158Abstract: An efficient method of controlling transportation in a linear tool type vacuum process device in a state that a length of time required for a process is not stable. For each process chamber, the number of unprocessed wafers that are in process or are being transported to the process chamber is counted, and in deciding a transport destination of a wafer, when the number of unprocessed wafers is equal to or larger than a charge limit amount, a transport destination of a wafer is decided excluding the process chamber. Also, a wafer holding mechanism on a transport path to a process chamber is reserved, and a transport destination of a processed member to be transported next is decided according to a status of reservation.Type: ApplicationFiled: May 24, 2012Publication date: November 29, 2012Inventors: Teruo NAKATA, Keita Nogi, Satomi Inoue, Michinori Kawaguchi
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Publication number: 20110229289Abstract: The apparatus includes a load lock adapted to store the workpiece inside and to be switched between atmosphere and vacuum; vacuum transport chambers connected to the load lock and to the corresponding process chambers in a state where the load lock and each of the process chambers are isolated mutually; transfer means for transferring the workpiece between each of the process chambers and the load lock via the corresponding vacuum transport chamber; load lock valves adapted to switch between interrupt and opening at a position between the load lock and the corresponding vacuum transport chambers; process chamber valves adapted to switch between interrupt and opening at a position between the process chambers and the corresponding vacuum transport chambers; and control means for controlling timing of the opening and closing of the valves whose timings are controlled in synchronization with the transfer of the workpieces.Type: ApplicationFiled: February 7, 2011Publication date: September 22, 2011Inventors: Keita Nogi, Hideaki Kondo, Susumu Tauchi, Teruo Nakata
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Publication number: 20110217148Abstract: The present invention provides an efficient transferring control method in a vacuum processing apparatus of a linear tool in which plural vacuum robots are arranged in transferring mechanical units to which process chambers are connected and processing-target members are passed and received among the plural vacuum robots. In addition, the present invention provides a vacuum processing apparatus in which there are provided plural controlling methods, and a unit which determines whether rates of the transferring robots are to be controlled or rates of the process chambers are to be controlled on the basis of processing time of each processing-target member and switches the controlling method in accordance with a site whose rate is controlled.Type: ApplicationFiled: February 7, 2011Publication date: September 8, 2011Inventors: Teruo NAKATA, Hideaki Kondo, Susumu Tauchi, Keita Nogi
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Publication number: 20110218662Abstract: Provided is a method for controlling efficient transferring operations in a vacuum processing apparatus with a linear tool. In the apparatus, plural transferring robots are arranged in transferring mechanism units in which plural process chambers are connected with each other, and to-be-processed wafers are received and passed between plural transferring robots. As the transferring robots is far from the load lock, the number of transferring operations to the process chambers is set larger, the number of times of continuous transferring operations to the process chambers is set as small as possible, and an odd number of times of continuous transferring operations to buffer rooms is set, by a destination determination unit and operation control rules. Further, transferring operations are performed based on the destination determination unit and the operation control rules.Type: ApplicationFiled: February 7, 2011Publication date: September 8, 2011Inventors: Teruo Nakata, Hideaki Kondo, Susumu Tauchi, Keita Nogi
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Publication number: 20110144792Abstract: In a processing system of a linear tool in which plural carrying robots are arranged in carrying mechanical units to which processing modules are coupled and a processing target is delivered and received between the plural carrying robots, in the case where there are plural carrying routes on which the processing target is carried, the present invention provides a technique for determining the carrying route on which the highest throughput can be obtained. In the processing system of a linear tool, in the case where there are plural carrying routes on which the processing target is carried, the throughputs of the respective carrying routes are compared to each other, and the carrying route is determined by a unit for selecting the carrying route with the highest throughput.Type: ApplicationFiled: December 13, 2010Publication date: June 16, 2011Inventors: Teruo Nakata, Hideaki Kondo, Keita Nogi
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Publication number: 20110110751Abstract: A vacuum processing system of a semiconductor processing substrate and a vacuum processing method using the same comprises an atmospheric transfer chamber having a plurality of cassette stands for transferring a wafer, a lock chamber for storing the wafer transferred from the atmospheric transfer chamber, a first vacuum transfer chamber to which the wafer from the lock chamber is transferred, a transfer intermediate chamber connected to the first vacuum transfer chamber, a second vacuum transfer chamber connected to the transfer intermediate chamber, at least one vacuum processing chamber connected to the first vacuum transfer chamber, and two or more vacuum processing chambers connected to a rear side of the second vacuum transfer chamber, wherein the number of vacuum processing chambers connected to the first vacuum transfer chamber is smaller than the number of vacuum processing chambers connected to the second vacuum transfer chamber, or the number of use of vacuum processing chambers connected to the firType: ApplicationFiled: August 30, 2010Publication date: May 12, 2011Inventors: Susumu TAUCHI, Hideaki Kondo, Teruo Nakata, Keita Nogi, Atsushi Shimoda, Takafumi Chida