Patents by Inventor Tetsuro Nishimura
Tetsuro Nishimura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 11839937Abstract: A lead-free solder alloy consisting essentially of: 32 mass % or more and 40 mass % or less of Bi; 0.1 mass % or more and 1.0 mass % or less of Sb; 0.1 mass % or more and 1.0 mass % or less of Cu; 0.001 mass % or more and 0.1 mass % or less of Ni; and a remainder of Sn with unavoidable impurities. The lead-free solder alloy further contains specific elements in amounts in predetermined ranges.Type: GrantFiled: April 10, 2020Date of Patent: December 12, 2023Assignee: NIHON SUPERIOR CO., LTD.Inventor: Tetsuro Nishimura
-
Publication number: 20220297243Abstract: By using a solder paste including powder of a lead-free solder alloy mainly composed of Sn and a metal particle with a melting point higher than a melting point of the lead-free solder alloy, in which the metal particle is formed. of a Cu—Ni alloy having a Ni content of 0.1 to 90% by mass, or formed of a Cu—Co alloy having a Co content of 0.1 to 90% by mass, a solder bonded body that has heat resistance, thermal conductivity, and reliability higher than ever can be formed.Type: ApplicationFiled: September 2, 2020Publication date: September 22, 2022Inventor: Tetsuro NISHIMURA
-
Publication number: 20220281035Abstract: Provided is a solder-metal mesh composite material in which a lead-free solder layer formed of Sn—Cu—Ni-based lead-free solder contains metal mesh having high thermal conductivity, a void occupancy in a cross-section in a thickness direction is 15% or less, and the Sn—Cu—Ni-based lead-free solder contains 0.1 to 2% by weight of Cu, 0.002 to 1% by weight of Ni, and Sn as a remainder or contains 0.1 to 2% by weight of Cu, 0.002 to 1% by weight of Ni, 0.001 to 1% by weight of Ge, and Sn as a remainder.Type: ApplicationFiled: August 5, 2020Publication date: September 8, 2022Inventors: Tetsuro NISHIMURA, Takatoshi NISHIMURA, Tetsuya AKAIWA, Katsuhiko YASU, Hikaru UNO
-
Publication number: 20220274212Abstract: Provided is a preformed solder including a lead-free solder mainly composed of Sn and a metal particle with a melting point higher than a melting point of the lead-free solder. The metal particle is formed of a Cu-Ni alloy having a Ni content of 0.1 to 90% by mass, or a Cu-Co alloy having a Co content of 0.1 to 90% by mass, and the lead-free solder may contain Ni when the metal particle is formed of the Cu-Ni alloy, or contains Ni when the metal particle is formed of the Cu-Co alloy, and (Cu,Ni) 6Sn5 is formed on a surface of the metal particle. With this preformed solder, a bonded portion having heat resistance, thermal conductivity, and reliability higher than ever can be formed.Type: ApplicationFiled: July 22, 2020Publication date: September 1, 2022Inventor: Tetsuro NISHIMURA
-
Publication number: 20220105593Abstract: A lead-free solder alloy includes Ag in an amount of 0.3 to 4.0% by mass, Cu in an amount of 0.1 to 2.0% by mass, Fe in an amount of 0.005 to 0.05% by mass, Ni in an amount of 0.01 to 0.5% by mass, Ga in an amount of 0.001 to 0.1% by mass, and Sn as the balance.Type: ApplicationFiled: November 29, 2019Publication date: April 7, 2022Inventors: Takatoshi NISHIMURA, Tetsuro NISHIMURA, Tetsuya AKAIWA
-
Publication number: 20220016733Abstract: A lead-free solder alloy consisting essentially of: 32 mass % or more and 40 mass % or less of Bi; 0.1 mass % or more and 1.0 mass % or less of Sb; 0.1 mass % or more and 1.0 mass % or less of Cu; 0.001 parts by mass or more and 0.1 parts by mass or less of Ni; and a remainder of Sn with unavoidable impurities. The lead-free solder alloy further contains specific elements in amounts in predetermined ranges.Type: ApplicationFiled: April 10, 2020Publication date: January 20, 2022Inventor: Tetsuro NISHIMURA
-
Publication number: 20220009040Abstract: In a method for manufacturing a solder joint part, at least one of a first metal base material and a second metal base material is an alloy containing Ni in an amount of more than 0 wt % and less than 44 wt % and Cu in an amount of more than 56 wt %, and solder is a solder alloy containing Ga and inevitable impurities or a solder alloy containing Ga as a main component and having a melting point of 30° C. or lower. The method includes applying the solder to a surface of the first metal base material and placing the second metal base material on the applied solder, and heating the first and second metal base materials to a temperature of 90° C. or lower in a specified atmosphere or in a liquid to generate CuGa2 or (Cu, Ni)Ga2 between the first and second metal base materials, thereby joining the first and second metal material.Type: ApplicationFiled: October 31, 2019Publication date: January 13, 2022Inventors: Kazuhiro NOGITA, Stuart David MCDONALD, Shiqian LIU, Tetsuro NISHIMURA, Takatoshi NISHIMURA, Tetsuya AKAIWA
-
Patent number: 10966618Abstract: A light-emitting section (21) emits light to be irradiated on a body of a patient (100). A light-receiving section (22) outputs a signal corresponding to an intensity of light which has been transmitted through or reflected from the body of the patient (100). A pulse-amplitude Index acquiring section (32) analyzes amplitude of the signal to acquire a pulse-amplitude Index of the patient (100). A pulse determining section (33) determines presence or absence of a pulse of the patient (100) in accordance with the pulse-amplitude Index. A notifying section (34) notifies a result of determination made by the pulse determining section (33).Type: GrantFiled: July 13, 2016Date of Patent: April 6, 2021Assignees: NIHON KOHDEN CORPORATION, KYOTO UNIVERSITYInventors: Tomoyoshi Natsui, Satoshi Hayashi, Tsutomu Wakabayashi, Taku Iwami, Toshihiro Hatakeyama, Tetsuro Nishimura, Takayuki Otani
-
Publication number: 20200140975Abstract: A soldered joint of the present invention is a soldered joint using a lead-free solder alloy of Sn—Cu—Ni—Bi—Ge system, and the lead-free solder alloy is an alloy in which an addition amount of Cu is 0.1 weight % to 2.0 weight %, an addition amount of Ni is 0.05 weight % to 0.5 weight %, an addition amount of Bi is 0.1 weight % to less than 8 weight %, an addition amount of Ge is 0.006 weight % to 0.1 weight %, and a balance is Sn and inevitable impurities. The soldered joint of the present invention includes a bonding portion with an object to be soldered in which Cu3Sn is prevented from being generated.Type: ApplicationFiled: March 22, 2018Publication date: May 7, 2020Inventors: Tetsuro Nishimura, Takatoshi Nishimura, Tetsuya Akaiwa, Shoichi Suenaga
-
Patent number: 10427220Abstract: A nanoparticle production apparatus and automatic production apparatus that allow continuous mass production of nanoparticles with a uniform particle diameter and allow freely adjusting the generation time are provided.Type: GrantFiled: July 11, 2013Date of Patent: October 1, 2019Assignees: APPLIED NANOPARTICLE LABORATORY CORPORATION, NIHON SUPERIOR CO., LTD.Inventors: Teruo Komatsu, Tetsuro Nishimura
-
Patent number: 10329642Abstract: A silver electrode joint having a high joint strength obtained by actively minimizing the particle size of a silver-zinc intermetallic compound at the solidification point. A joint obtained by joining an article to be joined, the joint including silver at least as the surface layer thereof, using a solder alloy which comprises 2-9 wt % of zinc, 0.0001-0.1 wt % of manganese and the balance consisting of tin, the solder joint having a joint interface wherein the particle size of a silver-zinc intermetallic compound, which is formed by silver being the surface layer of the article to be joined and zinc in the solder alloy, is 5 ?m or less.Type: GrantFiled: March 12, 2014Date of Patent: June 25, 2019Assignee: NIHON SUPERIOR CO., LTD.Inventors: Tetsuro Nishimura, Shoichi Suenaga, Takashi Nozu, Motonori Miyaoka, Yasufumi Shibata
-
Patent number: 10286497Abstract: Provided is a lead-free solder alloy and soldering capable of maintaining strong joining strength even in a high-temperature state after soldering and having high reliability and versatility. The lead-free solder alloy composition of the present invention has Sn—Cu—Ni as a basic composition, which includes 0.1 to 2.0 mass % of Cu, and 0.01 to 0.5 mass % of Ni, 0.1 to 5 mass % of Bi, and 76.0 to 99.5 mass % of Sn, such that it is possible to implement soldering with high reliability without decreasing joining strength of a soldered joint even in a state of being exposed to high temperature for a long time, as well as joining strength at the time of bonding.Type: GrantFiled: April 28, 2015Date of Patent: May 14, 2019Assignee: Nihon Superior Co., Ltd.Inventors: Tetsuro Nishimura, Takatoshi Nishimura
-
Publication number: 20180206748Abstract: A light-emitting section (21) emits light to be irradiated on a body of a patient (100). A light-receiving section (22) outputs a signal corresponding to an intensity of light which has been transmitted through or reflected from the body of the patient (100). A pulse-amplitude Index acquiring section (32) analyzes amplitude of the signal to acquire a pulse-amplitude Index of the patient (100). A pulse determining section (33) determines presence or absence of a pulse of the patient (100) in accordance with the pulse-amplitude Index. A notifying section (34) notifies a result of determination made by the pulse determining section (33).Type: ApplicationFiled: July 13, 2016Publication date: July 26, 2018Applicants: NIHON KOHDEN CORPORATION, KYOTO UNIVERSITYInventors: Tomoyoshi NATSUI, Satoshi HAYASHI, Tsutomu WAKABAYASHI, Taku IWAMI, Toshihiro HATAKEYAMA, Tetsuro NISHIMURA, Takayuki OTANI
-
Patent number: 9999945Abstract: A solder alloy may include a Sn—Cu hypereutectic area having Cu in the amount of up to 7.6 weight percent, from 0.006 to 0.5 weight percent of Al, Al2O3, or a combination thereof.Type: GrantFiled: April 6, 2012Date of Patent: June 19, 2018Assignees: NIHON SUPERIOR CO., LTD., THE UNIVERSITY OF QUEENSLANDInventors: Tetsuro Nishimura, Kazuhiro Nogita, Stuart David McDonald, Jonathan James Read, Tina Ventura
-
Patent number: 9999936Abstract: A solder wire bobbinless coil includes a solder wire coil formed by winding a solder wire into a hollow columnar, the solder wire coil having a first coil opening at one end of the hollow columnar, and a second coil opening at the other end of the hollow columnar; and a covering film covering an outer surface of the solder wire coil. The covering film has a first film opening smaller than the first coil opening on a portion covering the first coil opening and a second film opening equal to or smaller than the second coil opening on a portion covering the second coil opening, and the first film opening includes, at a peripheral area thereof, a first protruding portion extending so as to protrude to an inner side of the first coil opening.Type: GrantFiled: June 16, 2016Date of Patent: June 19, 2018Assignee: NIHON SUPERIOR CO., LTD.Inventors: Tetsuro Nishimura, Yutaka Fukushima, Hideki Yoshida
-
Publication number: 20160375517Abstract: A solder wire bobbinless coil includes a solder wire coil formed by winding a solder wire into a hollow columnar, the solder wire coil having a first coil opening at one end of the hollow columnar, and a second coil opening at the other end of the hollow columnar; and a covering film covering an outer surface of the solder wire coil. The covering film has a first film opening smaller than the first coil opening on a portion covering the first coil opening and a second film opening equal to or smaller than the second coil opening on a portion covering the second coil opening, and the first film opening includes, at a peripheral area thereof, a first protruding portion extending so as to protrude to an inner side of the first coil opening.Type: ApplicationFiled: June 16, 2016Publication date: December 29, 2016Inventors: Tetsuro NISHIMURA, Yutaka FUKUSHIMA, Hideki YOSHIDA
-
Publication number: 20160368102Abstract: Provided is a lead-free solder alloy and soldering capable of maintaining strong joining strength even in a high-temperature state after soldering and having high reliability and versatility. The lead-free solder alloy composition of the present invention has Sn—Cu—Ni as a basic composition, which includes 0.1 to 2.0 mass % of Cu, and 0.01 to 0.5 mass % of Ni, 0.1 to 5 mass % of Bi, and 76.0 to 99.5 mass % of Sn, such that it is possible to implement soldering with high reliability without decreasing joining strength of a soldered joint even in a state of being exposed to high temperature for a long time, as well as joining strength at the time of bonding.Type: ApplicationFiled: April 28, 2015Publication date: December 22, 2016Applicant: NIHON SUPERIOR CO., LTDInventors: Tetsuro NISHIMURA, Takatoshi NISHIMURA
-
Patent number: 9339893Abstract: The present invention provides a lead-free solder alloy having high reliability and excellent solder bonding properties and suited for the mounting of micronized electronic components at low cost. The lead-free solder alloy according to the present invention has a composition containing 0.5 to 1.5 wt % of Ag, 0.3 to 1.5 wt % of Cu, 0.01 to 0.2 wt % of Ni, 1.0 wt % or less of Ga, and the balance being Sn and unavoidable impurities.Type: GrantFiled: April 16, 2012Date of Patent: May 17, 2016Assignee: Nihon Superior Co., Ltd.Inventor: Tetsuro Nishimura
-
Publication number: 20160032424Abstract: A silver electrode joint having a high joint strength obtained by actively minimizing the particle size of a silver-zinc intermetallic compound at the solidification point. A joint obtained by joining an article to be joined, the joint including silver at least as the surface layer thereof, using a solder alloy which comprises 2-9 wt % of zinc, 0.0001-0.1 wt % of manganese and the balance consisting of tin, the solder joint having a joint interface wherein the particle size of a silver-zinc intermetallic compound, which is formed by silver being the surface layer of the article to be joined and zinc in the solder alloy, is 5 ?m or less.Type: ApplicationFiled: March 12, 2014Publication date: February 4, 2016Inventors: Tetsuro NISHIMURA, Shoichi SUENAGA, Takashi NOZU, Motonori MIYAOKA, Yasufumi SHIBATA
-
Patent number: 8999519Abstract: A solder joint manufactured of an alloy essentially composed of 0.01-7.6 wt % Cu, 0.001-6 wt % Ni, and the remaining of Sn. Each of Cu and Ni has a maximum concentration range. The lower limit of the range of Ni is 0.01 wt % and preferably 0.03 wt %. The upper limit of the range of Ni is 0.3 wt % and preferably 0.1 wt %. The lower limit of the range of Cu is 0.1 wt % and preferably 0.2 wt %. The upper limit of the range of Cu is 7 wt % and preferably 0.92 wt %. The invention includes the solder joint essentially having these compositions.Type: GrantFiled: October 20, 2008Date of Patent: April 7, 2015Assignee: Nihon Superior Sha Co., Ltd.Inventor: Tetsuro Nishimura