Patents by Inventor Teruyuki Ishihara

Teruyuki Ishihara has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10674604
    Abstract: A printed wiring board includes a multilayer body, a first wiring layer formed on first surface of the body and including first pads, a second wiring layer embedded into second surface of the body and including second and third pads, conductor posts formed on the third pads, and via conductors formed in the body and having diameter reducing toward the second surface of the body. Each third pad has metal foil formed thereon such that each post is formed on the foil, the second wiring layer is formed such that the second pads are positioned to connect an electronic component in central portion of the second surface of the body and the third pads are positioned to connect another board in outer edge portion of the second surface of the body, and the second pads are formed such that each second pad has exposed surface recessed from the second surface.
    Type: Grant
    Filed: October 31, 2016
    Date of Patent: June 2, 2020
    Assignee: IBIDEN CO., LTD.
    Inventors: Teruyuki Ishihara, Hiroyuki Ban, Haiying Mei
  • Patent number: 10477682
    Abstract: A printed wiring board includes a build-up layer including an insulating layer and a first conductor layer including a component mounting pad, a covering layer formed on the build-up layer such that the covering layer is covering the insulating layer and has opening exposing the pad, a reinforcement layer formed on the covering layer and having cavity exposing the pad and the covering layer, a conductor layer formed on the reinforcement layer such that the conductor layer is on the opposite side of the covering layer on the build-up layer, and a via conductor formed in the reinforcement layer such that the via conductor electrically connects the first conductor layer and conductor layer on the reinforcement layer. The first conductor layer is embedded in the insulating layer forming a surface of the build-up layer such that the first conductor layer has surface exposed on the surface of the build-up layer.
    Type: Grant
    Filed: January 11, 2019
    Date of Patent: November 12, 2019
    Assignee: IBIDEN CO., LTD.
    Inventors: Teruyuki Ishihara, Shunsuke Sakai
  • Publication number: 20190327830
    Abstract: A printed wiring board includes a laminate including first conductor pads on first surface side of the laminate and second conductor pads on second surface side of the laminate, and a solder resist layer formed on the first surface side of the laminate and having openings formed such that the openings are exposing the first conductor pads respectively. The laminate includes a resin insulating layer and has first surface on the first surface side and second surface on the second surface side on the opposite side with respect to the first surface of the laminate, and the second conductor pads are embedded in the second surface of the laminate such that the second conductor pads have surfaces exposed from the second surfaces of the laminate respectively and that the surfaces of the second conductor pads are protruding from the second surface of the laminate.
    Type: Application
    Filed: July 3, 2019
    Publication date: October 24, 2019
    Applicant: IBIDEN CO., LTD.
    Inventors: Teruyuki ISHIHARA, Hiroyuki BAN, Haiying MEI
  • Publication number: 20190215958
    Abstract: A printed wiring board includes a build-up layer including an insulating layer and a first conductor layer including a component mounting pad, a covering layer formed on the build-up layer such that the covering layer is covering the insulating layer and has opening exposing the pad, a reinforcement layer formed on the covering layer and having cavity exposing the pad and the covering layer, a conductor layer formed on the reinforcement layer such that the conductor layer is on the opposite side of the covering layer on the build-up layer, and a via conductor formed in the reinforcement layer such that the via conductor electrically connects the first conductor layer and conductor layer on the reinforcement layer. The first conductor layer is embedded in the insulating layer forming a surface of the build-up layer such that the first conductor layer has surface exposed on the surface of the build-up layer.
    Type: Application
    Filed: January 11, 2019
    Publication date: July 11, 2019
    Applicant: IBIDEN CO., LTD.
    Inventors: Teruyuki Ishihara, Shunsuke Sakai
  • Publication number: 20190139877
    Abstract: A printed wiring board includes a support plate, a laminate formed on the support plate and including first conductor pads on a first surface side of the laminate and second conductor pads on a second surface side of the laminate, and a solder resist layer interposed between the support plate and the laminate and having openings formed such that the openings are exposing the first conductor pads respectively. The laminate includes a resin insulating layer and has a first surface on the first surface side and a second surface on the second surface side on the opposite side with respect to the first surface of the laminate, the second conductor pads are embedded in the second surface of the laminate such that the second conductor pads have surfaces recessed from the second surface of the laminate respectively.
    Type: Application
    Filed: December 28, 2018
    Publication date: May 9, 2019
    Applicant: IBIDEN CO., LTD.
    Inventors: Teruyuki ISHIHARA, Hiroyuki BAN, Haiying MEI
  • Patent number: 10271430
    Abstract: A printed wiring board includes a support plate, a laminate formed on the support plate and including first conductor pads on first surface side of the laminate and first via conductors on second surface side of the laminate, and a solder resist layer interposed between the plate and the laminate and having openings formed such that the openings are exposing the first pads. The laminate has first surface on the first surface side and second surface on the second surface side on the opposite side and includes a first resin insulating layer forming the second surface of the laminate, and the first conductors are formed through the first insulating layer such that the first vias are tapering from the first surface side toward the second surface side of the laminate and have end surfaces recessed from the second surface of the laminate on the second surface side of the laminate.
    Type: Grant
    Filed: August 22, 2017
    Date of Patent: April 23, 2019
    Assignee: IBIDEN CO., LTD.
    Inventors: Teruyuki Ishihara, Hiroyuki Ban, Haiying Mei
  • Patent number: 10256175
    Abstract: A printed wiring board includes a support plate, a laminate formed on the support plate and including first conductor pads on a first surface side of the laminate and second conductor pads on a second surface side of the laminate, and a solder resist layer interposed between the support plate and the laminate and having openings formed such that the openings are exposing the first conductor pads respectively. The laminate includes a resin insulating layer and has a first surface on the first surface side and a second surface on the second surface side on the opposite side with respect to the first surface of the laminate, the second conductor pads are embedded in the second surface of the laminate such that the second conductor pads have surfaces recessed from the second surface of the laminate respectively.
    Type: Grant
    Filed: August 21, 2017
    Date of Patent: April 9, 2019
    Assignee: IBIDEN CO., LTD.
    Inventors: Teruyuki Ishihara, Hiroyuki Ban, Haiying Mei
  • Patent number: 10249561
    Abstract: A printed wiring board includes a support plate, and a build-up wiring layer including resin insulating layers and conductor layers and having a first surface and a second surface on the opposite side with respect to the first surface such that the support plate is positioned on the first surface of the build-up wiring layer. The resin insulating layers in the build-up wiring layer include a first resin insulating layer that forms the second surface of the build-up wiring layer, and the build-up wiring layer includes first conductor pads embedded in the first resin insulating layer such that each of the first conductor pads has an exposed surface exposed from the second surface of the build-up wiring layer.
    Type: Grant
    Filed: April 28, 2017
    Date of Patent: April 2, 2019
    Assignee: IBIDEN CO., LTD.
    Inventors: Teruyuki Ishihara, Haiying Mei, Hiroyuki Ban
  • Patent number: 10219374
    Abstract: A printed wiring board includes a first insulating layer, a second conductor layer including first and second circuits, a second insulating layer covering the second conductor layer on the first insulating layer, a third conductor layer including first and second circuits, a third insulating layer covering the third conductor layer on the second insulating layer, a fourth conductor layer including first circuit, a second via conductor connecting the first circuits in the second and third conductor layers through the second insulating layer, and a first skip via conductor penetrating through the second circuit in the third conductor layer and connecting the second circuit in the second conductor layer and the first circuit in the fourth conductor layer through the second and third insulating layers. The second and third conductor layers are formed such that the second conductor layer has thickness t2 larger than thickness t3 of the third conductor layer.
    Type: Grant
    Filed: January 5, 2017
    Date of Patent: February 26, 2019
    Assignee: IBIDEN CO., LTD.
    Inventor: Teruyuki Ishihara
  • Patent number: 10051736
    Abstract: A printed wiring board includes a conductor layer including a conductor circuit, a resin insulating layer formed on the conductor layer and having a via opening reaching to the conductor circuit of the conductor layer, and a via conductor formed in the via opening of the resin insulating layer such that the via conductor is connecting to the conductor circuit of the conductor layer. The conductor circuit of the conductor layer has a first conductor portion and a second conductor portion integrally formed such that the first conductor portion is connected to the via opening of the resin insulating layer, that the second conductor portion is surrounding the first conductor portion and that the first conductor portion has a thickness which is greater than a thickness of the second conductor portion.
    Type: Grant
    Filed: January 25, 2017
    Date of Patent: August 14, 2018
    Assignee: IBIDEN CO., LTD.
    Inventor: Teruyuki Ishihara
  • Patent number: 10004145
    Abstract: A combined wiring board includes a metal frame having multiple opening portions, and multiple wiring boards accommodated in the opening portions in the metal frame, respectively. The opening portions in the metal frame have side walls having holding portions such that the holding portions hold the wiring boards in the opening portions in the metal frame, and the metal frame has slit portions adjacent to the holding portions and connecting portions connecting the slit portions to the opening portions.
    Type: Grant
    Filed: September 25, 2014
    Date of Patent: June 19, 2018
    Assignee: IBIDEN CO., LTD.
    Inventors: Teruyuki Ishihara, Michimasa Takahashi
  • Patent number: 10004143
    Abstract: A printed wiring board includes a first circuit substrate having a first surface and a second surface on the opposite side, and a second circuit substrate having a third surface and a fourth surface on the opposite side such that the first circuit substrate is laminated on the third surface and that the first surface and the third surface are opposing each other. The second circuit substrate has a mounting area on the third surface and includes pads positioned to mount an electronic component in the mounting area and a connection wire structure connected to the pads, and the first circuit substrate includes through-hole conductors extending from the first surface to the second surface and connected to the pads through the connection wire structure and has an opening portion formed through the first circuit substrate such that the opening portion is exposing the pads formed in the mounting area.
    Type: Grant
    Filed: August 31, 2016
    Date of Patent: June 19, 2018
    Assignee: IBIDEN CO., LTD.
    Inventors: Teruyuki Ishihara, Haiying Mei, Hiroyuki Ban
  • Patent number: 9949372
    Abstract: A printed wiring board includes a laminate, a wiring layer formed on first main surface of the laminate and including conductor pads, via conductors including first and second via conductors and formed in the laminate such that each via conductor has diameter gradually reducing from the first main surface toward second main surface of the laminate, and conductor post formed on the first via conductors such that each conductor post includes a metal foil and a plating layer formed on the metal foil. The via conductors are formed such that the first via conductors are positioned in an outer edge portion of the laminate and have minimum-diameter-side surfaces positioned to form a same plane with the second main surface of the laminate and that the second via conductors are positioned in a central portion of the laminate and have minimum-diameter-side surfaces recessed from the second main surface of the laminate.
    Type: Grant
    Filed: February 24, 2017
    Date of Patent: April 17, 2018
    Assignee: IBIDEN CO., LTD.
    Inventors: Teruyuki Ishihara, Hiroyuki Ban, Haiying Mei
  • Publication number: 20180054891
    Abstract: A printed wiring board includes a support plate, a laminate formed on the support plate and including first conductor pads on first surface side of the laminate and second conductor pads on second surface side of the laminate, and a solder resist layer interposed between the support plate and laminate and having openings formed such that the openings are exposing the first pads. The laminate includes a resin insulating layer and has a first surface on the first surface side and a second surface on the second surface side on the opposite side, and a via conductor structure penetrating from the first surface to the second surface of the laminate such that the via structure includes via conductors formed in the insulating layer and tapering from the first surface side toward second surface side of the laminate, and the second pads are protruding from the second surface of the laminate.
    Type: Application
    Filed: August 22, 2017
    Publication date: February 22, 2018
    Applicant: IBIDEN CO., LTD.
    Inventors: Teruyuki ISHIHARA, Hiroyuki BAN, Haiying MEI
  • Publication number: 20180054890
    Abstract: A printed wiring board includes a support plate, a laminate formed on the support plate and including first conductor pads on first surface side of the laminate and first via conductors on second surface side of the laminate, and a solder resist layer interposed between the plate and the laminate and having openings formed such that the openings are exposing the first pads. The laminate has first surface on the first surface side and second surface on the second surface side on the opposite side and includes a first resin insulating layer forming the second surface of the laminate, and the first conductors are formed through the first insulating layer such that the first vias are tapering from the first surface side toward the second surface side of the laminate and have end surfaces recessed from the second surface of the laminate on the second surface side of the laminate.
    Type: Application
    Filed: August 22, 2017
    Publication date: February 22, 2018
    Applicant: IBIDEN CO., LTD.
    Inventors: Teruyuki ISHIHARA, Hiroyuki BAN, Haiying MEI
  • Publication number: 20180053715
    Abstract: A printed wiring board includes a support plate, a laminate formed on the support plate and including first conductor pads on a first surface side of the laminate and second conductor pads on a second surface side of the laminate, and a solder resist layer interposed between the support plate and the laminate and having openings formed such that the openings are exposing the first conductor pads respectively. The laminate includes a resin insulating layer and has a first surface on the first surface side and a second surface on the second surface side on the opposite side with respect to the first surface of the laminate, the second conductor pads are embedded in the second surface of the laminate such that the second conductor pads have surfaces recessed from the second surface of the laminate respectively.
    Type: Application
    Filed: August 21, 2017
    Publication date: February 22, 2018
    Applicant: IBIDEN CO., LTD.
    Inventors: Teruyuki ISHIHARA, Hiroyuki Ban, Haiying Mei
  • Publication number: 20180054888
    Abstract: A printed wiring board includes a support plate, a laminate formed on the support plate and including first conductor pads on a first surface side of the laminate and second conductor pads on a second surface side of the laminate, and a solder resist layer interposed between the support plate and the laminate and having openings formed such that the openings are exposing the first conductor pads respectively. The laminate includes a resin insulating layer and has a first surface on the first surface side and a second surface on the second surface side on the opposite side with respect to the first surface of the laminate, the second conductor pads are embedded in the second surface of the laminate such that the second conductor pads have surfaces exposed from the second surface of the laminate respectively.
    Type: Application
    Filed: August 21, 2017
    Publication date: February 22, 2018
    Applicant: IBIDEN CO., LTD.
    Inventors: Teruyuki ISHIHARA, Hiroyuki BAN, Haiying MEI
  • Patent number: 9844151
    Abstract: A method for manufacturing a combined wiring board includes preparing multiple wiring boards, preparing a metal frame having opening portions which accommodate the boards, respectively, positioning the boards in the opening portions of the frame, respectively, and forming multiple crimped portions in the frame by plastic deformation such that the sidewalls of the boards bond to sidewalls of the opening portions in the frame. The preparing of the boards includes forming the sidewalls of the boards such that when the boards are positioned in the opening portions of the frame, the sidewalls of the boards form wide-space portions and narrow-space portions with respect to the sidewalls of the opening portions in the frame, and the forming of the crimped portions includes generating the deformation such that the sidewalls of the opening portions in the frame abut the narrow-space portions of the boards before the wide-space portions of the boards.
    Type: Grant
    Filed: September 22, 2014
    Date of Patent: December 12, 2017
    Assignee: IBIDEN CO., LTD.
    Inventors: Teruyuki Ishihara, Michimasa Takahashi
  • Publication number: 20170317017
    Abstract: A printed wiring board includes a support plate, and a build-up wiring layer including resin insulating layers and conductor layers and having a first surface and a second surface on the opposite side with respect to the first surface such that the support plate is positioned on the first surface of the build-up wiring layer. The resin insulating layers in the build-up wiring layer include a first resin insulating layer that forms the second surface of the build-up wiring layer, and the build-up wiring layer includes first conductor pads embedded in the first resin insulating layer such that each of the first conductor pads has an exposed surface exposed from the second surface of the build-up wiring layer.
    Type: Application
    Filed: April 28, 2017
    Publication date: November 2, 2017
    Applicant: IBIDEN CO., LTD.
    Inventors: Teruyuki ISHIHARA, Haiying MEI, Hiroyuki BAN
  • Publication number: 20170263571
    Abstract: An electronic component built-in substrate includes an insulating substrate having a through hole and an inner wall surrounding the through hole, an electronic component accommodated in the through hole of the substrate, a sealing member filling the through hole such that the sealing member is covering the electronic component in the through hole of the substrate and exposing a terminal of the electronic component on a first side of the substrate, and a shield layer structure including a first metal film and a second metal film formed such that the first metal film is formed on the inner wall of the substrate and surrounding the through hole of the substrate and that the second metal film is formed on a second side of the substrate on the opposite side with respect to the first side and covering an opening of the through hole on the second side of the substrate.
    Type: Application
    Filed: March 9, 2017
    Publication date: September 14, 2017
    Applicant: IBIDEN CO., LTD.
    Inventors: Teruyuki ISHIHARA, Hiroyuki BAN, Kosuke IKEDA, Haiying MEI