Abstract: A magnetic sensor includes a substrate, and a magneto-resistive element portion which is provided on the substrate and has a predetermined magneto-sensitive direction, and in which a bias magnetic field is applied in a direction orthogonal or substantially orthogonal to the magneto-sensitive direction. The magneto-resistive element portion includes a magnetic layer having a negative magneto-striction constant, and stress-induced anisotropy of the magnetic layer develops in a direction parallel or substantially parallel to the direction of the bias magnetic field in response to a tensile stress act on the substrate in a direction parallel or substantially parallel to the magneto-sensitive direction.

Abstract: A magnetic sensor includes a substrate, and a magneto-resistive element portion which is provided on the substrate and has a predetermined magneto-sensitive direction, and in which a bias magnetic field is applied in a direction orthogonal or substantially orthogonal to the magneto-sensitive direction. The magneto-resistive element portion includes a magnetic layer having a negative magneto-striction constant, and stress-induced anisotropy of the magnetic layer develops in a direction parallel or substantially parallel to the direction of the bias magnetic field in response to a tensile stress act on the substrate in a direction parallel or substantially parallel to the magneto-sensitive direction.

Abstract: A magnetic substrate has such a shape that ridges extending between principal surfaces are cut away by cutout portions. A multilayer body has corners arranged so as to overlap the cutout portions. A coil includes lead portions which are connected with both ends of a coil portion and which are drawn out to the corners. A coil is combined with the coil to constitute a common mode choke coil and includes lead portions which are connected with both ends of a coil portion and which are drawn out to the corners. Connecting portions connect external electrodes to the lead portions and are provided at the cutout portion.

Abstract: A magnetic substrate has such a shape that ridges extending between principal surfaces are cut away by cutout portions. A multilayer body has corners arranged so as to overlap the cutout portions. A coil includes lead portions which are connected with both ends of a coil portion and which are drawn out to the corners. A coil is combined with the coil to constitute a common mode choke coil and includes lead portions which are connected with both ends of a coil portion and which are drawn out to the corners. Connecting portions connect external electrodes to the lead portions and are provided at the cutout portion.

Abstract: A magnetic substrate has such a shape that ridges extending between principal surfaces are cut away by cutout portions. A multilayer body has corners arranged so as to overlap the cutout portions. A coil includes lead portions which are connected with both ends of a coil portion and which are drawn out to the corners. A coil is combined with the coil to constitute a common mode choke coil and includes lead portions which are connected with both ends of a coil portion and which are drawn out to the corners. Connecting portions connect external electrodes to the lead portions and are provided at the cutout portion.

Abstract: A perforated-structure body having a plurality of apertures that penetrate from a first main surface to a second main surface of a perforated plate. Support substrates are stacked on at least one of the first main surface and the second main surface of the perforated plate so as to define a portion through which at least one of the apertures is exposed.

Abstract: A perforated-structure body having a plurality of apertures that penetrate from a first main surface to a second main surface of a perforated plate. Support substrates are stacked on at least one of the first main surface and the second main surface of the perforated plate so as to define a portion through which at least one of the apertures is exposed.

Abstract: A magnetic substrate has such a shape that ridges extending between principal surfaces are cut away by cutout portions. A multilayer body has corners arranged so as to overlap the cutout portions. A coil includes lead portions which are connected with both ends of a coil portion and which are drawn out to the corners. A coil is combined with the coil to constitute a common mode choke coil and includes lead portions which are connected with both ends of a coil portion and which are drawn out to the corners. Connecting portions connect external electrodes to the lead portions and are provided at the cutout portion.

Abstract: A semiconductor substrate is coupled to the upper side of a base. After the semiconductor substrate is processed, a lid material is anode-coupled to the semiconductor substrate. For the anode-coupling, first, the semiconductor substrate and the lid material are anode-coupled in a spot pattern. After this, the semiconductor substrate and the lid material are wholly anode-coupled to each other. Thereafter, the laminate including the base, the semiconductor substrate, and the lid material are divided and separated into predetermined individual areas. Thus, a vacuum container having a vacuum cavity formed inside of the laminate including the base layer, the semiconductor layer, and the lid layer can be formed. The vacuum degree of the vacuum cavity of the vacuum container is considerably enhanced compared to that by a conventional process of producing a vacuum container. In addition, scattering of the vacuum degrees of the vacuum cavities can be suppressed.

Abstract: An evacuated package with highly reliable vacuum-sealing and a method for producing an evacuated package with the evacuatable package. A lid portion is joined onto a substrate with an element accommodated in an evacuated space formed by the substrate and the lid portion. A connecting hole in the lid portion extends from the space to the top face of the lid portion. A metal film is formed around the complete peripheral region of the opening of the connecting hole, and a thermo-melting material is joined to the metal film to close the opening of the connecting hole so as to seal the element in the evacuated space. Before closing the opening of the connecting hole with the thermo-melting material, the space is evacuated, and simultaneously, the thermo-melting material is melted by heat and left until completely degassed in a vacuum.

Abstract: A semiconductor substrate is coupled to the upper side of a base. After the semiconductor substrate is processed, a lid material is anode-coupled to the semiconductor substrate. For the anode-coupling, first, the semiconductor substrate and the lid material are anode-coupled in a spot pattern. After this, the semiconductor substrate and the lid material are wholly anode-coupled to each other. Thereafter, the laminate including the base, the semiconductor substrate, and the lid material are divided and separated into predetermined individual areas. Thus, a vacuum container having a vacuum cavity formed inside of the laminate including the base layer, the semiconductor layer, and the lid layer can be formed. The vacuum degree of the vacuum cavity of the vacuum container is considerably enhanced compared to that by a conventional process of producing a vacuum container. In addition, scattering of the vacuum degrees of the vacuum cavities can be suppressed.