Abstract: A vapor-liquid separating space is provided in a body. The body houses a fixed throttle-decompressing liquid-phase refrigerant, and an integration valve member selectively opening or closing a liquid-phase refrigerant passage and a vapor-phase refrigerant passage. The integration valve member is moved by a stepping motor connected to the integration valve member via a shaft. Accordingly, a cycle configuration of a heat pump cycle working as a gas injection cycle can be simplified.

Abstract: A temperature sensitive rod is communicated with a diaphragm that is displaceable in response to a pressure difference between an internal pressure of a sealed space, in which a temperature sensitive medium is sealed, and a pressure of a low pressure refrigerant outputted from an evaporator. A blind hole, which opens to the sealed space, is formed in an inside of the temperature sensitive rod. The temperature sensitive medium is a mixture gas of the refrigerant and an inert gas. A mixing ratio of the inert gas in the temperature sensitive medium corresponds to a ratio of an equivalent diameter of the blind hole relative to a depth of the blind hole in such a manner that a time constant of heat conduction from the temperature sensitive rod to the temperature sensitive medium is kept within a desired time constant range.

Abstract: An accumulator is disposed in a refrigerant circuit at a position on the suction side of a compressor, separates the gas and liquid phases of the refrigerant, and contains the liquid refrigerant. The accumulator comprises: a pressure container (2) having an inner space (S) formed therein; a refrigerant inlet opening (5) provided in the pressure container; a refrigerant outlet opening (6); a conduction pipe (8) for conducting a refrigerant within the pressure container to the outlet opening; and a gas-liquid separation means (15) provided with a separation plate (16) provided within the pressure container so as to face the inlet opening and so as to expand substantially perpendicularly to the direction of the line of flow at the inlet opening. The gas-liquid separation means has, in the region of the separation plate which faces the inlet opening, a mountain-shaped protrusion (18) having a crest (18a) and a sloped surface (18b), the crest (18a) protruding toward the inlet opening.

Abstract: A vapor-liquid separating space is provided in a body. The body houses a fixed throttle-decompressing liquid-phase refrigerant, and an integration valve member selectively opening or closing a liquid-phase refrigerant passage and a vapor-phase refrigerant passage. The integration valve member is moved by a stepping motor connected to the integration valve member via a shaft. Accordingly, a cycle configuration of a heat pump cycle working as a gas injection cycle can be simplified.

Abstract: In an integration valve, a body, in which a vapor-liquid separating space is provided, includes a fixed throttle decompressing liquid-phase refrigerant, a liquid-phase refrigerant side valve body member opening or closing a liquid-phase refrigerant passage, and a vapor-phase refrigerant side valve body member opening or closing a vapor-phase refrigerant passage. Further, the vapor-phase refrigerant side valve body member is configured by a differential pressure regulating valve operated based on a pressure difference between a refrigerant pressure at a side of the vapor-phase refrigerant passage and a refrigerant pressure at a side of the liquid-phase refrigerant passage. The vapor-phase refrigerant side valve body member is movable when the liquid-phase refrigerant side valve body member is moved by a solenoid. Therefore, a cycle configuration of a heat pump cycle configuring a gas injection cycle can be simplified.

Abstract: A decompression device includes an upstream throttle portion, a middle passage portion and a downstream throttle portion, which are arranged within a body portion. The upstream throttle portion is a variable throttle including an upstream throttle passage in which the refrigerant is decompressed and expanded, and a valve body having an open degree adjusting portion configured to adjust an open degree of the upstream throttle passage. The downstream throttle portion is a fixed throttle for decompressing and expanding refrigerant flowing from the middle passage portion. Furthermore, a refrigerant passage defined from the upstream throttle portion to the downstream throttle portion through the middle passage portion is provided in the body portion, and is bent at least at a bent portion in which the refrigerant flow is bent in the body portion.

Abstract: An tank such as an electroless copper plating tank 200, includes a liquid squirting part 4 having a squirt port 6 for squirting the processing solution Q from the squirt port 6 toward the treatment object obliquely upward to a horizontal plane, and hitting the processing solution Q on the upper area of the plate-like work 10 so that the processing solution Q runs down the plate-like work 10.

Abstract: A tank body 100 includes a liquid receiving part 2 for receiving processing solution Q applied to a plate-like work 10 and a liquid retaining part 4 for retaining liquids to be applied to the plate-like work 10 and a liquid outflowing part 6 for causing a flow of the processing solution Q which is spilled out of the liquid retaining part 4 and traveled down toward the plate-like work 10, wherein a tip 6a of the liquid outflowing part 6 is projected from a connecting part 5 connecting to the liquid retaining part 4 (or the liquid receiving part 2).

Abstract: Provided are an electroless copper plating bath and an electroless copper plating method using the electroless copper plating bath, the electroless copper plating bath not containing formaldehyde; being usable under approximately neutral pH conditions; improving plating bath stability; and capable of forming a plating film with a good thickness while controlling deposition outside a pattern. The electroless copper plating bath according to the present invention contains a water-soluble copper salt, and amine borane or a substituted derivative thereof as a reducing agent; does not contain formaldehyde; and has a pH of 4 to 9, wherein polyaminopolyphosphonic acid as a complexing agent, an anionic surface-active agent, an antimony compound, and a nitrogen-containing aromatic compound are contained.

Abstract: The present invention is directed to a method for manufacturing a printed circuit board in which a plurality of conductive layers forming a wiring pattern are laminated in the state where they are put between insulating layers, and a printed circuit board formed thereby. The printed circuit board manufacturing method for the present invention includes a step of forming a via fill (17) to allow electroless plating liquid to be in contact with the surface of the wiring pattern exposed to a bottom part of a via hole (14) formed at a insulating layer to laminate plating metallic film from the bottom part to a opening part of the via hole (14), to form the via fill (17), and a step of forming a wiring pattern to form electroless plating metallic film (20) serving as the wiring pattern onto a substrate where the via fill (17) is formed.

Abstract: A method for forming a circuit pattern is disclosed. A circuit pattern that forms an electrically conductive layer (2L) is formed on an insulating resin (11) that forms a first insulating layer (1L). An insulating resin (13) that forms a second insulating layer (3L) is laminated on the insulating resin (11) on which the circuit pattern has been formed. A trench (14) is formed in the laminated insulating resin (13) to expose the circuit pattern. An electroless plating metal (15) is buried by electroless plating in the trench (14) formed.

Abstract: Disclosed is an electroless plating solution exhibiting a good plating metal filling performance even for larger trenches or vias of several to one hundred and tens of ?m, in a manner free from voids or seams, and allowing maintenance of stabilized performance for prolonged time. The electroless plating solution contains at least a water-soluble metal salt, a reducing agent for reducing metal ions derived from the water-soluble metal salt, and a chelating agent. In addition, the electroless plating solution contains a sulfur-based organic compound as a leveler having at least one aliphatic cyclic group or aromatic cyclic group to which may be linked at least one optional substituent. The aliphatic cyclic group or the aromatic cyclic group contains optional numbers of carbon atoms, oxygen atoms, phosphorus atoms, sulfur atoms and nitrogen atoms.

Abstract: Disclosed is an electroless plating solution exhibiting a good plating metal filling performance even for larger trenches or vias of several to one hundred and tens of ?m, in a manner free from voids or seams, and allowing maintenance of stabilized performance for prolonged time. The electroless plating solution contains at least a water-soluble metal salt, a reducing agent for reducing metal ions derived from the water-soluble metal salt, and a chelating agent. In addition, the electroless plating solution contains a sulfur-based organic compound as a leveler having at least one aliphatic cyclic group or aromatic cyclic group to which may be linked at least one optional substituent. The aliphatic cyclic group or the aromatic cyclic group contains optional numbers of carbon atoms, oxygen atoms, phosphorus atoms, sulfur atoms and nitrogen atoms.

Abstract: Disclosed is an electroless plating solution exhibiting a good plating metal filling performance even for larger trenches or vias of several to one hundred and tens of ?m, in a manner free from voids or seams, and allowing maintenance of stabilized performance for prolonged time. The electroless plating solution contains at least a water-soluble metal salt, a reducing agent for reducing metal ions derived from the water-soluble metal salt, and a chelating agent. In addition, the electroless plating solution contains a sulfur-based organic compound as a leveler having at least one aliphatic cyclic group or aromatic cyclic group to which may be linked at least one optional substituent. The aliphatic cyclic group or the aromatic cyclic group contains optional numbers of carbon atoms, oxygen atoms, phosphorus atoms, sulfur atoms and nitrogen atoms.

Abstract: A surface processing method and a surface processing agent for effectively removing smear produced in a via or the like are disclosed. The smear is to be removed without etching an inner metalized layer without using expensive permanganates that might impose a greater load on an environment and operators. By removing the smear, the tightness in adhesion between an inner metalized circuit layer and plating metal as well as reliability in electrical connection may be improved. To this end, a surface processing method for a resin-containing substrate of a printed circuit board is provided in which the smear left in an opening, such as a blind via, a through-hole or a trench, formed in the substrate, may be removed without etching a metalized inner layer.

Abstract: A decompression device includes an upstream throttle portion, a middle passage portion and a downstream throttle portion, which are arranged within a body portion. The upstream throttle portion is a variable throttle including an upstream throttle passage in which the refrigerant is decompressed and expanded, and a valve body having an open degree adjusting portion configured to adjust an open degree of the upstream throttle passage. The downstream throttle portion is a fixed throttle for decompressing and expanding refrigerant flowing from the middle passage portion. Furthermore, a refrigerant passage defined from the upstream throttle portion to the downstream throttle portion through the middle passage portion is provided in the body portion, and is bent at least at a bent portion in which the refrigerant flow is bent in the body portion.

Abstract: A method for forming a circuit pattern is disclosed. A circuit pattern that forms an electrically conductive layer (2L) is formed on an insulating resin (11) that forms a first insulating layer (1L). An insulating resin (13) that forms a second insulating layer (3L) is laminated on the insulating resin (11) on which the circuit pattern has been formed. A trench (14) is formed in the laminated insulating resin (13) to expose the circuit pattern. An electroless plating metal (15) is buried by electroless plating in the trench (14) formed.

Abstract: The present invention is directed to a method for manufacturing a printed circuit board in which a plurality of conductive layers forming a wiring pattern are laminated in the state where they are put between insulating layers, and a printed circuit board formed thereby. The printed circuit board manufacturing method for the present invention includes a step of forming a via fill (17) to allow electroless plating liquid to be in contact with the surface of the wiring pattern exposed to a bottom part of a via hole (14) formed at a insulating layer to laminate plating metallic film from the bottom part to a opening part of the via hole (14), to form the via fill (17), and a step of forming a wiring pattern to form electroless plating metallic film (20) serving as the wiring pattern onto a substrate where the via fill (17) is formed.

Abstract: Disclosed is an electroless plating solution exhibiting a good plating metal filling performance even for larger trenches or vias of several to one hundred and tens of ?m, in a manner free from voids or seams, and allowing maintenance of stabilized performance for prolonged time. The electroless plating solution contains at least a water-soluble metal salt, a reducing agent for reducing metal ions derived from the water-soluble metal salt, and a chelating agent. In addition, the electroless plating solution contains a sulfur-based organic compound as a leveler having at least one aliphatic cyclic group or aromatic cyclic group to which may be linked at least one optional substituent. The aliphatic cyclic group or the aromatic cyclic group contains optional numbers of carbon atoms, oxygen atoms, phosphorus atoms, sulfur atoms and nitrogen atoms.

Abstract: The internal heat exchanger 7 is provided which exchanges heat between the refrigerant of low pressure and the refrigerant of high pressure, and the pre-load adjusting mechanism of the expansion valve 5 is abolished. Due to the above structure, the refrigerant flowing into the expansion valve 5 is cooled in the internal heat exchanger 7, and enthalpy of the refrigerant flowing into the evaporator 6 is reduced. On the contrary, the refrigerant sucked into the compressor 1 is heated. Accordingly, a difference in enthalpy between the refrigerant at the inlet and the refrigerant at the outlet of the evaporator 6 can be made large, and the heat absorbing capacity of the evaporator 6 can be enhanced, and further it becomes possible to give the degree of superheat to the refrigerant sucked into the compressor 1. Therefore, even if the pre-load adjusting mechanism is abolished, the vapor-compression-type refrigerating machine can be stably operated.