Patents by Inventor Tetsurou Irino

Tetsurou Irino has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10957964
    Abstract: Provided is a multilayered transmission line plate including one pair of ground layers, a differential wiring layer disposed between one ground layer and the other ground layer of the one pair of ground layers, a first insulating portion disposed between the differential wiring layer and the one ground layer, and a second insulating portion disposed between the differential wiring layer and the other ground layer, wherein the first insulating portion has a resin layer, the first insulating portion or the second insulating portion has a fiber base material layer including a fiber base material, and a thickness of the first insulating portion is equal to or thinner than a thickness of the second insulating portion.
    Type: Grant
    Filed: July 20, 2016
    Date of Patent: March 23, 2021
    Assignee: SHOWA DENKO MATERIALS CO., LTD.
    Inventors: Takao Tanigawa, Tetsurou Irino, Yuusuke Kondou, Etsuo Mizushima, Tomio Fukuda, Yuki Nagai
  • Patent number: 10544305
    Abstract: Provided is a thermosetting resin composition containing a polyimide compound (A) having a structural unit derived from a maleimide compound (a1) having at least two N-substituted maleimide groups and a structural unit derived from a diamine compound (a2); a modified polybutadiene (B); and an inorganic filler (C).
    Type: Grant
    Filed: December 3, 2015
    Date of Patent: January 28, 2020
    Assignee: HITACHI CHEMICAL COMPANY, LTD.
    Inventors: Aya Kasahara, Tetsurou Irino, Hikari Murai
  • Patent number: 10506705
    Abstract: Provided is a multilayered transmission line plate including a pair of ground layers, a differential wiring disposed between a one-sided ground layer of the pair of ground layers and the other ground layer, an insulating layer (X) disposed between the differential wiring and the one-sided ground layer, and an insulating layer (Y) disposed between the differential wiring and the other ground layer, wherein the insulating layer (X) has a layer containing a resin and not containing a glass cloth; the insulating layer (X) or the insulating layer (Y) has a layer containing a glass cloth and a resin; and the thickness of the insulating layer (X) is equal to or less than the thickness of the insulating layer (Y).
    Type: Grant
    Filed: November 20, 2015
    Date of Patent: December 10, 2019
    Assignee: HITACHI CHEMICAL COMPANY, LTD.
    Inventors: Yuusuke Kondou, Etsuo Mizushima, Takao Tanigawa, Yuki Nagai, Tomio Fukuda, Tetsurou Irino
  • Publication number: 20190023899
    Abstract: Provided is a multilayered transmission line plate including one pair of ground layers, a differential wiring layer disposed between one ground layer and the other ground layer of the one pair of ground layers, a first insulating portion disposed between the differential wiring layer and the one ground layer, and a second insulating portion disposed between the differential wiring layer and the other ground layer, wherein the first insulating portion has a resin layer, the first insulating portion or the second insulating portion has a fiber base material layer including a fiber base material, and a thickness of the first insulating portion is equal to or thinner than a thickness of the second insulating portion.
    Type: Application
    Filed: July 20, 2016
    Publication date: January 24, 2019
    Inventors: Takao TANIGAWA, Tetsurou IRINO, Yuusuke KONDOU, Etsuo MIZUSHIMA, Tomio FUKUDA, Yuki NAGAI
  • Publication number: 20180327593
    Abstract: Provided is a thermosetting resin composition containing a polyimide compound (A) having a structural unit derived from a maleimide compound (a1) having at least two N-substituted maleimide groups and a structural unit derived from a diamine compound (a2); a modified polybutadiene (B); and an inorganic filler (C).
    Type: Application
    Filed: December 3, 2015
    Publication date: November 15, 2018
    Inventors: Aya KASAHARA, Tetsurou IRINO, Hikari MURAI
  • Patent number: 10119047
    Abstract: A thermosetting resin composition containing: (A) a resin composition having an unsaturated maleimide group, produced by reacting (a) a maleimide compound having at least two N-substituted maleimide groups per one molecule and (b) an amine compound having at least two primary amino groups per one molecule, in an organic solvent; (B) a thermosetting resin; and (C) a modified imidazole compound, such as an isocyanate-masked imidazole and an epoxy-masked imidazole, and a prepreg, an insulating film with a support, a laminate plate and a printed wiring board, each containing the same.
    Type: Grant
    Filed: March 31, 2015
    Date of Patent: November 6, 2018
    Assignee: HITACHI CHEMICAL COMPANY, LTD.
    Inventors: Tomohiko Kotake, Shinji Tsuchikawa, Hiroyuki Izumi, Masato Miyatake, Shin Takanezawa, Hikari Murai, Tetsurou Irino
  • Publication number: 20150203715
    Abstract: A thermosetting resin composition containing: (A) a resin composition having an unsaturated maleimide group, produced by reacting (a) a maleimide compound having at least two N-substituted maleimide groups per one molecule and (b) an amine compound having at least two primary amino groups per one molecule, in an organic solvent; (B) a thermosetting resin; and (C) a modified imidazole compound, such as an isocyanate-masked imidazole and an epoxy-masked imidazole, and a prepreg, an insulating film with a support, a laminate plate and a printed wiring board, each containing the same.
    Type: Application
    Filed: March 31, 2015
    Publication date: July 23, 2015
    Inventors: Tomohiko KOTAKE, Shinji TSUCHIKAWA, Hiroyuki IZUMI, Masato MIYATAKE, Shin TAKANEZAWA, Hikari MURAI, Tetsurou IRINO
  • Publication number: 20120077401
    Abstract: A thermosetting resin composition containing: (A) a resin composition having an unsaturated maleimide group, produced by reacting (a) a maleimide compound having at least two N-substituted maleimide groups per one molecule and (b) an amine compound having at least two primary amino groups per one molecule, in an organic solvent; (B) a thermosetting resin; and (C) a modified imidazole compound, such as an isocyanate-masked imidazole and an epoxy-masked imidazole, and a prepreg, an insulating film with a support, a laminate plate and a printed wiring board, each containing the same.
    Type: Application
    Filed: March 26, 2010
    Publication date: March 29, 2012
    Inventors: Tomohiko Kotake, Shinji Tsuchikawa, Hiroyuki Izumi, Masato Miyatake, Shin Takanezawa, Hikari Murai, Tetsurou Irino