Abstract: There are a first coolant circuit that supplies a first coolant in a first tank to a first load, a second coolant circuit that supplies a second coolant in a second tank to a second load, and a refrigeration circuit that adjusts temperatures of the first and second coolants to set temperatures by heat exchange between the first and second coolants and refrigerants by using heat exchangers. The set temperature of the second coolant is equal to the set temperature of the first coolant or higher than the set temperature of the second coolant, and the set flow rate of the first coolant is higher than the set flow rate of the second coolant, and the volume of the first tank is larger than the volume of the second tank.

Abstract: A heat exchange flow path portion is formed by alternately winding two spirally-shaped first and second heat transfer walls, with a predetermined gap interposed therebetween in the radial direction of the flow path pipe, around the outer periphery of a cylindrical flow path pipe, in which a cooling heat source is disposed in a main heat transfer flow path inside thereof. An inlet flow path and an outlet flow path for introducing compressed air into the flow path pipe and discharging compressed air from the flow path pipe are alternately formed, in the radial direction, from the gap between the heat transfer walls. Heat exchange is performed between compressed air that flows in the flow path and compressed air that flows in the flow path.

Abstract: A heat exchange flow path portion is formed by alternately winding two spirally-shaped first and second heat transfer walls, with a predetermined gap interposed therebetween in the radial direction of the flow path pipe, around the outer periphery of a cylindrical flow path pipe, in which a cooling heat source is disposed in a main heat transfer flow path inside thereof ?n inlet flow path and an outlet flow path for introducing compressed air into the flow path pipe and discharging compressed air from the flow path pipe are alternately formed, in the radial direction, from the gap between the heat transfer walls. Heat exchange is performed between compressed air that flows in the flow path and compressed air that flows in the flow path.

Abstract: An outer tank and an inner tank having liquid at different temperatures, and a load are connected to each other via outer and inner tank liquid circulating channels and a valve unit. A first opening-and-closing valve is connected to a first bypass flow-channel connecting an outer tank feed channel and an inner tank feedback channel, a second opening-and-closing valve is connected to a second bypass flow channel connecting an inner tank feed channel and an outer tank feedback channel to detect the liquid level of the liquid in the outer tank and the liquid level of the liquid in the inner tank by a liquid level sensor. The liquid levels are adjusted by selectively opening the first opening-and-closing valve and the second opening-and-closing valve when the liquid levels in both tanks become uneven in the process of cyclically feeding the liquid from the tanks to the load.

Abstract: An outer tank and an inner tank having liquid at different temperatures, and a load are connected to each other via outer and inner tank liquid circulating channels and a valve unit. A first opening-and-closing valve is connected to a first bypass flow-channel connecting an outer tank feed channel and an inner tank feedback channel, a second opening-and-closing valve is connected to a second bypass flow channel connecting an inner tank feed channel and an outer tank feedback channel to detect the liquid level of the liquid in the outer tank and the liquid level of the liquid in the inner tank by a liquid level sensor. The liquid levels are adjusted by selectively opening the first opening-and-closing valve and the second opening-and-closing valve when the liquid levels in both tanks become uneven in the process of cyclically feeding the liquid from the tanks to the load.

Abstract: A method of manufacturing a circuit substrate of the present invention, includes the steps of forming an n-layered (n is an integer of 1 or more) wiring layer connected electrically to a metal plate on the metal plate, forming an electroplating layer on a connection pad portion of an uppermost wiring layer of the n-layered wiring layer by an electroplating utilizing the metal plate and the wiring layer as a plating power-supply path, and removing the metal plate.

Abstract: The whole main tank for housing the constant temperature liquid the temperature of which is adjusted by a temperature adjusting device is supported in a sub tank with a gap as a heat insulating layer around the main tank. A liquid level regulating mechanism supplies and discharges the constant temperature liquid between inside of the main tank and the gap formed in the sub tank to thereby achieve heat insulation and regulation of the liquid level of the constant temperature liquid housed in the main tank by utilizing the same gap in the sub tank.

Abstract: A method of manufacturing a circuit substrate of the present invention, includes the steps of forming an n-layered (n is an integer of 1 or more) wiring layer connected electrically to a metal plate on the metal plate, forming an electroplating layer on a connection pad portion of an uppermost wiring layer of the n-layered wiring layer by an electroplating utilizing the metal plate and the wiring layer as a plating power-supply path, and removing the metal plate.

Abstract: The whole main tank for housing the constant temperature liquid the temperature of which is adjusted by a temperature adjusting device is supported in a sub tank with a gap as a heat insulating layer around the main tank. A liquid level regulating mechanism supplies and discharges the constant temperature liquid between inside of the main tank and the gap formed in the sub tank to thereby achieve heat insulation and regulation of the liquid level of the constant temperature liquid housed in the main tank by utilizing the same gap in the sub tank.