Abstract: An electronic device such as a chip coil including an electric wire firmly connected to electrodes in a highly reliable fashion is constructed to be mounted on a printed circuit board or substrate in a stable and reliable manner. At both ends of a core of the chip coil, there are provided electrodes having a multilayer structure including a high-conductivity layer made of Ag, Ag—Pd, or a similar material; a solder barrier layer made of Ni; and an easy-soldering layer made of Sn or solder. End portions of the electric wire are embedded in the easy-soldering layer so that the resultant electrode structure has a substantially flat surface. A thermo-compression process is performed so that the end portions of the electric wire are connected to the solder barrier layer via solid welding and to the easy-soldering layer via brazing.

Abstract: An electronic device such as a chip coil including an electric wire firmly connected to electrodes in a highly reliable fashion is constructed to be mounted on a printed circuit board or substrate in a stable and reliable manner. At both ends of a core of the chip coil, there are provided electrodes having a multilayer structure including a high-conductivity layer made of Ag, Ag--Pd, or a similar material; a solder barrier layer made of Ni; and an easy-soldering layer made of Sn or solder. End portions of the electric wire are embedded in the easy-soldering layer so that the resultant electrode structure has a substantially flat surface. A thermo-compression process is performed so that the end portions of the electric wire are connected to the solder barrier layer via solid welding and to the easy-soldering layer via brazing.

Abstract: An electronic device such as a chip coil including an electric wire firmly connected to electrodes in a highly reliable fashion is constructed to be mounted on a printed circuit board or substrate in a stable and reliable manner. At both ends of a core of the chip coil, there are provided electrodes having a multilayer structure including a high-conductivity layer made of Ag, Ag--Pd, or a similar material; a solder barrier layer made of Ni; and an easy-soldering layer made of Sn or solder. End portions of the electric wire are embedded in the easy-soldering layer so that the resultant electrode structure has a substantially flat surface. A thermo-compression process is performed so that the end portions of the electric wire are connected to the solder barrier layer via solid welding and to the easy-soldering layer via brazing.

Abstract: A method for accurately and inexpensively producing a chip-type coil device comprises first forming an insulating plate. A plurality of parallel division grooves are then formed in a first direction on the insulating plate on one surface thereof. Thereafter, a conductive layer is formed on the insulating plate, wherein the conductive layer also coats the division grooves. The process then entails forming recess grooves between the division grooves on the insulating plate on which the conductive layer has been formed, and then dividing the insulating plate by forming slots within the division grooves, wherein the slots have widths which are smaller than widths of the division grooves.

Abstract: A method for accurately and inexpensively producing a chip-type coil device comprises first forming an insulating plate. A plurality of parallel division grooves are then formed in a first direction on the insulating plate on one surface thereof. Thereafter, a conductive layer is formed on the insulating plate, wherein the conductive layer also coats the division grooves. The process then entails forming recess grooves between the division grooves on the insulating plate on which the conductive layer has been formed, and then dividing the insulating plate by forming slots within the division grooves, wherein the slots have widths which are smaller than widths of the division grooves.

Abstract: A chip coil wherein the coil wound around the core is enclosed with a sleeve core. The upper surfaces of the core and the sleeve core are ground so as to adjust the inductance of the chip coil.