Abstract: A parking assist system includes: an actuator that drives a back door of a vehicle; an opening degree control unit that controls an opening degree of the back door by controlling the actuator; a storage device that stores an allowable opening degree of the back door at a park position of the vehicle in association with the park position; and a position information acquisition unit that acquires position information of the vehicle. When a position of the vehicle corresponds to the park position stored in the storage device, the opening degree control unit limits the opening degree of the back door on the basis of the allowable opening degree of the back door, stored in the storage device in association with the park position.

Abstract: With respect to fiber-reinforced plastics in which a base member is at least partially reinforced with a continuous fiber-reinforced resin member, there is provided a fiber-reinforced plastic in which the continuous fibers forming the continuous fiber-reinforced resin member do not bend, and, further, the base member and the continuous fiber-reinforced resin member are made to favorably adhere to each other, as well as a method of producing same. Provided is a fiber-reinforced plastic in which at least a portion of the base member is laminated with, as a reinforcement member, the continuous fiber-reinforced resin member. An adhesion layer comprising a thermoplastic resin is present between the base member and the reinforcement member, the adhesion layer making the two adhere to each other.

Abstract: A substrate processing apparatus according to the present disclosure includes first and second nozzles that eject a processing liquid to a substrate; a moving mechanism that moves the first and second nozzles; and a nozzle cleaning device that cleans at least the second nozzle. The nozzle cleaning device includes a cleaning bath and an overflow bath. The cleaning bath includes a liquid storage portion that stores a cleaning liquid for cleaning the second nozzle, and an overflow portion that discharges the cleaning liquid exceeding a predetermined level from the liquid storage portion. The overflow bath is disposed adjacent to the cleaning bath and receives the cleaning liquid discharged from the overflow portion and discharge the received cleaning liquid to the outside.

Abstract: A specimen analysis system, a specimen analyzer, and a specimen analysis method are provided by which reexamination of a specimen can be executed more quickly than in conventional technology. A specimen analyzer measures a specimen and obtains an analysis result. The specimen analyzer determines the necessity of remeasurement of the specimen, based on a specimen analysis result. Also, the specimen analyzer determines, based on the specimen analysis result, whether or not determination of the necessity of remeasurement of the specimen based on examination information by the examination information management device is necessary. If it is determined that determination of the necessity of remeasurement of the specimen based on the examination information is necessary, the specimen analyzer makes a request to determine the necessity of remeasurement of the specimen based on the examination information, to the examination information management device.

Abstract: A parking assist system includes: an actuator that drives a back door of a vehicle; an opening degree control unit that controls an opening degree of the back door by controlling the actuator; a storage device that stores an allowable opening degree of the back door at a park position of the vehicle in association with the park position; and a position information acquisition unit that acquires position information of the vehicle. When a position of the vehicle corresponds to the park position stored in the storage device, the opening degree control unit limits the opening degree of the back door on the basis of the allowable opening degree of the back door, stored in the storage device in association with the park position.

Abstract: With respect to fiber-reinforced plastics in which a base member is at least partially reinforced with a continuous fiber-reinforced resin member, there is provided a fiber-reinforced plastic in which the continuous fibers forming the continuous fiber-reinforced resin member do not bend, and, further, the base member and the continuous fiber-reinforced resin member are made to favorably adhere to each other, as well as a method of producing same. Provided is a fiber-reinforced plastic in which at least a portion of the base member is laminated with, as a reinforcement member, the continuous fiber-reinforced resin member. An adhesion layer comprising a thermoplastic resin is present between the base member and the reinforcement member, the adhesion layer making the two adhere to each other.

Abstract: An electronic component achieves reduced variations in the mounting positions of elements even with variations in the size of solder bumps and easily supports finer pitches of the bumps. The electronic component includes a common substrate, at least two elements mounted on a first main surface of the common substrate, a conductive pattern provided on the first main surface of the common substrate so as to extend in a direction along which the at least two elements are disposed adjacent to each other and including a plurality of lands arranged at positions corresponding to terminals of the elements insulating films provided at least on the conductive pattern so as to be spaced apart from both side edges of the lands in a direction perpendicular or substantially perpendicular to a land extending direction and adjacent to both ends of the lands in the land extending direction, and solder bumps that are disposed on the lands and are arranged to connect the lands and the terminals of the elements.

Abstract: A substrate heating apparatus includes a top plate arranged above a hot plate so that a vertical space is formed between the hot plate and the top plate. The top plate has an evacuated internal chamber serving as a vacuum insulating layer that suppresses heat transfer from a first surface of the top plate facing the hot plate to a second surface of the top plate opposite to the first surface. When heating the substrate, a gas flow flowing through the space between the hot plate and the top plate is generated.

Abstract: Provided is a metal colloid having higher visibility and higher sensitivity than a gold colloid and a Au-core Pt-shell composite colloid and suitable as a labeling agent for use in a test such as an immunoassay. An alloyed Au/Pt composite colloid formed by mixing a gold salt and a platinum salt with at least one reducing agent selected from the group consisting of an amino acid and a derivative thereof, an oligopeptide and a derivative thereof, and an amino sugar in the presence of an alkali, thereby reducing the gold salt and platinum salt.

Abstract: A substrate heating apparatus includes a top plate arranged above a hot plate so that a vertical space is formed between the hot plate and the top plate. The top plate has an evacuated internal chamber serving as a vacuum insulating layer that suppresses heat transfer from a first surface of the top plate facing the hot plate to a second surface of the top plate opposite to the first surface. When heating the substrate, a gas flow flowing through the space between the hot plate and the top plate is generated.

Abstract: In a heat treatment method in which a semiconductor wafer is carried into a heat treatment chamber constituted of a heat plate and a cover body covering the heat plate and processed, until the wafer is carried into the heat treatment chamber, an opening and closing operation of the cover body is performed to maintain the accumulated heat temperature of the heat treatment chamber at a prescribed processing temperature.

Abstract: A boundary acoustic wave element includes an IDT electrode arranged at the interface between a piezoelectric substance and a dielectric layer, a heat dissipation film is arranged on the outer side surface of the dielectric layer or on the outer side surface of a sound-absorbing film laminated on the outer side of the dielectric layer, the heat dissipation film is arranged to have a portion that overlaps the IDT electrode in plan view, and the heat dissipation film is connected to a bump provided on the outer side surface of the sound-absorbing film, and is connected to a via-hole conductor that extends through the sound-absorbing film. The boundary acoustic wave element and a boundary acoustic wave device are excellent in a heat dissipation property and hence can provide enhanced electric power resistance, without causing an increase in chip size and an increase in the area of the mounting space.

Abstract: An image pickup device includes a display that displays one of image data including an operation menu or operation key image data representing operation keys; an external output section that outputs the image data including the operation menu to the outside; an output state detector that detects that the external output section is in a state capable of outputting the image data to the outside; a display data instruction section that instructs to display the operation key image data on the display and to display the image data including the operation menu on an external display device, which is an output destination of the image data in the external output section, when the external output section is detected to be in the capable state, and instructs to display the image data including the operation menu on the display when the external output section is not detected to be in the capable state; a display data supply that supplies one of the display or the external output section with one of the image data incl

Abstract: A substrate heating apparatus includes a top plate arranged above a hot plate so that a vertical space is formed between the hot plate and the top plate. The top plate has an evacuated internal chamber serving as a vacuum insulating layer that suppresses heat transfer from a first surface of the top plate facing the hot plate to a second surface of the top plate opposite to the first surface. When heating the substrate, a gas flow flowing through the space between the hot plate and the top plate is generated.

Abstract: A substrate heating apparatus includes a top plate arranged above a hot plate so that a vertical space is formed between the hot plate and the top plate. The top plate has an evacuated internal chamber serving as a vacuum insulating layer that suppresses heat transfer from a first surface of the top plate facing the hot plate to a second surface of the top plate opposite to the first surface. When heating the substrate, a gas flow flowing through the space between the hot plate and the top plate is generated.

Abstract: A substrate heating apparatus includes a top plate arranged above a hot plate so that a vertical space is formed between the hot plate and the top plate. The top plate has an evacuated internal chamber serving as a vacuum insulating layer that suppresses heat transfer from a first surface of the top plate facing the hot plate to a second surface of the top plate opposite to the first surface. When heating the substrate, a gas flow flowing through the space between the hot plate and the top plate is generated.

Abstract: An electronic component achieves reduced variations in the mounting positions of elements even with variations in the size of solder bumps and easily supports finer pitches of the bumps. The electronic component includes a common substrate, at least two elements mounted on a first main surface of the common substrate, a conductive pattern provided on the first main surface of the common substrate so as to extend in a direction along which the at least two elements are disposed adjacent to each other and including a plurality of lands arranged at positions corresponding to terminals of the elements insulating films provided at least on the conductive pattern so as to be spaced apart from both side edges of the lands in a direction perpendicular or substantially perpendicular to a land extending direction and adjacent to both ends of the lands in the land extending direction, and solder bumps that are disposed on the lands and are arranged to connect the lands and the terminals of the elements.

Abstract: A boundary acoustic wave element includes an IDT electrode arranged at the interface between a piezoelectric substance and a dielectric layer, a heat dissipation film is arranged on the outer side surface of the dielectric layer or on the outer side surface of a sound-absorbing film laminated on the outer side of the dielectric layer, the heat dissipation film is arranged to have a portion that overlaps the IDT electrode in plan view, and the heat dissipation film is connected to a bump provided on the outer side surface of the sound-absorbing film, and is connected to a via-hole conductor that extends through the sound-absorbing film. The boundary acoustic wave element and a boundary acoustic wave device are excellent in a heat dissipation property and hence can provide enhanced electric power resistance, without causing an increase in chip size and an increase in the area of the mounting space.

Abstract: Image data of a document generated by a key business terminal or a key business server is sent to a database management server, and this image data and the description contents of the document represented by this image data are stored to a freight tracking information database base. Image data and data of the description contents of the document stored in the freight tracking information database are viewed or searched by an authenticated operator who operates a user terminal. Image data representing the progress of transport of goods is sent to the user terminal from the database management server according to the operator's instruction, and an image represented by this image data is displayed by the user terminal.

Abstract: In a heat treatment method in which a semiconductor wafer is carried into a heat treatment chamber constituted of a heat plate and a cover body covering the heat plate and processed, until the wafer is carried into the heat treatment chamber, an opening and closing operation of the cover body is performed to maintain the accumulated heat temperature of the heat treatment chamber at a prescribed processing temperature.