Abstract: The present invention provides a production method of a copolymeric polyester which comprises culturing an ACT1 gene promoter shown under SEQ ID NO: 9, a GAP3 gene promoter shown under SEQ ID NO: 10; a PMA1 gene promoter shown under SEQ ID NO: 11, and, a TEF1 gene promoter shown under SEQ ID NO: 12; a plasmid which contains the gene expression unit comprising said promoter; a transformed cell as resulting from transformation of the said plasmid; and said transformed cell.

Abstract: A gene expression cassette comprising an Aeromonas caviae-origin polyhydroxyalkanoic acid (PHA) synthase gene having a mutation introduced thereinto and a promoter and a terminator acting in a yeast; a transformant constructed by transferring the above gene expression cassette into a yeast; and a process for producing a polyester using the above transformant. Thus, it becomes possible to efficiently produce a copolymerized polyester having a high biodegradability and excellent properties by copolymerizing 3-hydroxyalkanoic acids in a yeast.

Abstract: It is intended to provide a process for industrially safely and/or economically and efficiently producing a polyester by using gene manipulation techniques. A vector applicable to hosts over a wide range which is characterized by having improved industrial safety; a polyester synthase-expressing plasmid wherein at least a polyester synthase gene is transferred into said vector; a transformant capable of synthesizing a polyester which contains the plasmid; and a process for producing a polyester with the use of the plasmid or the transformant.

Abstract: A semiconductor package has (a) a package base, (b) package terminals formed on the package base and used to connect the semiconductor package to another device, (c) a wiring layer formed on the package base and electrically connected to the package terminals, (d) a semiconductor chip mounted on the package base and electrically connected to the wiring layer, (e) a low-elasticity resin layer formed between a resin mold and the wiring layer and between the package base and the resin mold, and (f) the resin mold sealing the package base, the wiring layer, the semiconductor chip, and the low-elasticity resin layer.

Abstract: A semiconductor package has (a) a package base, (b) package terminals formed on the package base and used to connect the semiconductor package to another device, (c) a wiring layer formed on the package base and electrically connected to the package terminals, (d) a semiconductor chip mounted on the package base and electrically connected to the wiring layer, (e) a low-elasticity resin layer formed between a resin mold and the wiring layer and between the package base and the resin mold, and (f) the resin mold sealing the package base, the wiring layer, the semiconductor chip, and the low-elasticity resin layer.

Abstract: A semiconductor package has (a) a package base, (b) package terminals formed on the package base and used to connect the semiconductor package to another device, (c) a wiring layer formed on the package base and electrically connected to the package terminals, (d) a semiconductor chip mounted on the package base and electrically connected to the wiring layer, (e) a low-elasticity resin layer formed between a resin mold and the wiring layer and between the package base and the resin mold, and (f) the resin mold sealing the package base, the wiring layer, the semiconductor chip, and the low-elasticity resin layer.

Abstract: A semiconductor package has (a) a package base, (b) package terminals formed on the package base and used to connect the semiconductor package to another device, (c) a wiring layer formed on the package base and electrically connected to the package terminals, (d) a semiconductor chip mounted on the package base and electrically connected to the wiring layer, (e) a low-elasticity resin layer formed between a resin mold and the wiring layer and between the package base and the resin mold, and (f) the resin mold sealing the package base, the wiring layer, the semiconductor chip, and the low-elasticity resin layer.

Abstract: A TPA variant with replacement of amino acids is provided. In a typical embodiment, the variant has an amino acid sequence with replacement of the amino acid group consisting of asparagine at the 37th position, serine at the 38th position, glycine at the 39th position, arginine at the 40th position, alanine at the 41st position, and glutamine at the 42nd position from the N-terminus of the amino acid sequence of mature human tissue plasminogen activator.

Abstract: A wire bonder comprises a pattern recognition mechanism. The pattern recognition mechanism includes a TV camera head, a camera control unit, a program research unit, and a bonder controller. The bonder controller includes a microcomputer, a control circuit, and a servo drive unit. The TV camera head and camera control unit detect locations of a first bonding pad formed on a first semiconductor chip and a second bonding pad formed on a second semiconductor chip. The program research unit calculates amounts of shift of the detected locations of the first and second bonding pads from reference locations thereof. The microcomputer corrects locations of first and second bonding points and those of first and second cutting points in accordance with the calculated amounts of shift. The control circuit and servo drive unit control the first and second bonding points and the first and second cutting points based on the corrected locations.

Abstract: Bonding pads for deriving out electrodes of semiconductor elements formed on a pellet to the exterior are formed on the pellet. The pellet is mounted on a bed. Inner lead portions of a lead frame are arranged on the surrounding portion of the bed to extend radially away from the bed. A distance between those of the inner lead portions which are disposed in position corresponding to the corner portion of the bed is set larger than a distance between those of the inner lead portions which are disposed in the other position. The bonding pads are electrically connected to the inner lead portions by means of bonding wires. The pellet, bed, inner lead portions and bonding wires are sealed into a plastic package.