Patents by Inventor Teruyuki Ishihara

Teruyuki Ishihara has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9215811
    Abstract: A method for manufacturing a multi-piece substrate includes preparing a first frame having a connecting portion to which a first piece substrate is to be connected, forming on a portion of the first piece substrate connected to a second frame a conductive pattern having a contour corresponding to the periphery of the connecting portion of the first frame, irradiating laser along the boundary between the second frame and the conductive pattern on the first piece substrate such that the first piece substrate having a joint portion which engages with the connecting portion of the first frame is detached from the second frame, and fitting the joint portion of the first piece substrate into the connecting portion of the first frame such that the first piece substrate is connected to the first frame.
    Type: Grant
    Filed: September 28, 2012
    Date of Patent: December 15, 2015
    Assignee: IBIDEN CO., LTD.
    Inventors: Michimasa Takahashi, Nobuyuki Naganuma, Toshinobu Asai, Teruyuki Ishihara
  • Publication number: 20150257269
    Abstract: A combined wiring board includes multiple metal frames arrayed in a first direction, and multiple wiring boards bonded to the metal frames such that the wiring boards are arrayed in the first direction. The metal frames directly or indirectly engage with the wiring boards such that each of the metal frames is positioned between two adjacent wiring boards of the wiring boards.
    Type: Application
    Filed: March 3, 2015
    Publication date: September 10, 2015
    Applicant: IBIDEN CO., LTD.
    Inventors: Teruyuki ISHIHARA, Michimasa Takahashi
  • Publication number: 20150245474
    Abstract: A wiring board includes a first multilayer wiring board having a built-in electronic component and first conductive layers, a second multilayer wiring board having second conductive layers and positioned such that the second multilayer wiring board has a surface facing a surface of the first multilayer wiring board, and an adhesive layer including an adhesive sheet and interposed between the first multilayer wiring board and the second multilayer wiring board such that the adhesive layer is adhering the first multilayer wiring board and the second multilayer wiring board. The first multilayer wiring board has a first pad on the surface of the first multilayer wiring board, the second multilayer wiring board has a second pad on the surface of the second multilayer wiring board, and the first pad and the second pad are positioned such that the first pad and the second pad face each other across the adhesive layer.
    Type: Application
    Filed: May 8, 2015
    Publication date: August 27, 2015
    Applicant: IBIDEN CO., LTD.
    Inventors: Michimasa Takahashi, Teruyuki Ishihara
  • Patent number: 9066439
    Abstract: A wiring board has a first wiring board having a first solder-resist layer, a second wiring board connected to the first wiring board and positioned in a first opening portion formed in the first solder-resist layer of the first wiring board, and a third wiring board connected to the first wiring board and positioned in a second opening portion formed in the first solder-resist layer of the first wiring board such that the second wiring board and the third wiring board are on the same side of the first wiring board. The first opening portion of the first wiring board and the second opening portion of the first wiring board form either a common opening portion accommodating the second and third wiring boards in the first solder-resist layer or separate opening portions separately accommodating the second wiring board and the third wiring board in the first solder-resist layer.
    Type: Grant
    Filed: May 30, 2012
    Date of Patent: June 23, 2015
    Assignee: IBIDEN CO., LTD.
    Inventors: Hiroshi Segawa, Nobuyuki Naganuma, Michimasa Takahashi, Teruyuki Ishihara
  • Patent number: 9040837
    Abstract: A wiring board includes a first multilayer wiring board having first conductive layers and having a surface, a second multilayer wiring board having second conductive layers and positioned such that the second multilayer wiring board has a surface facing the surface of the first multilayer wiring board, and an adhesive layer including an adhesive sheet and interposed between the first multilayer wiring board and the second multilayer wiring board such that the adhesive layer is adhering the first multilayer wiring board and the second multilayer wiring board. The first multilayer wiring board has a first pad on the surface of the first multilayer wiring board, the second multilayer wiring board has a second pad on the surface of the second multilayer wiring board, and the first pad and the second pad are positioned such that the first pad and the second pad face each other across the adhesive layer.
    Type: Grant
    Filed: October 31, 2012
    Date of Patent: May 26, 2015
    Assignee: IBIDEN CO., LTD.
    Inventors: Michimasa Takahashi, Teruyuki Ishihara
  • Publication number: 20150136454
    Abstract: A combined wiring board includes multiple wiring boards, and a connected metal frame having multiple metal frames and one or more connecting portions such that the metal frames are connected each other by the connecting portion or connecting portions and have accommodation opening portions formed to accommodate the wiring boards, respectively.
    Type: Application
    Filed: November 17, 2014
    Publication date: May 21, 2015
    Applicant: IBIDEN CO., LTD.
    Inventors: Teruyuki ISHIHARA, Michimasa TAKAHASHI
  • Publication number: 20150136453
    Abstract: A combined wiring board includes a wiring board set having multiple wiring boards and one or more adhesive agent portions such that the wiring boards are connected each other by the adhesive agent portion or adhesive agent portions, and a metal frame having an accommodation opening portion formed to accommodate the wiring board set such that the wiring board set is positioned in the accommodation opening portion of the metal frame.
    Type: Application
    Filed: November 17, 2014
    Publication date: May 21, 2015
    Applicant: IBIDEN CO., LTD.
    Inventors: Teruyuki ISHIHARA, Michimasa TAKAHASHI
  • Publication number: 20150114689
    Abstract: A flex-rigid wiring board includes a flexible substrate, a non-flexible substrate positioned such that the non-flexible substrate is extending in horizontal direction of the flexible substrate, a first wiring layer formed on first surfaces of the flexible and non-flexible substrates, a second wiring layer embedded in second surfaces of the flexible and non-flexible substrates, a first insulating layer covering the first surfaces of the flexible and non-flexible substrates and having an opening exposing a portion of the first surface of the flexible substrate, and a second insulating layer covering the second surfaces of the flexible and non-flexible substrates and having an opening exposing a portion of the second surface of the flexible substrate. The first wiring layer includes non-embedded wirings on the first surfaces of the flexible and non-flexible substrates, and the second wiring layer includes embedded wirings in the second surfaces of the flexible and non-flexible substrates.
    Type: Application
    Filed: October 24, 2014
    Publication date: April 30, 2015
    Applicant: IBIDEN Co., Ltd.
    Inventors: Teruyuki ISHIHARA, Michimasa TAKAHASHI, Takashi KARIYA
  • Publication number: 20150114690
    Abstract: A flex-rigid wiring board includes a flexible substrate, a non-flexible substrate positioned such that the non-flexible substrate is extending in horizontal direction of the flexible substrate, a first wiring layer on first surface sides of the flexible and non-flexible substrates, a second wiring layer on second surface sides of the flexible and non-flexible substrates, a first insulating layer covering the first sides of the flexible and non-flexible substrates and having an opening exposing a portion of the first side of the flexible substrate, and a second insulating layer covering the second sides of the flexible and non-flexible substrates and having an opening exposing a portion of the second side of the flexible substrate. The first wiring layer includes first conductor pattern on the first side of the flexible substrate, and the second wiring layer includes second conductor pattern extending across the second sides of the flexible and non-flexible substrates.
    Type: Application
    Filed: October 24, 2014
    Publication date: April 30, 2015
    Applicant: IBIDEN Co., Ltd.
    Inventors: Teruyuki ISHIHARA, Michimasa Takahashi, Takashi Kariya
  • Publication number: 20150083471
    Abstract: A combined wiring board includes a metal frame having multiple opening portions, and multiple wiring boards accommodated in the opening portions in the metal frame, respectively. The opening portions in the metal frame have side walls having holding portions such that the holding portions hold the wiring boards in the opening portions in the metal frame, and the metal frame has slit portions adjacent to the holding portions and connecting portions connecting the slit portions to the opening portions.
    Type: Application
    Filed: September 25, 2014
    Publication date: March 26, 2015
    Applicant: IBIDEN CO., LTD.
    Inventors: Teruyuki Ishihara, Michimasa Takahashi
  • Publication number: 20150085461
    Abstract: A method for manufacturing a combined wiring board includes preparing multiple wiring boards, preparing a metal frame having opening portions which accommodate the boards, respectively, positioning the boards in the opening portions of the frame, respectively, and forming multiple crimped portions in the frame by plastic deformation such that the sidewalls of the boards bond to sidewalls of the opening portions in the frame. The preparing of the boards includes forming the sidewalls of the boards such that when the boards are positioned in the opening portions of the frame, the sidewalls of the boards form wide-space portions and narrow-space portions with respect to the sidewalls of the opening portions in the frame, and the forming of the crimped portions includes generating the deformation such that the sidewalls of the opening portions in the frame abut the narrow-space portions of the boards before the wide-space portions of the boards.
    Type: Application
    Filed: September 22, 2014
    Publication date: March 26, 2015
    Applicant: IBIDEN CO., LTD.
    Inventors: Teruyuki ISHIHARA, Michimasa TAKAHASHI
  • Publication number: 20150055313
    Abstract: A method for manufacturing a combined wiring board includes preparing wiring boards, preparing a metal frame having opening portions formed to accommodate the wiring boards, respectively, positioning the wiring boards in the opening portions in the metal frame, and forming crimped portions in the metal frame by plastic deformation such that sidewalls of the metal frame in the opening portions bond sidewalls of each of the wiring boards. The crimped portions are formed such that the crimped portions in the metal frame have amounts of the plastic deformation which are set different for positions of the crimped portions in the metal frame.
    Type: Application
    Filed: August 21, 2014
    Publication date: February 26, 2015
    Applicant: IBIDEN CO., LTD.
    Inventors: Teruyuki ISHIHARA, Michimasa Takahashi
  • Patent number: 8735739
    Abstract: A wiring board having an insulation layer, and a buildup structure formed on the insulation layer and including insulation layers. The insulation layer and the buildup structure form a board structure in which a cavity portion having an opening on a surface of the buildup structure on the opposite side of the insulation layer is formed. The cavity portion is extending through one or more of the insulation layers in the buildup structure and has a groove portion formed on the bottom surface of the cavity portion along a wall surface of the cavity portion. The board structure composed of the insulation layer and the buildup structure has a pad formed on the bottom surface of the cavity portion in a position farther from the wall surface of the cavity portion than the groove portion.
    Type: Grant
    Filed: September 30, 2011
    Date of Patent: May 27, 2014
    Assignee: Ibiden Co., Ltd.
    Inventors: Teruyuki Ishihara, Hidetoshi Noguchi
  • Publication number: 20140133111
    Abstract: A method for manufacturing a combined wiring board includes providing a metal frame having an accommodation opening portion, positioning a wiring board in the accommodation opening portion of the metal frame, and subjecting the metal frame to plastic deformation such that a sidewall of the wiring board is connected to a sidewall of the metal frame inside the accommodation opening portion of the metal frame.
    Type: Application
    Filed: November 12, 2013
    Publication date: May 15, 2014
    Applicant: IBIDEN CO., LTD.
    Inventors: Teruyuki ISHIHARA, Michimasa TAKAHASHI
  • Publication number: 20140133110
    Abstract: A combined wiring board has multiple piece components each including a wiring board, and a frame component having an accommodation opening portion and holding the multiple piece components in the accommodation opening portion such that each of the piece components is fixed to the frame component at an outer rim of each of the piece components. The frame component has a thermal expansion coefficient in a planar direction which is set higher than a thermal expansion coefficient of the multiple piece components in the planar direction.
    Type: Application
    Filed: November 11, 2013
    Publication date: May 15, 2014
    Applicant: IBIDEN CO., LTD.
    Inventors: Michimasa TAKAHASHI, Teruyuki ISHIHARA
  • Publication number: 20140131074
    Abstract: A wiring substrate has a frame including a metal material and having a connecting portion, and a piece substrate connected to the connecting portion of the frame and having a metal pattern. The metal pattern of the piece substrate has a contour which is corresponding to an outer edge of the connecting portion of the frame.
    Type: Application
    Filed: November 11, 2013
    Publication date: May 15, 2014
    Applicant: IBIDEN CO., LTD.
    Inventors: Teruyuki Ishihara, Michimasa Takahashi
  • Publication number: 20140063770
    Abstract: A plug-in board replacement method includes preparing a board having a piece board, forming first conductive pattern on first surface of the board, forming second conductive pattern on second surface on the opposite side such that the second pattern is on the opposite side of the first pattern, irradiating laser upon the first and second surfaces along the first and second patterns such that the piece is cut out from the board, and fitting the piece into another board. The irradiating includes irradiating laser upon the first surface along the first pattern such that laser is irradiated along the border between edge portion of the first pattern and the first surface and laser upon the second surface along the second pattern such that laser is irradiated along the border between edge portion of the second pattern and the second surface such that the piece is cut out through the board.
    Type: Application
    Filed: August 30, 2013
    Publication date: March 6, 2014
    Applicant: IBIDEN CO., LTD.
    Inventors: Teruyuki ISHIHARA, Michimasa Takahashi
  • Publication number: 20130305530
    Abstract: A wiring board having an insulation layer, and a buildup structure formed on the insulation layer and including insulation layers. The insulation layer and the buildup structure form a board structure in which a cavity portion having an opening on a surface of the buildup structure on the opposite side of the insulation layer is formed. The cavity portion is extending through one or more of the insulation layers in the buildup structure and has a groove portion formed on the bottom surface of the cavity portion along a wall surface of the cavity portion. The board structure composed of the insulation layer and the buildup structure has a pad formed on the bottom surface of the cavity portion in a position farther from the wall surface of the cavity portion than the groove portion.
    Type: Application
    Filed: July 18, 2013
    Publication date: November 21, 2013
    Applicant: IBIDEN CO., LTD.
    Inventors: Teruyuki ISHIHARA, Hidetoshi NOGUCHI
  • Publication number: 20130153269
    Abstract: A wiring board includes a first multilayer wiring board having first conductive layers and having a surface, a second multilayer wiring board having second conductive layers and positioned such that the second multilayer wiring board has a surface facing the surface of the first multilayer wiring board, and an adhesive layer including an adhesive sheet and interposed between the first multilayer wiring board and the second multilayer wiring board such that the adhesive layer is adhering the first multilayer wiring board and the second multilayer wiring board. The first multilayer wiring board has a first pad on the surface of the first multilayer wiring board, the second multilayer wiring board has a second pad on the surface of the second multilayer wiring board, and the first pad and the second pad are positioned such that the first pad and the second pad face each other across the adhesive layer.
    Type: Application
    Filed: October 31, 2012
    Publication date: June 20, 2013
    Inventors: Michimasa TAKAHASHI, Teruyuki ISHIHARA
  • Publication number: 20130081857
    Abstract: A method for manufacturing a multi-piece substrate includes preparing a first frame having a connecting portion to which a first piece substrate is to be connected, forming on a portion of the first piece substrate connected to a second frame a conductive pattern having a contour corresponding to the periphery of the connecting portion of the first frame, irradiating laser along the boundary between the second frame and the conductive pattern on the first piece substrate such that the first piece substrate having a joint portion which engages with the connecting portion of the first frame is detached from the second frame, and fitting the joint portion of the first piece substrate into the connecting portion of the first frame such that the first piece substrate is connected to the first frame.
    Type: Application
    Filed: September 28, 2012
    Publication date: April 4, 2013
    Inventors: MICHIMASA TAKAHASHI, NOBUYUKI NAGANUMA, TOSHINOBU ASAI, TERUYUKI ISHIHARA