Patents by Inventor Tetsuji Togawa

Tetsuji Togawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10307882
    Abstract: A polishing method is used for polishing a substrate such as a semiconductor wafer to a flat mirror finish. A method of polishing a substrate by a polishing apparatus includes a polishing table (100) having a polishing surface, a top ring (1) for holding a substrate and pressing the substrate against the polishing surface, and a vertically movable mechanism (24) for moving the top ring (1) in a vertical direction. The top ring (1) is moved to a first height before the substrate is pressed against the polishing surface, and then the top ring (1) is moved to a second height after the substrate is pressed against the polishing surface.
    Type: Grant
    Filed: March 2, 2016
    Date of Patent: June 4, 2019
    Assignee: EBARA CORPORATION
    Inventors: Makoto Fukushima, Tetsuji Togawa, Shingo Togashi, Tomoshi Inoue
  • Patent number: 10293455
    Abstract: A polishing apparatus has a polishing pad, a top ring for holding a semiconductor wafer, and a vertical movement mechanism operable to move the top ring in a vertical direction. The polishing apparatus also has a distance measuring sensor operable to detect a position of the top ring when a lower surface of the top ring is brought into contact with the polishing pad, and a controller operable to calculate an optimal position of the top ring to polish the semiconductor wafer based on the position detected by the distance measuring sensor. The vertical movement mechanism includes a ball screw mechanism operable to move the top ring to the optimal position.
    Type: Grant
    Filed: May 9, 2016
    Date of Patent: May 21, 2019
    Assignee: EBARA CORPORATION
    Inventors: Osamu Nabeya, Tetsuji Togawa, Makoto Fukushima, Hozumi Yasuda
  • Patent number: 10155294
    Abstract: A polishing unit of a polishing apparatus according to an embodiment includes: a polishing head having a pressing member configured to hold a polishing tape and press the polishing tape against a peripheral portion of a substrate from above; a tape supply and recovery mechanism configured to supply the polishing tape to the polishing head and recover the polishing tape from the polishing head; a first moving mechanism configured to move the polishing head in a radial direction of the substrate; and a second moving mechanism configured to move the tape supply and recovery mechanism in the radial direction of the substrate. The positioning unit includes a positioning block having a contacting surface, and alignment of the polishing tape is conducted by the second moving mechanism moving the tape supply and recovery mechanism so that a substrate-side edge of the polishing tape makes contact with the contacting surface.
    Type: Grant
    Filed: January 29, 2018
    Date of Patent: December 18, 2018
    Assignee: Ebara Corporation
    Inventors: Masaya Seki, Tetsuji Togawa, Kenya Ito
  • Patent number: 10040166
    Abstract: A polishing apparatus has a polishing pad, a top ring for holding a semiconductor wafer, and a vertical movement mechanism operable to move the top ring in a vertical direction. The polishing apparatus also has a distance measuring sensor operable to detect a position of the top ring when a lower surface of the top ring is brought into contact with the polishing pad, and a controller operable to calculate an optimal position of the top ring to polish the semiconductor wafer based on the position detected by the distance measuring sensor. The vertical movement mechanism includes a ball screw mechanism operable to move the top ring to the optimal position.
    Type: Grant
    Filed: June 23, 2014
    Date of Patent: August 7, 2018
    Assignee: EBARA CORPORATION
    Inventors: Osamu Nabeya, Tetsuji Togawa, Makoto Fukushima, Hozumi Yasuda
  • Publication number: 20180169822
    Abstract: A polishing unit of a polishing apparatus according to an embodiment includes: a polishing head having a pressing member configured to hold a polishing tape and press the polishing tape against a peripheral portion of a substrate from above; a tape supply and recovery mechanism configured to supply the polishing tape to the polishing head and recover the polishing tape from the polishing head; a first moving mechanism configured to move the polishing head in a radial direction of the substrate; and a second moving mechanism configured to move the tape supply and recovery mechanism in the radial direction of the substrate. The positioning unit includes a positioning block having a contacting surface, and alignment of the polishing tape is conducted by the second moving mechanism moving the tape supply and recovery mechanism so that a substrate-side edge of the polishing tape makes contact with the contacting surface.
    Type: Application
    Filed: January 29, 2018
    Publication date: June 21, 2018
    Applicant: Ebara Corporation
    Inventors: Masaya Seki, Tetsuji Togawa, Kenya Ito
  • Patent number: 9914196
    Abstract: A polishing unit of a polishing apparatus according to an embodiment includes: a polishing head having a pressing member configured to hold a polishing tape and press the polishing tape against a peripheral portion of a substrate from above; a tape supply and recovery mechanism configured to supply the polishing tape to the polishing head and recover the polishing tape from the polishing head; a first moving mechanism configured to move the polishing head in a radial direction of the substrate; and a second moving mechanism configured to move the tape supply and recovery mechanism in the radial direction of the substrate. The positioning unit includes a positioning block having a contacting surface, and alignment of the polishing tape is conducted by the second moving mechanism moving the tape supply and recovery mechanism so that a substrate-side edge of the polishing tape makes contact with the contacting surface.
    Type: Grant
    Filed: March 10, 2015
    Date of Patent: March 13, 2018
    Assignee: Ebara Corporation
    Inventors: Masaya Seki, Tetsuji Togawa, Kenya Ito
  • Patent number: 9808836
    Abstract: There is disclosed a substrate processing apparatus which is capable of detecting whether a substrate, such as a wafer, supported by a fluid is properly present in a predetermined processing position or not. The substrate processing apparatus includes at least one distance sensor configured to measure a distance between a scrubber and a hydrostatic support structure; and a processing controller configured to calculate a gap between the hydrostatic support structure and the surface of the substrate from a measured value of the distance and determine whether the gap falls within a predetermined range or not.
    Type: Grant
    Filed: June 26, 2014
    Date of Patent: November 7, 2017
    Assignee: EBARA CORPORATION
    Inventors: Tetsuji Togawa, Kenya Ito, Yu Ishii, Keisuke Uchiyama
  • Patent number: 9808903
    Abstract: A polishing method which can remove foreign matters from an entire back surface of a substrate at a high removal rate is provided. The polishing method includes placing a polishing tool in sliding contact with an outer circumferential region of a back surface of a substrate while holding a center-side region of the back surface of the substrate, and placing a polishing tool in sliding contact with the center-side region of the back surface of the substrate while holding a bevel portion of the substrate to polish the back surface in its entirety.
    Type: Grant
    Filed: January 29, 2014
    Date of Patent: November 7, 2017
    Assignee: EBARA CORPORATION
    Inventors: Yu Ishii, Kenya Ito, Masayuki Nakanishi, Tetsuji Togawa
  • Publication number: 20170312879
    Abstract: A method of detecting an abnormality in polishing of a substrate is provided. The method includes: rotating the substrate; pressing a polishing tool against an edge portion of the substrate to polish the edge portion; measuring a position of the polishing tool relative to a surface of the substrate; determining an amount of polishing of the substrate from the position of the polishing tool; calculating a polishing rate from the amount of polishing of the substrate; and judging that an abnormality in polishing of the edge portion of the substrate has occurred if the polishing rate is out of a predetermined range.
    Type: Application
    Filed: July 19, 2017
    Publication date: November 2, 2017
    Inventors: Tetsuji Togawa, Masaya Seki, Hiroyuki Takenaka
  • Patent number: 9782869
    Abstract: Detection of an abnormality in polishing of a substrate is provided. A measuring device measures a position of the polishing tool relative to a surface of the substrate. A controller determines an amount of polishing of the substrate from the position of the polishing tool; calculates a polishing rate from the amount of polishing of the substrate; and judges that an abnormality in polishing of the edge portion of the substrate has occurred if the polishing rate is out of a predetermined range exceeds a predetermined threshold value.
    Type: Grant
    Filed: January 4, 2016
    Date of Patent: October 10, 2017
    Assignee: EBARA CORPORATION
    Inventors: Tetsuji Togawa, Masaya Seki, Hiroyuki Takenaka
  • Patent number: 9724797
    Abstract: A polishing apparatus has a polishing pad, a top ring for holding a semiconductor wafer, and a vertical movement mechanism operable to move the top ring in a vertical direction. The polishing apparatus also has a distance measuring sensor operable to detect a position of the top ring when a lower surface of the top ring is brought into contact with the polishing pad, and a controller operable to calculate an optimal position of the top ring to polish the semiconductor wafer based on the position detected by the distance measuring sensor. The vertical movement mechanism includes a ball screw mechanism operable to move the top ring to the optimal position.
    Type: Grant
    Filed: August 20, 2014
    Date of Patent: August 8, 2017
    Assignee: EBARA CORPORATION
    Inventors: Osamu Nabeya, Tetsuji Togawa, Makoto Fukushima, Hozumi Yasuda
  • Publication number: 20170200623
    Abstract: A cleaning apparatus 1 is provided with a heating unit 5 that heats a cleaning surface of a substrate W, a cleaning unit 6 that supplies ozone water to the cleaning surface of the substrate W and cleans the cleaning surface and a control unit 7 that controls the heating of the cleaning surface and the supply of the cleaning liquid so as to clean the cleaning surface after heating the cleaning surface of the substrate W.
    Type: Application
    Filed: December 21, 2016
    Publication date: July 13, 2017
    Inventors: Suguru OZAWA, Toshio YOKOYAMA, Tetsuji TOGAWA
  • Patent number: 9694467
    Abstract: A polishing method of polishing a substrate includes moving a stopper from a predetermined initial position by a distance corresponding to a target polishing amount of a substrate. The method further includes pressing a polishing tool against the substrate by a pressing member while rotating the substrate. The method further includes polishing the substrate until a positioning member which moves together with the pressing member is brought into contact with the stopper.
    Type: Grant
    Filed: December 21, 2016
    Date of Patent: July 4, 2017
    Assignee: EBARA CORPORATION
    Inventors: Masaya Seki, Tetsuji Togawa
  • Patent number: 9630289
    Abstract: A polishing method includes rotating a substrate, performing a first polishing process of pressing a polishing tape against an edge portion of the substrate by a pressing member, with a portion of the polishing tape projecting from the pressing member inwardly in a radial direction of the substrate, to polish the edge portion of the substrate and bend the portion of the polishing tape along the pressing member, and performing a second polishing process of pressing the bent portion of the polishing tape inwardly in the radial direction of the substrate by the pressing member to further polish the edge portion of the substrate.
    Type: Grant
    Filed: September 23, 2013
    Date of Patent: April 25, 2017
    Assignee: Ebara Corporation
    Inventors: Tetsuji Togawa, Atsushi Yoshida, Michiyoshi Yamashita
  • Publication number: 20170100813
    Abstract: A polishing apparatus is used for polishing a substrate such as a semiconductor wafer. The polishing apparatus includes a substrate holder to hold a substrate and to rotate the substrate, a pressing member configured to press a polishing tool against the substrate and to polish the substrate, a pressing force control mechanism configured to control a pressing force of the pressing member, and a polishing position limiting mechanism configured to limit a polishing position of the pressing member. A polishing tape or a fixed abrasive is used as the polishing tool.
    Type: Application
    Filed: December 21, 2016
    Publication date: April 13, 2017
    Inventors: Masaya Seki, Tetsuji Togawa
  • Patent number: 9604335
    Abstract: An apparatus and method of polishing a substrate is described. The polishing includes: rotating a substrate; pressing a first polishing tool against an edge portion of the substrate to polish the edge portion; and pressing a second polishing tool against the edge portion of the substrate to polish the edge portion. The second polishing tool is located more inwardly than the first polishing tool with respect to a radial direction of the substrate. The first polishing tool has a polishing surface rougher than a polishing surface of the second polishing tool.
    Type: Grant
    Filed: June 21, 2016
    Date of Patent: March 28, 2017
    Assignee: Ebara Corporation
    Inventors: Tetsuji Togawa, Atsushi Yoshida, Toshifumi Watanabe
  • Patent number: 9566616
    Abstract: There is disclosed a substrate processing apparatus which is capable of detecting whether a substrate, such as a wafer, supported by a fluid is properly present in a predetermined processing position or not. The substrate processing apparatus includes at least one distance sensor configured to measure a distance between a scrubber and a hydrostatic support structure; and a processing controller configured to calculate a gap between the hydrostatic support structure and the surface of the substrate from a measured value of the distance and determine whether the gap falls within a predetermined range or not.
    Type: Grant
    Filed: June 25, 2014
    Date of Patent: February 14, 2017
    Assignee: Ebara Corporation
    Inventors: Tetsuji Togawa, Kenya Ito, Yu Ishii, Keisuke Uchiyama
  • Patent number: 9561573
    Abstract: A polishing apparatus is used for polishing a substrate such as a semiconductor wafer. The polishing apparatus includes a substrate holder to hold a substrate and to rotate the substrate, a pressing member configured to press a polishing tool against the substrate and to polish the substrate, a pressing force control mechanism configured to control a pressing force of the pressing member, and a polishing position limiting mechanism configured to limit a polishing position of the pressing member. A polishing tape or a fixed abrasive is used as the polishing tool.
    Type: Grant
    Filed: January 29, 2014
    Date of Patent: February 7, 2017
    Assignee: EBARA CORPORATION
    Inventors: Masaya Seki, Tetsuji Togawa
  • Publication number: 20160297048
    Abstract: An apparatus and method of polishing a substrate is described. The polishing includes: rotating a substrate; pressing a first polishing tool against an edge portion of the substrate to polish the edge portion; and pressing a second polishing tool against the edge portion of the substrate to polish the edge portion. The second polishing tool is located more inwardly than the first polishing tool with respect to a radial direction of the substrate. The first polishing tool has a polishing surface rougher than a polishing surface of the second polishing tool.
    Type: Application
    Filed: June 21, 2016
    Publication date: October 13, 2016
    Inventors: Tetsuji TOGAWA, Atsushi YOSHIDA, Toshifumi WATANABE
  • Patent number: 9457448
    Abstract: The polishing apparatus has a polishing unit capable of forming a right-angled cross section by polishing a peripheral portion of the substrate. The polishing unit includes a polishing head having a pressing member configured to press a polishing tape against the peripheral portion of the substrate from above, a tape supply and recovery mechanism configured to supply the polishing tape to the polishing head and to recover the polishing tape from the polishing head, a first moving mechanism configured to move the polishing head in a radial direction of the substrate, and a second moving mechanism configured to move the tape supply and recovery mechanism in the radial direction of the substrate. The guide rollers are arranged such that the polishing tape extends parallel to a tangential direction of the substrate and a polishing surface of the polishing tape is parallel to a surface of the substrate.
    Type: Grant
    Filed: June 22, 2015
    Date of Patent: October 4, 2016
    Assignee: EBARA CORPORATION
    Inventors: Masaya Seki, Tetsuji Togawa, Masayuki Nakanishi