Abstract: The present invention provide an apparatus for manufacturing a bonded substrate that suppresses a defect in the bonded substrate. When the pressure in a vacuum chamber is at the atmospheric level, upper and lower chuck units respectively attract substrates through vacuum. When the vacuum chamber is depressurized, each chuck unit electrostatically attracts the associated substrate. During the depressurization of the vacuum chamber, the pressure for attracting each substrate to the associated chuck unit is controlled to be equal to the pressure in the vacuum chamber. This prevents each substrate from falling from or moving relative to the associated chuck unit. The first and second substrates are thus bonded together as accurately aligned.

Abstract: The present invention provide an apparatus for manufacturing a bonded substrate that suppresses a defect in the bonded substrate. When the pressure in a vacuum chamber is at the atmospheric level, upper and lower chuck units respectively attract substrates through vacuum. When the vacuum chamber is depressurized, each chuck unit electrostatically attracts the associated substrate. During the depressurization of the vacuum chamber, the pressure for attracting each substrate to the associated chuck unit is controlled to be equal to the pressure in the vacuum chamber. This prevents each substrate from falling from or moving relative to the associated chuck unit. The first and second substrates are thus bonded together as accurately aligned.

Abstract: A laminated substrate manufacturing apparatus that seals an inner side of a seal frame into which liquid crystal is filled while reducing manufacturing deficiencies of laminated substrates. The substrate includes a first holding plate and a second holding plate for holding two substrates. A seal pressing device arranged on one of the first and second holding plates presses a seal formed between the substrates.

Abstract: An apparatus for manufacturing a laminated substrate with a simple structure and with satisfactory yield. First and second holding plates each attract substrates without contacting a laminating surface of the two substrates. A substrate conveying device conveys the substrates into the processing chamber. The substrate conveying device attracts only the surface of a substrate that is opposite to the laminating surface, transfers the substrate to a holding plate, and receives the substrate from the holding plate.

Abstract: A carbon-covered lithium transition metal oxide which comprises a lithium transition metal oxide and carbon black attached on the surface thereof, wherein the carbon black covers 80% or more of the lithium transition metal oxide; a carbon-covered lithium transition metal oxide which comprises a lithium transition metal oxide and carbon fiber attached on the surface thereof; and a positive electrode material for a secondary cell which comprises the carbon-covered lithium transition metal oxide.

Abstract: A water repellent carbonaceous material obtained by contacting a carbonaceous material with a water repellent material in a melted state.

Abstract: The present invention provide an apparatus for manufacturing a bonded substrate that suppresses a defect in the bonded substrate. When the pressure in a vacuum chamber is at the atmospheric level, upper and lower chuck units respectively attract substrates through vacuum. When the vacuum chamber is depressurized, each chuck unit electrostatically attracts the associated substrate. During the depressurization of the vacuum chamber, the pressure for attracting each substrate to the associated chuck unit is controlled to be equal to the pressure in the vacuum chamber. This prevents each substrate from falling from or moving relative to the associated chuck unit. The first and second substrates are thus bonded together as accurately aligned.

Abstract: An apparatus for conveyance of a semiconductor chip. The apparatus includes an arm for conveying a semiconductor chip, a pickup on the arm for holding the semiconductor chip. A first transmission mechanism is provided for producing power acting in a first direction. The first transmission mechanism includes pulleys and a wire. An interconnection mechanism is provided for interconnecting the wire and the arm for causing movement of the arm in the first direction. A second transmission mechanism is connected to the arm for moving the arm in a second direction which is substantially orthogonal to the first direction. The interconnection mechanism is configured to permit movement of the arm with respect to the first transmission mechanism in the second direction and to transmit the power from the first transmission mechanism to the arm.