Patents by Inventor Teruyuki Ishihara

Teruyuki Ishihara has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8383948
    Abstract: A flex-rigid wiring board includes a flexible substrate having a first surface and a second surface on the opposite side of the first surface, a first conductive pattern formed on the first surface of the flexible substrate, a second conductive pattern formed on the second surface of the flexible substrate, and a conductor made of a conductive paste and formed in a first hole penetrating through the flexible substrate such that the first conductive pattern and the second conductive pattern are electrically connected to each other.
    Type: Grant
    Filed: June 4, 2010
    Date of Patent: February 26, 2013
    Assignee: Ibiden Co., Ltd.
    Inventors: Masakazu Aoyama, Teruyuki Ishihara, Noboru Shibita
  • Publication number: 20130020120
    Abstract: A wiring board has a laminated structure having a recessed portion on a first-surface side of the laminated structure and a solder resist layer on a second-surface side of the laminated structure on the opposite side of the first-surface side. The laminated structure has a first-surface side pad formed in the bottom of the recessed portion and a second-surface side pad formed on the second-surface side of the laminated structure, the solder resist layer has a first opening portion and a second opening portion formed in the solder resist layer, the first opening portion is exposing the second-surface side pad, the second opening portion is formed on a back face of the recessed portion, and the back face of the recessed portion does not include the second-surface side pad.
    Type: Application
    Filed: May 31, 2012
    Publication date: January 24, 2013
    Applicant: IBIDEN CO., LTD.
    Inventors: Teruyuki Ishihara, Hidetoshi Noguchi, Hirofumi Futamura
  • Publication number: 20130014982
    Abstract: A wiring board has a first wiring board having a first solder-resist layer, a second wiring board connected to the first wiring board and positioned in a first opening portion formed in the first solder-resist layer of the first wiring board, and a third wiring board connected to the first wiring board and positioned in a second opening portion formed in the first solder-resist layer of the first wiring board such that the second wiring board and the third wiring board are on the same side of the first wiring board. The first opening portion of the first wiring board and the second opening portion of the first wiring board form either a common opening portion accommodating the second and third wiring boards in the first solder-resist layer or separate opening portions separately accommodating the second wiring board and the third wiring board in the first solder-resist layer.
    Type: Application
    Filed: May 30, 2012
    Publication date: January 17, 2013
    Applicant: IBIDEN CO., LTD.
    Inventors: Hiroshi SEGAWA, Nobuyuki NAGANUMA, Michimasa TAKAHASHI, Teruyuki ISHIHARA
  • Publication number: 20120181074
    Abstract: A wiring board having an insulation layer, and a buildup structure formed on the insulation layer and including insulation layers. The insulation layer and the buildup structure form a board structure in which a cavity portion having an opening on a surface of the buildup structure on the opposite side of the insulation layer is formed. The cavity portion is extending through one or more of the insulation layers in the buildup structure and has a groove portion formed on the bottom surface of the cavity portion along a wall surface of the cavity portion. The board structure composed of the insulation layer and the buildup structure has a pad formed on the bottom surface of the cavity portion in a position farther from the wall surface of the cavity portion than the groove portion.
    Type: Application
    Filed: September 30, 2011
    Publication date: July 19, 2012
    Applicant: IBIDEN CO., LTD.
    Inventors: Teruyuki Ishihara, Hidetoshi Noguchi
  • Publication number: 20110067904
    Abstract: A flex-rigid wiring board includes a flexible substrate having a first surface and a second surface on the opposite side of the first surface, a first conductive pattern formed on the first surface of the flexible substrate, a second conductive pattern formed on the second surface of the flexible substrate, and a conductor made of a conductive paste and formed in a first hole penetrating through the flexible substrate such that the first conductive pattern and the second conductive pattern are electrically connected to each other.
    Type: Application
    Filed: June 4, 2010
    Publication date: March 24, 2011
    Applicant: IBIDEN CO., LTD
    Inventors: Masakazu Aoyama, Teruyuki Ishihara, Noboru Shibita