Patents by Inventor Tetsuya Muraki

Tetsuya Muraki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200286678
    Abstract: A planar transformer includes a coil substrate including a flexible substrate and multiple coils formed on the flexible substrate. The coil substrate is formed to have coil parts and coilless parts such that the coil parts have the coils and that the coilless parts do not have the coils, and the coil substrate is folded such that at least one of the coilless parts is sandwiched between two of the coil parts.
    Type: Application
    Filed: February 28, 2020
    Publication date: September 10, 2020
    Applicant: IBIDEN CO., LTD.
    Inventors: Haruhiko MORITA, Hitoshi MIWA, Shinobu KATO, Toshihiko YOKOMAKU, Hisashi KATO, Takahisa HIRASAWA, Tetsuya MURAKI, Takayuki FURUNO
  • Publication number: 20200287452
    Abstract: A motor coil substrate includes a coil substrate including a flexible substrate and multiple coils formed on the flexible substrate such that the coils are extending from a first end toward a second end on the opposite side with respect to the first end. The flexible substrate includes inner peripheral and outer peripheral flexible substrates such that the coils include outer peripheral coils formed on the outer peripheral flexible substrate and inner peripheral coils formed on the inner peripheral flexible substrate, that a number of the outer peripheral coils and a number of the inner peripheral coils are L, that an m-th outer peripheral coil of the outer peripheral coils is positioned on a m-th inner peripheral coil of the inner peripheral coils, and that the m-th outer peripheral coil and the m-th inner peripheral coil are connected to each other in parallel, where L and m are natural numbers.
    Type: Application
    Filed: February 28, 2020
    Publication date: September 10, 2020
    Applicant: IBIDEN CO., LTD.
    Inventors: Haruhiko MORITA, Hitoshi MIWA, Shinobu KATO, Toshihiko YOKOMAKU, Hisashi KATO, Takahisa HIRASAWA, Tetsuya MURAKI, Takayuki FURUNO
  • Publication number: 20200161919
    Abstract: A coil substrate includes a flexible substrate, and a coil including a wiring and formed on the flexible substrate. The flexible substrate has a cut penetrating through the flexible substrate such that the cut is formed to extend along a portion of the coil.
    Type: Application
    Filed: November 15, 2019
    Publication date: May 21, 2020
    Applicant: IBIDEN CO., LTD.
    Inventors: Haruhiko MORITA, Hitoshi Miwa, Shinobu Kato, Toshihiko Yokomaku, Hisashi Kato, Takahisa Hirasawa, Tetsuya Muraki, Takayuki Furuno
  • Publication number: 20200083769
    Abstract: A coil substrate for a motor includes a flexible substrate, and multiple coils formed on a surface of the flexible substrate. Each of the coils has a wiring having first wiring portions and second wiring portions extending from the first wirings respectively and is formed such that the first wiring portions extend parallel with respect to each other and that the second wiring portions extend not parallel to the first wirings, and the flexible substrate is formed to be formed around a magnet of a motor such that the first wiring portions form an angle that is substantially perpendicular to a rotation direction of the motor.
    Type: Application
    Filed: September 11, 2019
    Publication date: March 12, 2020
    Applicant: IBIDEN CO., LTD.
    Inventors: Haruhiko MORITA, Hitoshi MIWA, Shinobu KATO, Toshihiko YOKOMAKU, Hisashi KATO, Takahisa HIRASWA, Tetsuya MURAKI, Takayuki FURUNO
  • Publication number: 20200075224
    Abstract: A planar transfoinier includes a flexible insulating substrate having a pair of short sides, a pair of long sides, a first surface, and a second surface on an opposite side with respect to the first surface, multiple coils formed side by side on the first surface and second surface of the flexible insulating substrate such that each of the coils has a spiral-shaped wiring, and multiple terminals formed on the flexible insulating substrate and connected to the coils respectively such that the terminals are positioned in a center portion of the flexible insulating substrate formed close to a center of the long sides of the flexible insulating substrate. The flexible insulating substrate has multiple bending portions formed such that the flexible insulating substrate is folded at the bending portions and stacks the coils one another.
    Type: Application
    Filed: August 29, 2019
    Publication date: March 5, 2020
    Applicant: IBIDEN CO., LTD.
    Inventors: Haruhiko MORITA, Hitoshi MIWA, Shinobu KATO, Toshihiko YOKOMAKU, Hisashi KATO, Takahisa HIRASAWA, Tetsuya MURAKI, Takayuki FURUNO
  • Publication number: 20200076263
    Abstract: A motor coil substrate includes a flexible substrate, and multiple coils formed on the flexible substrate such that each of the coils has a spiral shape. The flexible substrate has multiple folding lines formed and the multiple coils positioned such that the flexible substrate is folded at the folding lines and wound around a magnet and that an m-th coil and an (m+1)-th coil of the coils partially overlap one another when folded at the folding lines.
    Type: Application
    Filed: August 30, 2019
    Publication date: March 5, 2020
    Applicant: IBIDEN CO., LTD.
    Inventors: Haruhiko MORITA, Hitoshi MIWA, Shinobu KATO, Toshihiko YOKOMAKU, Hisashi KATO, Takahisa HIRASAWA, Tetsuya MURAKI, Takayuki FURUNO
  • Publication number: 20200075223
    Abstract: A planar transformer includes a flexible insulating substrate having a first surface and a second surface on the opposite side with respect to the first surface, and multiple coils formed side by side on the first surface and the second surface of the flexible insulating substrate such that each of the coils includes a spiral-shaped wiring. The flexible insulating substrate has bending portions formed such that the flexible insulating substrate is folded at the bending portions and stack the coils one another.
    Type: Application
    Filed: August 29, 2019
    Publication date: March 5, 2020
    Applicant: IBIDEN CO., LTD.
    Inventors: Haruhiko MORITA, Hitoshi MIWA, Shinobu KATO, Toshihiko YOKOMAKU, Hisashi KATO, Takahisa HIRASAWA, Tetsuya MURAKI, Takayuki FURUNO
  • Patent number: 8614898
    Abstract: A printed wiring board includes an insulating resinous substrate having an aperture unit, a first terminal unit and a second terminal unit consisting of a conductor and formed on top of the resinous substrate, and a fuse unit that electrically couples the first terminal unit and the second terminal unit to each other. At least a part of the fuse unit is disposed over the aperture unit, and in addition, is covered by a porous inorganic covering material having insulating properties.
    Type: Grant
    Filed: June 9, 2011
    Date of Patent: December 24, 2013
    Assignee: Ibiden Co., Ltd.
    Inventors: Yasuji Hiramatsu, Yuki Terada, Tetsuya Muraki
  • Patent number: 8441806
    Abstract: A circuit board comprises a first conductive post for electrically connecting to the first electrode of the semiconductor device, a first metal plate connecting to the first conductive post, a second conductive post for electrically connecting to the second electrode of the semiconductor device, a second metal plate connecting to the second conductive post, a third conductive post for electrically connecting to the third electrode of the semiconductor device, and a third metal plate connecting to the third conductive post.
    Type: Grant
    Filed: September 30, 2010
    Date of Patent: May 14, 2013
    Assignee: Ibiden Co., Ltd.
    Inventors: Kiyotaka Tsukada, Tetsuya Muraki
  • Patent number: 8415791
    Abstract: A semiconductor device includes a support plate having a hole formed therein and a conductor formed on a wall surface of the hole, a semiconductor element; and a conductive post formed by a conductor having a first end portion at one end, and a second end portion at an other end. The second end portion of the conductive post is connected to the semiconductor element, and a side surface of the conductive post is fixed to the conductor on the wall surface of the hole deformed by pressing force of the conductive post on a side closer to the first end portion than the second end portion.
    Type: Grant
    Filed: November 23, 2010
    Date of Patent: April 9, 2013
    Assignee: Ibiden Co., Ltd.
    Inventors: Kiyotaka Tsukada, Tetsuya Muraki, Atsunari Yamashita, Yoshitomo Tomida
  • Patent number: 8278753
    Abstract: The semiconductor device comprises a support plate; a semiconductor element; and conductor posts consisting of a conductor having a first end at one end and a second end at the other end, the second end being connected to the semiconductor element and the conductor posts being connected to the support plate at a position on the side of the second end that is closer to the first end, wherein the conductor posts have a heat conductivity of approximately 200 W/m·K or higher and a Vickers hardness of approximately 70 or lower.
    Type: Grant
    Filed: November 23, 2010
    Date of Patent: October 2, 2012
    Assignee: Ibiden Co., Ltd.
    Inventors: Kiyotaka Tsukada, Tetsuya Muraki, Atsunari Yamashita, Yoshitomo Tomida
  • Patent number: 8093502
    Abstract: A flex-rigid printed wiring board is proposed which includes rigid substrates each formed from an insulative base material and a conductor circuit provided on the insulative base material, and a bendably flexible substrate formed from an insulative base material, conductor circuit provided on the insulative base material and a cover lay to cover the conductor circuit, the rigid and flexible substrates being connected to each other. As the insulative base material of the flexible substrate, there is adopted a bendable base material formed by impregnating a glass cloth with a resin and drying it. An conductor circuit is formed on one side of the flexible substrate while a dummy pattern is formed on the other side near a portion thereof where the flexible substrate is to be bent.
    Type: Grant
    Filed: June 9, 2005
    Date of Patent: January 10, 2012
    Assignee: Ibiden Co., Ltd.
    Inventors: Yukinobu Mikado, Katsumi Sagisaka, Katsuo Kawaguchi, Tetsuya Muraki
  • Publication number: 20110304997
    Abstract: A printed wiring board includes an insulating resinous substrate having an aperture unit, a first terminal unit and a second terminal unit consisting of a conductor and formed on top of the resinous substrate, and a fuse unit that electrically couples the first terminal unit and the second terminal unit to each other. At least a part of the fuse unit is disposed over the aperture unit, and in addition, is covered by a porous inorganic covering material having insulating properties.
    Type: Application
    Filed: June 9, 2011
    Publication date: December 15, 2011
    Applicant: IBIDEN CO., LTD.
    Inventors: Yasuji Hiramatsu, Yuki Terada, Tetsuya Muraki
  • Publication number: 20110140564
    Abstract: A coil sheet has an insulative substrate which bends and has the first surface and the second surface on the opposite side of the first surface, a first conductor forming a first spiral conductive pattern and formed on the first surface of the insulative substrate, and a second conductor forming a second spiral conductive pattern and formed on the second surface of the insulative substrate. The width of the tip portion of the second conductor of the second spiral conductive pattern is set narrower than the width of the base end portion of the first conductor of the first spiral conductive pattern.
    Type: Application
    Filed: May 27, 2010
    Publication date: June 16, 2011
    Applicant: IBIDEN CO., LTD.
    Inventors: Toshihiro Nomura, Tetsuya Muraki
  • Publication number: 20110121450
    Abstract: A semiconductor device includes a support plate having a hole formed therein and a conductor formed on a wall surface of the hole, a semiconductor element; and a conductive post formed by a conductor having a first end portion at one end, and a second end portion at an other end. The second end portion of the conductive post is connected to the semiconductor element, and a side surface of the conductive post is fixed to the conductor on the wall surface of the hole deformed by pressing force of the conductive post on a side closer to the first end portion than the second end portion.
    Type: Application
    Filed: November 23, 2010
    Publication date: May 26, 2011
    Applicant: IBIDEN CO., LTD.
    Inventors: Kiyotaka Tsukada, Tetsuya Muraki, Atsunari Yamashita, Yoshitomo Tomida
  • Publication number: 20110121448
    Abstract: The semiconductor device comprises a support plate; a semiconductor element; and conductor posts consisting of a conductor having a first end at one end and a second end at the other end, the second end being connected to the semiconductor element and the conductor posts being connected to the support plate at a position on the side of the second end that is closer to the first end, wherein the conductor posts have a heat conductivity of approximately 200 W/m·K or higher and a Vickers hardness of approximately 70 or lower.
    Type: Application
    Filed: November 23, 2010
    Publication date: May 26, 2011
    Applicant: IBIDEN CO., LTD.
    Inventors: Kiyotaka TSUKADA, Tetsuya Muraki, Atsunari Yamashita, Yoshitomo Tomida
  • Publication number: 20110080714
    Abstract: A circuit board comprises a first conductive post for electrically connecting to the first electrode of the semiconductor device, a first metal plate connecting to the first conductive post, a second conductive post for electrically connecting to the second electrode of the semiconductor device, a second metal plate connecting to the second conductive post, a third conductive post for electrically connecting to the third electrode of the semiconductor device, and a third metal plate connecting to the third conductive post.
    Type: Application
    Filed: September 30, 2010
    Publication date: April 7, 2011
    Applicant: IBIDEN CO., LTD
    Inventors: Kiyotaka Tsukada, Tetsuya Muraki
  • Publication number: 20080289859
    Abstract: A flex-rigid printed wiring board is proposed which includes rigid substrates each formed from an insulative base material and a conductor circuit provided on the insulative base material, and a bendably flexible substrate formed from an insulative base material, conductor circuit provided on the insulative base material and a cover lay to cover the conductor circuit, the rigid and flexible substrates being connected to each other. As the insulative base material of the flexible substrate, there is adopted a bendable base material formed by impregnating a glass cloth with a resin and drying it. An conductor circuit is formed on one side of the flexible substrate while a dummy pattern is formed on the other side near a portion thereof where the flexible substrate is to be bent.
    Type: Application
    Filed: June 9, 2005
    Publication date: November 27, 2008
    Applicant: IBIDEN CO., LTD.
    Inventors: Yukinobu Mikado, Katsumi Sagisaka, Katsuo Kawaguchi, Tetsuya Muraki