Patents by Inventor Tetsuyuki SHIRAKAWA
Tetsuyuki SHIRAKAWA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11667817Abstract: A conductive film includes an elongated release film and a plurality of conductive adhesive film pieces provided on the release film. Then, the plurality of adhesive film pieces are arranged in a longitudinal direction X of the release film. For this reason, the adhesive film piece can be set to an arbitrary shape. Accordingly, it is possible to attach the adhesive film piece to adhesive surfaces having various shapes and to efficiently use the adhesive film piece.Type: GrantFiled: September 26, 2017Date of Patent: June 6, 2023Assignee: Showa Denko Materials Co., Ltd.Inventors: Takashi Tatsuzawa, Kazuya Matsuda, Yutaka Tsuchida, Takashi Seki, Mitsuyoshi Shimamura, Kengo Shinohara, Tetsuyuki Shirakawa, Yasunori Kawabata, Satoru Matsumoto
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Publication number: 20230137299Abstract: A conductive film includes an elongated release film and a plurality of conductive adhesive film pieces provided on the release film. Then, the plurality of adhesive film pieces are arranged in a longitudinal direction X of the release film. For this reason, the adhesive film piece can be set to an arbitrary shape. Accordingly, it is possible to attach the adhesive film piece to adhesive surfaces having various shapes and to efficiently use the adhesive film piece.Type: ApplicationFiled: December 28, 2022Publication date: May 4, 2023Inventors: Takashi TATSUZAWA, Kazuya MATSUDA, Yutaka TSUCHIDA, Takashi SEKI, Mitsuyoshi SHIMAMURA, Kengo SHINOHARA, Tetsuyuki SHIRAKAWA, Yasunori KAWABATA, Satoru MATSUMOTO
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Publication number: 20230002644Abstract: A method of producing a connected body, containing: disposing an adhesive film between a first electronic member having a first electronic electrode and a second electronic member having a second electrode; and pressure-bonding the second electronic member to the first electronic member via the adhesive film so that the second electrode is electrically connected to the first electrode; wherein the first electronic member has an indented surface, the first electrode is provided in a depressed portion of the indented surface, the second electrode has a substantially flat surface having an area larger than an area of the first electrode, the adhesive film contains: first conductive particles that are dendritic conductive particles; and second conductive particles containing a non-conductive core and a conductive layer provided on the core, and the second conductive particles have an average particle diameter of not less than a depth of the depressed portion.Type: ApplicationFiled: December 3, 2020Publication date: January 5, 2023Inventors: Tetsuyuki SHIRAKAWA, Hiroyuki IZAWA, Takuya MORI, Kenta KIKUCHI
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Publication number: 20220363958Abstract: One aspect of the present invention relates to an adhesive composition used for connecting electronic members, the adhesive composition comprising: a first conductive particle that is a conductive particle having a projection capable of penetrating an oxide film formed on a surface of an electrode of the electronic member; and second conductive particle that is a conductive particle other than the first conductive particle, the second conductive particle having a nonconductive core body and a conductive layer provided on the core body.Type: ApplicationFiled: August 1, 2022Publication date: November 17, 2022Inventors: Tetsuyuki SHIRAKAWA, Satoru MATSUMOTO, Yusuke ASAKAWA, Tatsuya KUMADA, Takahiro FUKUI
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Patent number: 11414573Abstract: One aspect of the present invention relates to an adhesive composition used for connecting electronic members, the adhesive composition comprising: a first conductive particle that is a conductive particle having a projection capable of penetrating an oxide film formed on a surface of an electrode of the electronic member; and second conductive particle that is a conductive particle other than the first conductive particle, the second conductive particle having a nonconductive core body and a conductive layer provided on the core body.Type: GrantFiled: August 29, 2017Date of Patent: August 16, 2022Assignee: SHOWA DENKO MATERIALS CO., LTD.Inventors: Tetsuyuki Shirakawa, Satoru Matsumoto, Yusuke Asakawa, Tatsuya Kumada, Takahiro Fukui
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Patent number: 11355469Abstract: One aspect of the invention is a method of manufacturing a connection structure, including disposing an adhesive layer between a first electronic member including a first substrate and a first electrode formed on the first substrate and a second electronic member including a second substrate and a second electrode formed on the second substrate, and pressure-bonding the first electronic member and the second electronic member via the adhesive layer such that the first electrode and the second electrode are electrically connected to each other, wherein the first electronic member further including an insulating layer formed on a side of the first electrode opposite to the first substrate, and the adhesive layer including: a first conductive particle being a dendritic conductive particle; and a second conductive particle being a conductive particle other than the first conductive particle and having a non-conductive core and a conductive layer provided on the core.Type: GrantFiled: December 27, 2018Date of Patent: June 7, 2022Assignee: Showa Denko Materials Co., Ltd.Inventors: Tetsuyuki Shirakawa, Takahiro Fukui, Shinnosuke Iwamoto
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Patent number: 11342303Abstract: This member connection method includes: a cutting step of forming cutting lines C in an adhesive layer at predetermined intervals at least in a width direction of an adhesive tape and making segments of the adhesive layer divided by the cutting lines C continuous at least in a lengthwise direction of the adhesive tape; a transfer step of disposing the segments to face a connection surface of one member to be connected, pressing a heating and pressing tool having an arbitrary pattern shape against the adhesive tape from a separator side and selectively transferring the segments to the one member to be connected; and a connection step for connecting another member to be connected to the one member to be connected via the segments transferred to the one member to be connected.Type: GrantFiled: January 31, 2019Date of Patent: May 24, 2022Assignee: Showa Denko Materials Co., Ltd.Inventor: Tetsuyuki Shirakawa
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Patent number: 11319466Abstract: One aspect of the present invention is an adhesive film comprising: a first adhesive layer comprising a first adhesive component, a first conductive particle that is a dendritic conductive particle, and a second conductive particle that is a conductive particle other than the first conductive particle, the second conductive particle comprising a nonconductive core body and a conductive layer provided on the core body; and a second adhesive layer comprising a second adhesive component, wherein a volume proportion of the second adhesive component in the second adhesive layer is larger than a volume proportion of the first adhesive component in the first adhesive layer.Type: GrantFiled: February 14, 2018Date of Patent: May 3, 2022Assignee: SHOWA DENKO MATERIALS CO., LTD.Inventors: Tetsuyuki Shirakawa, Hiroyuki Izawa, Tatsuya Kumada
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Patent number: 11242472Abstract: One aspect of the present invention is an adhesive film comprising a first adhesive layer comprising a first conductive particle that is a dendritic conductive particle; and a second adhesive layer containing a second conductive particle that is a conductive particle other than the first conductive particle, the second conductive particle comprising a nonconductive core body and a conductive layer provided on the core body.Type: GrantFiled: February 14, 2018Date of Patent: February 8, 2022Assignee: SHOWA DENKO MATERIALS CO., LTD.Inventors: Tetsuyuki Shirakawa, Hiroyuki Izawa, Takahiro Fukui, Tatsuya Kumada
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Publication number: 20210074674Abstract: This member connection method includes: a cutting step of forming cutting lines C in an adhesive layer at predetermined intervals at least in a width direction of an adhesive tape and making segments of the adhesive layer divided by the cutting lines C continuous at least in a lengthwise direction of the adhesive tape; a transfer step of disposing the segments to face a connection surface of one member to be connected, pressing a heating and pressing tool having an arbitrary pattern shape against the adhesive tape from a separator side and selectively transferring the segments to the one member to be connected; and a connection step for connecting another member to be connected to the one member to be connected via the segments transferred to the one member to be connected.Type: ApplicationFiled: January 31, 2019Publication date: March 11, 2021Inventor: Tetsuyuki SHIRAKAWA
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Publication number: 20210017427Abstract: One aspect of the present invention is an adhesive film comprising: a first adhesive layer; a metal layer; and a second adhesive layer in this order, wherein each of the first adhesive layer and the second adhesive layer comprises: a first conductive particle being a dendritic conductive particle; and a second conductive particle being a conductive particle other than the first conductive particle and the second conductive particle comprising a non-conductive core and a conductive layer provided on the core.Type: ApplicationFiled: December 27, 2018Publication date: January 21, 2021Inventors: Tetsuyuki SHIRAKAWA, Shinnosuke IWAMOTO, Takahiro FUKUI
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Publication number: 20200321305Abstract: One aspect of the invention is a method of manufacturing a connection structure, including disposing an adhesive layer between a first electronic member including a first substrate and a first electrode formed on the first substrate and a second electronic member including a second substrate and a second electrode formed on the second substrate, and pressure-bonding the first electronic member and the second electronic member via the adhesive layer such that the first electrode and the second electrode are electrically connected to each other, wherein the first electronic member further including an insulating layer formed on a side of the first electrode opposite to the first substrate, and the adhesive layer including: a first conductive particle being a dendritic conductive particle; and a second conductive particle being a conductive particle other than the first conductive particle and having a non-conductive core and a conductive layer provided on the core.Type: ApplicationFiled: December 27, 2018Publication date: October 8, 2020Inventors: Tetsuyuki SHIRAKAWA, Takahiro FUKUI, Shinnosuke IWAMOTO
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Publication number: 20190367783Abstract: One aspect of the present invention is an adhesive film comprising: a first adhesive layer comprising a first adhesive component, a first conductive particle that is a dendritic conductive particle, and a second conductive particle that is a conductive particle other than the first conductive particle, the second conductive particle comprising a nonconductive core body and a conductive layer provided on the core body; and a second adhesive layer comprising a second adhesive component, wherein a volume proportion of the second adhesive component in the second adhesive layer is larger than a volume proportion of the first adhesive component in the first adhesive layer.Type: ApplicationFiled: February 14, 2018Publication date: December 5, 2019Inventors: Tetsuyuki SHIRAKAWA, Hiroyuki IZAWA, Tatsuya KUMADA
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Publication number: 20190367782Abstract: One aspect of the present invention is an adhesive film comprising a first adhesive layer comprising a first conductive particle that is a dendritic conductive particle; and a second adhesive layer containing a second conductive particle that is a conductive particle other than the first conductive particle, the second conductive particle comprising a nonconductive core body and a conductive layer provided on the core body.Type: ApplicationFiled: February 14, 2018Publication date: December 5, 2019Inventors: Tetsuyuki SHIRAKAWA, Hiroyuki IZAWA, Takahiro FUKUI, Tatsuya KUMADA
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Publication number: 20190241770Abstract: One aspect of the present invention relates to an adhesive composition used for connecting electronic members, the adhesive composition comprising: a first conductive particle that is a conductive particle having a projection capable of penetrating an oxide film formed on a surface of an electrode of the electronic member; and second conductive particle that is a conductive particle other than the first conductive particle, the second conductive particle having a nonconductive core body and a conductive layer provided on the core body.Type: ApplicationFiled: August 29, 2017Publication date: August 8, 2019Inventors: Tetsuyuki SHIRAKAWA, Satoru MATSUMOTO, Yusuke ASAKAWA, Tatsuya KUMADA, Takahiro FUKUI
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Publication number: 20190241771Abstract: A conductive film includes an elongated release film and a plurality of conductive adhesive film pieces provided on the release film. Then, the plurality of adhesive film pieces are arranged in a longitudinal direction X of the release film. For this reason, the adhesive film piece can be set to an arbitrary shape. Accordingly, it is possible to attach the adhesive film piece to adhesive surfaces having various shapes and to efficiently use the adhesive film piece.Type: ApplicationFiled: September 26, 2017Publication date: August 8, 2019Inventors: Takashi TATSUZAWA, Kazuya MATSUDA, Yutaka TSUCHIDA, Takashi SEKI, Mitsuyoshi SHIMAMURA, Kengo SHINOHARA, Tetsuyuki SHIRAKAWA, Yasunori KAWABATA, Satoru MATSUMOTO