Abstract: A transport device includes: a first nipping part having an outer surface; a second nipping part having an outer surface, the second nipping part being configured to form, with the first nipping part, a nip region in which a recording medium is nipped by bringing the outer surface of the second nipping part into contact with the outer surface of the first nipping part, the second nipping part being relatively movable between a first position at which a distance from the second nipping part to the first nipping part is a first distance at which the nip region is formed and a second position at which the distance from the second nipping part to the first nipping part is longer than the first distance; a transport part including a holder that holds a front end side of the recording medium, the transport part being configured to move the holder to transport the recording medium to pass through the nip region together with the holder while the recording medium is being held by the holder; and a moving mechanism co

Abstract: An image forming device includes a transfer unit that transfers a toner image onto a recording medium that has first and second surfaces and is conveyed in a conveyance direction; a main heating unit arranged downstream of the transfer unit in the conveyance direction, and which contacts and heats the recording medium and fixes the toner image onto the recording medium; a reversing unit that reverses front and back of the recording medium having a first toner image fixed onto the first surface; and a preheating unit arranged between the transfer and main heating units in the conveyance direction and that heats the recording medium having a second toner image transferred onto the second surface. The preheating unit heats the recording medium so that a temperature of the first surface is lower than a softening point of a toner before the recording medium is heated by the main heating unit.

Abstract: A room-temperature-curable organopolysiloxane composition for an oil seal, wherein an organosilane compound containing a specific organo-oxymethyl group and represented by formula (1) and/or a partial hydrolysis condensate of said compound is used as a curing agent (crosslinking agent), and an organic compound having a guanidine skeleton is added in combination as a curing catalyst. (In the formula, each R1 is independently a C1-12 unsubstituted or substituted monovalent hydrocarbon group, R2 is a C1-12 unsubstituted or substituted monovalent hydrocarbon group, Y is a hydrolyzable group, and n is 0, 1 or 2.) It is thus possible to obtain a cured product having good rubber properties, adhesiveness, and engine oil resistance after curing even without containing a metal-based catalyst.

Abstract: Provided is a polyoxyalkylene group-containing organosilicon compound which contains at least one group represented by structural formula (1) in one molecule and has a polyoxyalkylene structure in the main chain. This polyoxyalkylene group-containing organosilicon compound exhibits satisfactorily fast curability and excellent safety even when an amine compound is used as a curing catalyst (In the formula, each R1 independently represents an unsubstituted or substituted C1-10 alkyl group, or an unsubstituted or substituted C6-10 and group, each R2 independently represents an unsubstituted or substituted C1-10 alkyl group, or an unsubstituted or substituted C6-10 aryl group, and each R3 independently represents an unsubstituted or substituted C1-10 alkyl group, or a hydrogen atom. m is a number from 1-3, and n is an integer of 2 or greater. A dashed line represents a bond.

Abstract: An addition reaction-curable silicone emulsion composition containing a water-soluble silane coupling agent (I) and an organopolysiloxane (II) having at least two alkenyl groups in one molecule thereof, where the water-soluble silane coupling agent (I) has at least one group selected from among a succinic anhydride group, a quaternary ammonium group, and a ureido group, and 1 part by mass or more of the water-soluble silane coupling agent (I) is contained relative to 100 parts by mass of the organopolysiloxane (II). This provides: a silicone emulsion composition that gives a cured film adhering well to plastic film substrates regardless of the type, while having suitable release properties regarding adhesives; and a delamination film made by forming a cured film of the silicone emulsion composition.

Abstract: An organopolysiloxane compound represented by average structural formula (1) is capable of imparting an electron beam curable resin with high antistatic properties, while having excellent antistatic performance durability.

Abstract: An electronic component includes: a first terminal that is inserted into a first through hole in a substrate; and a second terminal that is inserted into a second through hole in the substrate, wherein a length of the first terminal from a first end that is inserted into the first through hole to a second end is longer than a length of the second terminal from a third end that is inserted into the second through hole to a fourth end, and a cross sectional area of a portion of the first terminal positioned on a side of the second end with respect to a first joined portion is larger than a cross sectional area of a portion of the second terminal positioned on a side of the fourth end with respect to a second joined portion.

Abstract: Provided are: a removable radiation-curable silicone composition which has excellent radiation curability and gives cured objects having excellent adhesiveness to the substrates; and a release sheet. The removable radiation-curable silicone composition comprises the following components (A), (B), (C), and (D): (A) 100 parts by mass of an organopolysiloxane having an alkenyl group; (B) 1-30 parts by mass of an organopolysiloxane having a mercaptoalkyl group; (C) 0.1-5 parts by mass of a compound having a plurality of acryl groups in the molecule; and (D) 0.1-15 parts by mass of a radical polymerization initiator.

Abstract: A laser wavelength control device, includes a memory; and a processor coupled to the memory and configured to: measure a wavelength of a laser beam emitted by a light source, when the measured wavelength is not in a target wavelength band, adjust a voltage to be applied to the light source such that a wavelength of the laser beam falls within the target wavelength band, and when a wavelength measured after the adjustment of the voltage is not in the target wavelength band, adjust a temperature of the light source such that the wavelength of the laser beam falls within the target wavelength band.

Abstract: An integrated circuit (IC) tag includes: an IC chip; a substrate that is provided with an antenna on a first surface; an adhesive portion configured to adhere a side surface of the IC chip and a peripheral of the IC chip in a state that a terminal of the IC chip is electrically coupled to the antenna; and a first member that is provided between the antenna and the adhesive portion, the first member having an elastic modulus higher than an elastic modulus of the antenna.

Abstract: Provided is a polyoxyalkylene group-containing organosilicon compound which contains at least one group represented by structural formula (1) in one molecule and has polyoxyalkylene structure in the main chain. This polyoxyalkylene group-containing organosilicon compound exhibits satisfactorily fast curability and excellent safety even when an amine compound is used as a curing catalyst (In the formula, each R1 independently represents an unsubstituted or substituted C1-10 alkyl group, or an unsubstituted or substituted C6-10 and group, each R2 independently represents an unsubstituted or substituted C1-10 alkyl group, or an unsubstituted or substituted C6-10 aryl group, and each R3 independently represents an unsubstituted or substituted C1-10 alkyl group, or a hydrogen atom, m is a number from 1-3, and n is an integer of 2 or greater. A dashed line represents a bond.

Abstract: This organic silicon compound is characterized by being represented by structural formula (1), and has good reactivity while having a monoalkoxysilyl group. (In the formula, X represents a monovalent to trivalent organic group including a polyoxyalkylene structure, an alkylene group having 1-20 carbon atoms, O, S, N, or the like, R1 and R2 each independently represent an alkyl group or the like having 1-10 carbon atoms, Y represents a single bond, O, S, or the like, A1, A2, A3, A4, and A5 each represent a single bond, or a divalent linking group such as a divalent hydrocarbon group having 1-20 carbon atoms, and n represents a number of 1-3.

Abstract: This polymer having a reactive silicon-containing group is represented by structural formula (1), and has good reactivity while having a monoalkoxysilyl group. (In the formula, X represents a monovalent to trivalent organic group including a main chain backbone including a predetermined polymer such as a polyurethane, a poly(meth)acrylate, or a polysiloxane, R1 and R2 each independently represent an alkyl group or the like having 1-10 carbon atoms, Y represents O, S, or the like, A1 and A2 each represent a single bond, or a divalent linking group such as a divalent hydrocarbon group having 1-20 carbon atoms, and n represents a number of 1-3.

Abstract: To provide an organic silicon compound having an average structural formula (1). (Z represents a 2 to 20-valent group containing an organosiloxane structure, each R1 independently represents an alkyl group or an aryl group, each R2 independently represents an alkyl group or an aryl group, each R3 independently represents a hydrogen atom, an alkyl group, an alkoxy group, or an O. (oxy radical), each R4 independently represents a hydrogen atom or an alkyl group, each A1 independently represents a single bond or an alkylene group free of a hetero atom, each A2 independently represents a single bond or a divalent linking group containing a hetero atom, m is a number of 1 to 3, p is a number of 1 to 10, q is a number of 1 to 10, and p+q represents a number satisfying from 2 to 20 corresponding to the valency number of Z.

Abstract: The present invention pertains to a room-temperature-curable organopolysiloxane composition containing (A) an organopolysiloxane having the hydrolyzable silyl-group-containing monovalent organic group represented by formula (1) (R1 represents a substituted or unsubstituted C1-10 alkyl group or a substituted or unsubstituted C6-10 aryl group, R2 represents a substituted or unsubstituted C1-10 alkyl group or a substituted or unsubstituted C6-10 aryl group, and R3 represents a substituted or unsubstituted C1-20 alkyl group or a hydrogen atom; M is an integer from 1 to 3, and n is an integer of 2 or more; and the broken line represents atomic bonding), (B) a hydrolyzable organosilane compound and/or a partially hydrolyzed condensate thereof, (C) a curing catalyst, and (F) a bleed oil.

Abstract: An optical waveguide substrate includes a substrate that includes a recess, a buffer layer disposed on a bottom surface and a wall surface of the recess, and an optical waveguide disposed inside the recess with the buffer layer interposed therebetween and having a cladding layer disposed on the buffer layer and a core layer disposed inside the cladding layer.

Abstract: A specific conductivity measurement method includes: performing first measurement to obtain a resonance frequency f1 that is outputted to a measuring device when the first and second dielectric flat plates each have a thickness t1, and an unloaded Qu1 that corresponds to the resonance frequency f1; performing second measurement to obtain a resonance frequency f2 that is outputted to the measuring device when the first and second dielectric flat plates each have a thickness t2 that is different from the thickness t1, and an unloaded Qu2 that corresponds to the resonance frequency f2; and calculating a specific conductivity ?r of the copper foil and the first and second conductor flat plates based on an arithmetic equation that includes the resonance frequency the unloaded Qu1, the resonance frequency f2, and the unloaded Qu2.

Abstract: A heat sink fixing member includes a frame that is provided above a board of a unit and surrounds a first electronic component and a first heat sink; and a blade in which both end parts are connected to the frame, a portion between the both end parts is erected in a gap in a first fin group, and a side closer to the board in the portion abuts on a first base plate, wherein the unit includes: the board; the first electronic component mounted on the board; and the first heat sink that is provided on the first electronic component, and has the first base plate and the first fin group that protrudes from the first base plate.

Abstract: An electronic component includes: a first terminal that is inserted into a first through hole in a substrate; and a second terminal that is inserted into a second through hole in the substrate, wherein a length of the first terminal from a first end that is inserted into the first through hole to a second end is longer than a length of the second terminal from a third end that is inserted into the second through hole to a fourth end, and a cross sectional area of a portion of the first terminal positioned on a side of the second end with respect to a first joined portion is larger than a cross sectional area of a portion of the second terminal positioned on a side of the fourth end with respect to a second joined portion.

Abstract: To provide an organic silicon compound having an average structural formula (1). (Z represents a 2 to 20-valent group containing an organosiloxane structure, each R1 independently represents an alkyl group or an aryl group, each R2 independently represents an alkyl group or an aryl group, each R3 independently represents a hydrogen atom, an alkyl group, an alkoxy group, or an O. (oxy radical), each R4 independently represents a hydrogen atom or an alkyl group, each A1 independently represents a single bond or an alkylene group free of a hetero atom, each A2 independently represents a single bond or a divalent linking group containing a hetero atom, m is a number of 1 to 3, p is a number of 1 to 10, q is a number of 1 to 10, and p+q represents a number satisfying from 2 to 20 corresponding to the valency number of Z.