Patents by Inventor Tetsuya SUEYOSHI

Tetsuya SUEYOSHI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10256170
    Abstract: An electronic device for a vehicle includes a substrate and a semiconductor package. The substrate is arranged to extend along a flowing path of wind produced by a fan unit. The semiconductor package is disposed on the substrate to be cooled by the wind. When an inflow port from which the wind is drawn by the fan unit is defined to include a flowing path having a first cross-section area, the semiconductor package is disposed in a space including a flowing path having a cross-section area that is larger than the first cross-section area.
    Type: Grant
    Filed: December 21, 2015
    Date of Patent: April 9, 2019
    Assignee: DENSO CORPORATION
    Inventors: Tetsuya Sueyoshi, Hiroaki Ando
  • Publication number: 20170352608
    Abstract: An electronic device for a vehicle includes a substrate and a semiconductor package. The substrate is arranged to extend along a flowing path of wind produced by a fan unit. The semiconductor package is disposed on the substrate to be cooled by the wind. When an inflow port from which the wind is drawn by the fan unit is defined to include a flowing path having a first cross-section area, the semiconductor package is disposed in a space including a flowing path having a cross-section area that is larger than the first cross-section area.
    Type: Application
    Filed: December 21, 2015
    Publication date: December 7, 2017
    Inventors: Tetsuya SUEYOSHI, Hiroaki ANDO
  • Patent number: 9723731
    Abstract: A vehicular electronic device has a semiconductor package and a multilayer wiring board. An electrode pad of the multilayer wiring board, to which a signal terminal of the semiconductor package is soldered, has a wiring pattern in an inner layer of the multilayer wiring board. A solder resist is applied and spaced from a periphery of the electrode pad to the exterior. The signal terminal is soldered to the electrode pad to cover an upper surface and an upper end of a side surface of the electrode pad. As a result, a crack is less likely to occur in solder connected to the signal terminal. Therefore, the signal terminal can be electrically connected with high reliability even when the signal terminal is provided in the semiconductor package with a small number.
    Type: Grant
    Filed: April 3, 2014
    Date of Patent: August 1, 2017
    Assignee: DENSO CORPORATION
    Inventors: Hiroaki Ando, Kiminobu Inayoshi, Tetsuichi Takeuchi, Naoto Makino, Tetsuya Sueyoshi, Kenichi Katoh, Keisuke Nishio
  • Patent number: 9591786
    Abstract: An electronic device for a vehicle includes: a digital substrate having a first semiconductor package with a CPU, a second semiconductor package with a volatile memory readable and writable from the CPU, a third semiconductor package with a flash memory storing a start-up program of the CPU, and a fourth semiconductor package with a power supply management integrated circuit; and a fan that takes in air along the surface of the digital substrate on which the first to fourth semiconductor packages are mounted. The third semiconductor package is disposed to distance from the first semiconductor package by at least a first predetermined distance and to distance from the fourth semiconductor package by at least a second predetermined distance exceeding the first predetermined distance, and is disposed in a passage of the air taken in by the fan.
    Type: Grant
    Filed: November 8, 2013
    Date of Patent: March 7, 2017
    Assignee: DENSO CORPORATION
    Inventors: Tetsuya Sueyoshi, Tsubasa Kawashita, Ichiro Yoshida, Kiyohiko Sawada
  • Publication number: 20160066439
    Abstract: A vehicular electronic device has a semiconductor package and a multilayer wiring board. An electrode pad of the multilayer wiring board, to which a signal terminal of the semiconductor package is soldered, has a wiring pattern in an inner layer of the multilayer wiring board. A solder resist is applied and spaced from a periphery of the electrode pad to the exterior. The signal terminal is soldered to the electrode pad to cover an upper surface and an upper end of a side surface of the electrode pad. As a result, a crack is less likely to occur in solder connected to the signal terminal. Therefore, the signal terminal can be electrically connected with high reliability even when the signal terminal is provided in the semiconductor package with a small number.
    Type: Application
    Filed: April 3, 2014
    Publication date: March 3, 2016
    Inventors: Hiroaki ANDO, Kiminobu INAYOSHI, Tetsuichi TAKEUCHI, Naoto MAKINO, Tetsuya SUEYOSHI, Kenichi KATOH, Keisuke NISHIO
  • Publication number: 20150382502
    Abstract: An electronic device for a vehicle includes: a digital substrate having a first semiconductor package with a CPU, a second semiconductor package with a volatile memory readable and writable from the CPU, a third semiconductor package with a flash memory storing a start-up program of the CPU, and a fourth semiconductor package with a power supply management integrated circuit; and a fan that takes in air along the surface of the digital substrate on which the first to fourth semiconductor packages are mounted. The third semiconductor package is disposed to distance from the first semiconductor package by at least a first predetermined distance and to distance from the fourth semiconductor package by at least a second predetermined distance exceeding the first predetermined distance, and is disposed in a passage of the air taken in by the fan.
    Type: Application
    Filed: November 8, 2013
    Publication date: December 31, 2015
    Inventors: Tetsuya SUEYOSHI, Tsubasa KAWASHITA, Ichiro YOSHIDA, Kiyohiko SAWADA