Abstract: Consistent with an aspect of the present disclosure, a flexible electrical interconnect connects a transmit receive optical subassembly (TROSA) with an integrated circuit package via a transmission line provided on a surface of a substrate upon which the integrated circuit is provided. Alternatively, the transmission line is embedded in the substrate. Mechanisms are provided to mechanically balance temperature induced stresses within the substrate and keep the substrate substantially planar and thus minimize damage to the integrated circuit and/or the electrical connections thereto.