Patents by Inventor Thirumani Selvan

Thirumani Selvan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8359902
    Abstract: A gas sensor apparatus and method of forming the same generally includes a gas sensor element comprising a heater and a plurality of electrodes. A ceramic substrate can be provided for supporting the electrodes on one side of the ceramic substrate and the heater on the opposite side of the ceramic substrate. The gas sensor element is preferably embedded in the ceramic substrate. The ceramic substrate also possesses a substantially circular shape in order to prevent a breakage of the gas sensor element, avoid thermal loss, and permit the gas sensor apparatus to withstand mechanical shock and high vibrations while occupying a minimal package space.
    Type: Grant
    Filed: August 27, 2010
    Date of Patent: January 29, 2013
    Assignee: Honeywell International Inc.
    Inventors: Palani Thanigachalam, Thirumani A. Selvan
  • Publication number: 20100314249
    Abstract: A gas sensor apparatus and method of forming the same generally includes a gas sensor element comprising a heater and a plurality of electrodes. A ceramic substrate can be provided for supporting the electrodes on one side of the ceramic substrate and the heater on the opposite side of the ceramic substrate. The gas sensor element is preferably embedded in the ceramic substrate. The ceramic substrate also possesses a substantially circular shape in order to prevent a breakage of the gas sensor element, avoid thermal loss, and permit the gas sensor apparatus to withstand mechanical shock and high vibrations while occupying a minimal package space.
    Type: Application
    Filed: August 27, 2010
    Publication date: December 16, 2010
    Applicant: HONEYWELL INTERNATIONAL INC.
    Inventors: Palani Thanigachalam, Thirumani A. Selvan
  • Patent number: 7726197
    Abstract: A low cost force sensor package and a method of forming such a package. The force sensor has a housing or package, such as a surface mount technology package (SMT), and a piezo resistive silicon die, or other force sensing element, carried on the housing or package. An actuator is operably coupled to the force sensing element for transferring force to the sensing element in response to receiving a force from an external source. The force sensing element is configured to sense the external force and generate an output signal representing the force. A signal conditioner is also carried on the housing for receiving the output signal. When the signal conditioner is electrically coupled to the force sensing element, the signal conditioner can condition the output signal and generate a conditioned output.
    Type: Grant
    Filed: April 26, 2006
    Date of Patent: June 1, 2010
    Assignee: Honeywell International Inc.
    Inventors: Thirumani A. Selvan, Raghu Sanjee
  • Publication number: 20090288484
    Abstract: An integrated mechanical combi sensor apparatus and method for measuring humidity, pressure and temperature. A pressure sensor and an ASIC can be mounted in a first compartment, and a temperature sensor mounted in a second compartment of a housing. Similarly, a humidity sensor can be mounted in a third compartment such that the pressure sensor, temperature sensor, and humidity sensor are isolated from each other. The sensor element associated with the sensors and the ASIC can be connected to a lead frame terminal by wire bonding for electrical connection. A pressure cover and a humidity cover can be utilized for covering the pressure sensor and the humidity sensor. The humidity sensor can include a hydrophobic filter for preventing moisture-saturated air from reaching the sensing element in order to provide accurate sensor measurements thereof.
    Type: Application
    Filed: May 21, 2008
    Publication date: November 26, 2009
    Inventors: Thirumani Selvan, Saravanan Sadasivan
  • Patent number: 7430918
    Abstract: A MEMS based pressure sensor for flow measurements includes a pressure sense die located between a media seal and a conductive seal. Such a system includes a pressure sense die located between a media seal and a conductive seal. A sensing diaphragm is generally associated with the pressure sense die, wherein the sensing diaphragm deflects when a pressure is applied thereto. An impedance circuit is generally embedded with one or more resistors on the sensing diaphragm to which the pressure to be detected is applied. An ASIC is generally associated with the impedance circuit and the sense die, wherein the ASIC is placed on a lead frame for signal conditioning in order to detect a change in the pressure.
    Type: Grant
    Filed: December 4, 2006
    Date of Patent: October 7, 2008
    Assignee: Honeywell International Inc.
    Inventors: Thirumani A. Selvan, Saravanan Sadasivan
  • Publication number: 20080206107
    Abstract: A gas sensor apparatus and method of forming the same generally includes a gas sensor element comprising a heater and a plurality of electrodes. A ceramic substrate can be provided for supporting the electrodes on one side of the ceramic substrate and the heater on the opposite side of the ceramic substrate. The gas sensor element is preferably embedded in the ceramic substrate. The ceramic substrate also possesses a substantially circular shape in order to prevent a breakage of the gas sensor element, avoid thermal loss, and permit the gas sensor apparatus to withstand mechanical shock and high vibrations while occupying a minimal package space.
    Type: Application
    Filed: February 23, 2007
    Publication date: August 28, 2008
    Inventors: Palani Thanigachalam, Thirumani A. Selvan
  • Publication number: 20080127741
    Abstract: A MEMS based pressure sensor for flow measurements includes a pressure sense die located between a media seal and a conductive seal. Such a system includes a pressure sense die located between a media seal and a conductive seal. A sensing diaphragm is generally associated with the pressure sense die, wherein the sensing diaphragm deflects when a pressure is applied thereto. An impedance circuit is generally embedded with one or more resistors on the sensing diaphragm to which the pressure to be detected is applied. An ASIC is generally associated with the impedance circuit and the sense die, wherein the ASIC is placed on a lead frame for signal conditioning in order to detect a change in the pressure.
    Type: Application
    Filed: December 4, 2006
    Publication date: June 5, 2008
    Inventors: Thirumani A. Selvan, Saravanan Sadasivan
  • Publication number: 20070251328
    Abstract: A low cost force sensor package and a method of forming such a package. The force sensor has a housing or package, such as a surface mount technology package (SMT), and a piezo resistive silicon die, or other force sensing element, carried on the housing or package. An actuator is operably coupled to the force sensing element for transferring force to the sensing element in response to receiving a force from an external source. The force sensing element is configured to sense the external force and generate an output signal representing the force. A signal conditioner is also carried on the housing for receiving the output signal. When the signal conditioner is electrically coupled to the force sensing element, the signal conditioner can condition the output signal and generate a conditioned output.
    Type: Application
    Filed: April 26, 2006
    Publication date: November 1, 2007
    Inventors: Thirumani Selvan, Raghu Sanjee
  • Patent number: 7162927
    Abstract: The invention provides pressure sensors for use in wet environments. A pressure sensor package according to the invention has a housing having a pair of cavities separated by a wall member. Sequentially contained within one cavity is a conductive elastomeric seal pad, a pressure sensor and an elastomeric media seal. A pressure cap is attached to the housing such that the pressure cap and the housing together form a hermetic seal. The pressure cap has a port for admitting a gas under pressure into the first cavity. A signal amplifier is positioned within the second cavity and a cover encloses the signal amplifier within the second cavity. An electrical connector through the wall member forms an electrical connection between the pressure sensor and the signal amplifier. A lead frame extends through the housing and forms electrical connections with the pressure sensor and the signal amplifier.
    Type: Grant
    Filed: December 16, 2005
    Date of Patent: January 16, 2007
    Assignee: Honeywell International Inc.
    Inventors: Thirumani A. Selvan, Gururaj U. Shenoy, Saravanan Sadasivan, Raghavendra Muniraju