Patents by Inventor Thomas F. McCarthy

Thomas F. McCarthy has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7425214
    Abstract: Apparatus and method are described for interoperatively determining, during a trailing procedure conducted in connection with total hip arthroplasty, a combination of neck length and femoral head offset required in a femoral component for establishing appropriate hip mechanics in a prosthetic hip joint to be implanted at an implant site. A trial femoral head is coupled for selective movement relative to a femoral stem component to move the trial femoral head longitudinally and laterally relative to a predetermined direction among selected combinations of trial distance and trial offset to evaluate hip mechanics and determine interoperatively an appropriate combination of trial distance and trial offset corresponding to the combination of neck length and femoral head offset required in the prosthetic hip joint.
    Type: Grant
    Filed: March 3, 2005
    Date of Patent: September 16, 2008
    Assignee: Howmedica Osteonics Corp.
    Inventors: Thomas F. McCarthy, Christopher DeMaria, Jason R. Cahayla
  • Patent number: 6861092
    Abstract: A process for fabricating a low loss multilayer printed circuit board using a bonding ply comprising a fluoropolymer composite substrate and a thermosetting adhesive composition is disclosed. The fluoropolymer composite comprises at least one fluoropolymer and a substrate selected from woven fabrics, nonwoven fabrics and polymeric films.
    Type: Grant
    Filed: November 7, 2002
    Date of Patent: March 1, 2005
    Assignee: Tonoga, Inc.
    Inventors: Thomas F. McCarthy, David L. Wynants, Sr.
  • Patent number: 6858304
    Abstract: Novel polyindanebisphenols or PIBPs for the preparation of new and improved thermosetting polymers having the general formula of are provided. Also disclosed are thermoplastic or thermoset compositions prepared using the novel compounds of the invention, as well as methods of making and using the same. When copolymerized or reactive with other commercial resins such as, e.g., epoxy compounds, PIBP based polymers are characterized by high glass transition temperature (“Tg”), low dielectric constant, low moisture absorption, low coefficient of expansion, low cost, and can be processed on equipment typically used for the production of epoxy based laminates.
    Type: Grant
    Filed: June 5, 2002
    Date of Patent: February 22, 2005
    Assignee: Honeywell International Inc.
    Inventors: Thomas F. McCarthy, David Schwind, Gordon Smith
  • Patent number: 6783841
    Abstract: A process for fabricating a low loss multilayer printed circuit board using a bonding ply comprising a reinforced fluoropolymer composite and a high-flowing thermosetting adhesive composition is disclosed. The fluoropolymer composite comprises at least one fluoropolymer and a substrate selected from woven fabrics, nonwoven fabrics and polymeric films.
    Type: Grant
    Filed: May 29, 2003
    Date of Patent: August 31, 2004
    Assignee: Tonoga, Inc.
    Inventors: Thomas F. McCarthy, David L. Wynants, Sr.
  • Patent number: 6759131
    Abstract: A composition containing a non-flammable chlorofluoro-olefin copolymer having a crystallinity index less than about 10% and a weight-average molecular weight greater than about 1,000,000 daltons, wherein the copolymer has at least two comonomer units of the formula: CX2CYA wherein each X is independently selected from H, Cl and F; Y is selected from H, Cl, F, O(CZ2)nCZ3, (CZ2)nCZ3, (OCZ2CZ2)nCZ3 and (O(CZ2)n)nCZ3, wherein each n is independently from about 1 to about 12 and each Z is independently selected from H, Cl and F; and A is selected from H, Cl and F, provided that for at least one comonomer unit, at least one of A, Y, either X or any Z is Cl. Substrates coated with the copolymer compositions are also disclosed.
    Type: Grant
    Filed: February 1, 2002
    Date of Patent: July 6, 2004
    Assignee: Honeywell International Inc.
    Inventor: Thomas F. McCarthy
  • Publication number: 20030203174
    Abstract: A process for fabricating a low loss multilayer printed circuit board using a bonding ply comprising a reinforced fluoropolymer composite and a high-flowing thermosetting adhesive composition is disclosed. The fluoropolymer composite comprises at least one fluoropolymer and a substrate selected from woven fabrics, nonwoven fabrics and polymeric films.
    Type: Application
    Filed: May 29, 2003
    Publication date: October 30, 2003
    Applicant: TONOGA, INC.
    Inventors: Thomas F. McCarthy, David L. Wynants
  • Publication number: 20030072929
    Abstract: A process for fabricating a low loss multilayer printed circuit board using a bonding ply comprising a fluoropolymer composite substrate and a thermosetting adhesive composition is disclosed. The fluoropolymer composite comprises at least one fluoropolymer and a substrate selected from woven fabrics, nonwoven fabrics and polymeric films.
    Type: Application
    Filed: November 7, 2002
    Publication date: April 17, 2003
    Applicant: TONOGA, LTD
    Inventors: Thomas F. McCarthy, David L. Wynants
  • Publication number: 20030069384
    Abstract: Novel polyindanebisphenols or PIBPs for the preparation of new and improved thermosetting polymers having the general formula of 1
    Type: Application
    Filed: June 5, 2002
    Publication date: April 10, 2003
    Applicant: Honeywell International Inc.
    Inventors: Thomas F. McCarthy, David Schwind, Gordon Smith
  • Publication number: 20030008990
    Abstract: A composition containing a non-flammable chlorofluoro-olefin copolymer having a crystallinity index less than about 10% and a weight-average molecular weight greater than about 1,000,000 daltons, wherein the copolymer has at least two comonomer units of the formula:
    Type: Application
    Filed: February 1, 2002
    Publication date: January 9, 2003
    Inventor: Thomas F. McCarthy
  • Patent number: 6500529
    Abstract: A process for fabricating a low loss multilayer printed circuit board using a bonding ply comprising a fluoropolymer composite substrate and a thermosetting adhesive composition is disclosed. The fluoropolymer composite comprises at least one fluoropolymer and a substrate selected from woven fabrics, nonwoven fabrics and polymeric films.
    Type: Grant
    Filed: September 14, 2001
    Date of Patent: December 31, 2002
    Assignee: Tonoga, Ltd.
    Inventors: Thomas F. McCarthy, David L. Wynants, Sr.
  • Publication number: 20020123282
    Abstract: Food cooking belts and textile belts containing a woven reinforcement, a fluoropolymer, and an interpenetrating network of either a non-fluorinated thermoplastic or a non-fluorinated thermosetting polymer have improved wear resistance, better adhesion to the glass reinforcement, and improved puncture resistance. The non-fluorinated thermoplastic or thermoset is composed of a thermally stable polymer which is stable at temperatures at continuous operating temperatures of 250° C. (500° F.).
    Type: Application
    Filed: January 3, 2001
    Publication date: September 5, 2002
    Inventors: Thomas F. McCarthy, Richard Foster
  • Patent number: 6369178
    Abstract: A composition containing a non-flammable chlorofluoro-olefin copolymer having a crystallinity index less than about 10% and a weight-average molecular weight greater than about 1,000,000 daltons, wherein the copolymer has at least two comonomer units of the formula: CX2CYA wherein each X is independently selected from H, Cl and F; Y is selected from H, Cl, F, O(CZ2)nCZ3, (CZ2)nCZ3, (OCZ2CZ2)nCZ3 and (O(CZ2)n)nCZ3, wherein each n is independently from about 1 to about 12 and each Z is independently selected from H, Cl and F; and A is selected from H, Cl and F, provided that for at least one comonomer unit, at least one of A, Y, either X or any Z is Cl. Substrates coated with the copolymer compositions are also disclosed.
    Type: Grant
    Filed: December 23, 1998
    Date of Patent: April 9, 2002
    Assignee: AlliedSignal Inc.
    Inventor: Thomas F. McCarthy
  • Patent number: 6365684
    Abstract: The present invention provides a novel, optionally surfactant-free process for controlling particle number, particle size, and/or particle size distribution. The method of the invention also significantly improves monomer to polymer conversion rates, as well as, increases the level of polymer solids which can be emulsified/dispersed in water without polymer flocculation. Specifically, the improved process provides an aqueous dispersion of up to about 48% polymer solids in water in the absence of surfactant. The resulting fluoropolymers dispersions may be used in resin and coating applications.
    Type: Grant
    Filed: September 12, 2000
    Date of Patent: April 2, 2002
    Assignee: AlliedSignal Inc.
    Inventors: Thomas F. McCarthy, Yan Chen, Eric J. Rainal
  • Patent number: 6342572
    Abstract: The invention pertains to benzocyclobutene resins having flame retardant properties. Such resins have a high glass transition temperature (Tg>250° C.), low moisture absorption, low dielectric constant, good mechanical properties, flame retardancy (meets or exceeds UL94 V-O and/or VTM-O requirements), and can be cast onto a reinforcement to prepare a laminate for use as a substrate for electronic circuitry. The flame resistant compound is reaction product of a halogen containing compound of the formulae R&Parenopenst; DA)n or R&Parenopenst; DA&Parenclosest;n R2 wherein R is a halogen containing aromatic group, a halogen containing aliphatic group or a combination thereof; R2 is hydrogen, an aromatic group, an aliphatic group or an combination of an aromatic group and an aliphatic group which may contain halogen atoms; DA is a Diels-Alder reactive diene or a group that can act as a dienophile in a Diels-Alder reaction; and n is greater than or equal to 1; with a benzocyclobutene compound.
    Type: Grant
    Filed: December 28, 1999
    Date of Patent: January 29, 2002
    Assignee: Honeywell International Inc.
    Inventors: Michael W. Wagaman, Thomas F. McCarthy
  • Patent number: 6255384
    Abstract: The present invention provides a novel, optionally surfactant-free process for controlling particle number, particle size, and/or particle size distribution. The method of the invention also significantly improves monomer to polymer conversion rates, as well as, increases the level of polymer solids which can be emulsified/dispersed in water without polymer flocculation. Specifically, the improved process provides an aqueous dispersion of up to about 48% polymer solids in water in the absence of surfactant. The resulting fluoropolymers dispersions may be used in resin and coating applications.
    Type: Grant
    Filed: January 20, 1998
    Date of Patent: July 3, 2001
    Assignee: AlliedSignal, Inc.
    Inventors: Thomas F. McCarthy, Yan Chen, Eric J. Rainal
  • Patent number: 6153721
    Abstract: Novel polyindanebisphenols or PIBPs for the preparation of new and improved thermosetting polymers having the general formula of ##STR1## are provided. Also disclosed are thermoplastic or thermoset compositions prepared using the novel compounds of the invention, as well as methods of making and using the same. When copolymerized or reactive with other commercial resins such as, e.g., epoxy compounds, PIBP based polymers are characterized by high glass transition temperature ("Tg"), low dielectric constant, low moisture absorption, low coefficient of expansion, low cost, and can be processed on equipment typically used for the production of epoxy based laminates.
    Type: Grant
    Filed: February 26, 1998
    Date of Patent: November 28, 2000
    Assignee: Honeywell International Inc.
    Inventors: Thomas F. McCarthy, David B. Schwind, Gordon C. Smith
  • Patent number: 6140408
    Abstract: This invention relates to novel room temperature coalescable aqueous fluoropolymer dispersions and a process for their manufacture. These dispersions may be used in a variety of applications including high temperature thermoplastic coatings, polishes, room temperature formable paints and coatings, extrudable or injection moldable resins, and adhesives.
    Type: Grant
    Filed: December 9, 1998
    Date of Patent: October 31, 2000
    Inventors: Thomas F. McCarthy, Yan Chen, Peter Petersen
  • Patent number: 5955556
    Abstract: The present invention provides a novel, optionally surfactant-free process for controlling particle number, particle size, and/or particle size distribution. The method of the invention also significantly improves monomer to polymer conversion rates, as well as, increases the level of polymer solids which can be emulsified/dispersed in water without polymer flocculation. Specifically, the improved process provides an aqueous dispersion of up to about 48% polymer solids in water in the absence of surfactant. The resulting fluoropolymers dispersions may be used in resin and coating applications.
    Type: Grant
    Filed: October 31, 1996
    Date of Patent: September 21, 1999
    Assignee: AlliedSignal Inc.
    Inventors: Thomas F. McCarthy, Yan Chen, Eric J. Rainal
  • Patent number: 5880204
    Abstract: This invention relates to novel room temperature coalescable aqueous fluoropolymer dispersions and a process for their manufacture. These dispersions may be used in a variety of applications including high temperature thermoplastic coatings, polishes, room temperature formable paints and coatings, extrudable or injection moldable resins, and adhesives.
    Type: Grant
    Filed: September 20, 1996
    Date of Patent: March 9, 1999
    Assignee: Alliedsignal Inc.
    Inventors: Thomas F. McCarthy, Yan Chen, Peter Petersen
  • Patent number: 5549706
    Abstract: A femoral hip prosthesis comprises a main member, a modular member and a means for connecting the two. The main member has a stem portion and a body portion which are adapted for insertion into the intramedullary canal. The body portion has lateral, posterior, and anterior sides adapted to mate with the bone and has a medial side configured and dimensioned to receive a modular member. The modular member is chosen from a plurality of such members of various shapes and sizes and is adapted to fit accurately into the intramedullary canal, especially after the intramedullary canal has been deformed through the prior implantation of a prosthetic hip device.
    Type: Grant
    Filed: April 10, 1995
    Date of Patent: August 27, 1996
    Assignee: Howmedica Inc.
    Inventor: Thomas F. McCarthy