Patents by Inventor Tetsuya Takeuti

Tetsuya Takeuti has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6575230
    Abstract: According to the present invention, a cooling apparatus using boiling and condensing refrigerant, includes a fluid separating plate for separating a high-temperature fluid from a low-temperature fluid, a refrigerant tank disposed on the side of the high-temperature fluid from the fluid separating plate, a refrigerant sealed into the refrigerant tank, a pair of communication pipes, one end of which is communicated with the refrigerant tank hermetically, a condensing portion communicated with the other end of the communication pipes and disposed on the side of the low-temperature fluid from the fluid separating plate, and a heat insulating material as a high-temperature portion-side heat insulating material coated on the outer periphery of the high-temperature-side communication pipe. In this way, it is possible to suppress a heat conduction from a high-temperature portion (high-temperature air) to the high-temperature-side communication pipe.
    Type: Grant
    Filed: December 20, 1999
    Date of Patent: June 10, 2003
    Assignee: Denso Corporation
    Inventors: Shigeru Kadota, Kiyoshi Kawaguchi, Tetsuya Takeuti, Kazuo Kobayashi, Takahide Ohara, Masahiko Suzuki, Hajime Sugito, Junichi Semura
  • Patent number: 6119767
    Abstract: According to the present invention, a cooling apparatus using boiling and condensing refrigerant, includes a fluid separating plate for separating a high-temperature fluid from a low-temperature fluid, a refrigerant tank disposed on the side of the high-temperature fluid from the fluid separating plate, a refrigerant sealed into the refrigerant tank, a pair of communication pipes, one end of which is communicated with the refrigerant tank hermetically, a condensing portion communicated with the other end of the communication pipes and disposed on the side of the low-temperature fluid from the fluid separating plate, and a heat insulating material as a high-temperature portion-side heat insulating material coated on the outer periphery of the high-temperature-side communication pipe. In this way, it is possible to suppress a heat conduction from a high-temperature portion (high-temperature air) to the high-temperature-side communication pipe.
    Type: Grant
    Filed: January 28, 1997
    Date of Patent: September 19, 2000
    Assignee: Denso Corporation
    Inventors: Shigeru Kadota, Kiyoshi Kawaguchi, Tetsuya Takeuti, Kazuo Kobayashi, Takahide Ohara, Masahiko Suzuki, Hajime Sugito, Junichi Semura