Patents by Inventor Thomas J. Chintala
Thomas J. Chintala has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7486240Abstract: The disclosed embodiments provide devices and methods for securely retaining an antenna to a communications device. The disclosed embodiments include an antenna assembly connectable with a housing. The antenna assembly may include a connector having a connector body extending from a first end to a second end and thereby defining a longitudinal axis. The first end and the housing include at least one set of corresponding, irreversible engagement members movable one way from an unlocked position and a locked position. In the unlocked position the antenna assembly is movable along the longitudinal axis relative to the communications device, while in the locked position the antenna assembly is not movable along the longitudinal axis relative to the communications device. An antenna is securable relative to the connector body and is connectable with the communications device through an electrical conductor.Type: GrantFiled: October 12, 2004Date of Patent: February 3, 2009Assignee: QUALCOMM IncorporatedInventor: Thomas J. Chintala
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Patent number: 7210963Abstract: The described embodiments provide mobile electronic devices and associated methods for securely maintaining a connected relationship between device housings. These embodiments include a first housing having at least one first engagement portion and a second housing having at least one second engagement portion, where the second engagement portion is movable between a disconnected state and a connected state relative to the first engagement portion. Further, the second engagement portion is also movable a predetermined engagement distance. Additionally, a limiting structure is positionable adjacent to at least one of the first housing and the second housing such that the limiting structure prevents the second engagement portion from moving the predetermined engagement distance after achieving the connected state.Type: GrantFiled: October 12, 2004Date of Patent: May 1, 2007Assignee: Qualcomm IncorporatedInventors: Thomas J. Chintala, Scott R. Semenik
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Patent number: 7133222Abstract: The described embodiments provide devices and methods for securing a lens member in a mobile electronic device. The lens member is positionable between a front housing and a rear housing of the device such that inner surfaces of the housings both exert a biasing force on the lens member such that the lens member is substantially immovable relative to the inner surfaces. As such, the lens member is securely fixed within the housings and cannot be removed or separated from one or both housings without evidence of tampering.Type: GrantFiled: October 12, 2004Date of Patent: November 7, 2006Assignee: Qualcomm, Inc.Inventors: Thomas J. Chintala, Scott R. Semenik
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Patent number: 7077692Abstract: The described embodiments provide devices and methods for creating an electrical connection in an electronic system. The devices and methods include a standoff that connects a circuit element with a circuit board and supports the circuit element at a sufficient height above the circuit board to create an additional layout area. The additional layout area may be utilized to mount additional circuit elements to the circuit board.Type: GrantFiled: October 12, 2004Date of Patent: July 18, 2006Assignee: QUALCOMM IncorporatedInventor: Thomas J. Chintala
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Patent number: 6345097Abstract: A portable phone has a cavity at one end in which a hinge pin is rotatably mounted, with opposite ends of the hinge pin releasably secured to a flip panel rotatable between a closed position extending over part of one face of the phone, and an open position. The hinge pin includes a cam formation, and a biasing spring secured in the cavity has a bearing portion acting against the cam portion to releasably retain the flip panel in its open and closed positions. A cam retainer is mounted in the cavity to extend over the hinge pin and resist bending of the hinge pin out of a straight, axial orientation.Type: GrantFiled: December 7, 1998Date of Patent: February 5, 2002Assignee: QUALCOMM IncorporatedInventors: Thomas J. Chintala, Jose F. Olivas, Paul J. Smith, Sean Moran, James Beckwith
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Patent number: 6157717Abstract: A snap hinge assembly for rotatably connecting a flip cover to a portable phone housing has only two parts, a hinge pin and a spring. The hinge pin is rotatably mounted in the housing and secured to the cover so as to rotate with the cover as it is opened and closed, and has a cam portion for engaging the spring. The spring is anchored in the housing and has a bearing portion for bearing against the cam portion as the pin rotates with the cover. The shape of the cam portion is such that the bearing portion is resiliently biased as the hinge pin rotates, and released at a predetermined orientation so as to snap the cover into either the open or closed position, depending on the direction of rotation of the pin. The cover is held by the engaging spring and cam surfaces in the open or closed position until positively urged towards the opposite end position.Type: GrantFiled: March 19, 1998Date of Patent: December 5, 2000Assignee: Qualcomm IncorporatedInventors: Thomas J. Chintala, Jose F. Olivas, Martin J. Kimbell, Miguel A. Cano, Jr.
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Patent number: 6148079Abstract: A hinge apparatus has relatively rotatable first and second parts, one of which is adapted to be secured to the phone housing and the other of which is adapted to be secured to a cover. One of the parts comprises a cam and the other comprises a follower, the cam having end stops corresponding to an open and a closed position of the cover relative to the housing, and a convex surface between the end stops to provide initial resistance to rotation of the cover out of the open and closed positions. The parts are spring loaded such that the cover is snapped into the open and closed positions, respectively, once the follower passes the arcuate surface of the cam.Type: GrantFiled: March 19, 1998Date of Patent: November 14, 2000Assignee: Qualcomm IncorporatedInventors: Thomas J. Chintala, Jose F. Olivas, Martin J. Kimbell, Miguel A. Cano, Jr.
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Patent number: 5917708Abstract: An EMI shielding apparatus has an outer peripheral wall extending around a combined area of predetermined shape and dimensions for enclosing at least two adjacent areas on a printed wiring board to be shielded from one another. A single transverse wall extends between opposing portions of the peripheral wall to divide the combined area into the two adjacent sub-areas to be shielded from one another. The single transverse wall is of single wall thickness, reducing the EMI shield footprint. The peripheral wall and transverse wall may be formed integrally as one frame, or from two or more adjacent sub-frames.Type: GrantFiled: March 24, 1997Date of Patent: June 29, 1999Assignee: Qualcomm IncorporatedInventors: Sean A. Moran, Jose F. Olivas, Thomas J. Chintala
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Patent number: 5844784Abstract: A combined EMI shield and brace assembly has at least two frames for placing side-by-side on a printed wiring board to surround predetermined adjacent areas on the board containing components to be shielded from one another, and a brace member securing the two frames together during reflow. Each frame has a peripheral side wall forming an enclosed area of predetermined shape and dimensions and a portion of the side wall of one frame is placed against a portion of the side wall of the other frame so that the two frames together form an enlarged enclosed area divided into two sub-areas by the adjacent side wall portions extending across the enlarged area. The brace member extends over the frames and is secured to their side walls, and may secure two or more frames together.Type: GrantFiled: March 24, 1997Date of Patent: December 1, 1998Assignee: Qualcomm IncorporatedInventors: Sean A. Moran, Jose F. Olivas, Thomas J. Chintala
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Patent number: D511507Type: GrantFiled: January 14, 2004Date of Patent: November 15, 2005Assignee: Qualcomm, Inc.Inventors: Thomas J. Chintala, Douglas Howard Moe, Ramin Moallemi, Kimberly Meyer Koro, Gregory Paul Heinzinger, Joel Gordon Delman, Scott R. Semenik
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Patent number: D515317Type: GrantFiled: January 14, 2004Date of Patent: February 21, 2006Assignee: Qualcomm IncorporatedInventors: Thomas J. Chintala, Scott C. Asbill, Joel Gordon Delman, Scott R. Semenik
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Patent number: D550219Type: GrantFiled: June 18, 2004Date of Patent: September 4, 2007Assignee: Qualcomm IncorporatedInventors: Thomas J. Chintala, Clifton E. Scott, Gregory Paul Heinzinger, Jason C. Baron, Mark R. Gartz, Paul Barnier, Scott R. Semenik, Kam Cheong Anthony Tsoi
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Patent number: D375740Type: GrantFiled: December 1, 1995Date of Patent: November 19, 1996Assignee: Qualcomm IncorporatedInventors: Steven A. Mergenthaler, Dawn E. Beattie, Paul E. Jacobs, Daniel Waldburger, Thomas J. Chintala, Stephen G. Miggels, David C. Stowers
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Patent number: D386186Type: GrantFiled: February 26, 1996Date of Patent: November 11, 1997Assignee: Qualcomm IncorporatedInventors: Michel W. Schnetzer, Clinton J. Wilber, Paul E. Jacobs, Thomas J. Chintala, Thomas J. Neppl
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Patent number: D407701Type: GrantFiled: March 6, 1997Date of Patent: April 6, 1999Assignee: Qualcomm IncorporatedInventors: Thomas J. Chintala, Dawn E. Beattie, Paul E. Jacobs, Gina M. Lombardi, John E. Maloney, Stanley T. Scheufler, John J. Wendorff, Stephen G. Miggels, David C. Stowers
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Patent number: D409561Type: GrantFiled: October 24, 1997Date of Patent: May 11, 1999Assignee: Qualcomm IncorporatedInventors: Thomas J. Chintala, Dawn E. Beattie, Paul E. Jacobs, Gina M. Lombardi, John E. Maloney, Stanley T. Scheufler, John J. Wendorff, Stephen G. Miggels, David C. Stowers
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Patent number: D410893Type: GrantFiled: March 12, 1998Date of Patent: June 15, 1999Assignee: QUALCOMM IncorporatedInventors: Thomas J. Chintala, Dawn E. Beattie, Paul E. Jacobs, Gina M. Lombardi, John E. Maloney, Stanley Scheufler, John J. Wendorff, Stephen G. Miggels, David C. Stowers
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Patent number: D412483Type: GrantFiled: October 24, 1997Date of Patent: August 3, 1999Assignee: Qualcomm IncorporatedInventors: Thomas J. Chintala, Dawn E. Beattie, Paul E. Jacobs, Gina M. Lombardi, John E. Maloney, Jeffrey J. Rhine, Stanley T. Scheufler, John J. Wendorff, Stephen G. Miggels, David C. Stowers
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Patent number: D413117Type: GrantFiled: February 20, 1998Date of Patent: August 24, 1999Assignee: Qualcomm IncorporatedInventors: Thomas J. Chintala, Jose F. Olivas, Paul E. Jacobs, Gina M. Lombardi, Robert W. Howe, Stanley T. Scheufler, John J. Wendorff, Stephen G. Miggels, David C. Stowers
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Patent number: D429210Type: GrantFiled: March 13, 1998Date of Patent: August 8, 2000Assignee: QUALCOMM IncorporatedInventors: Thomas J. Chintala, Richard M. Abney, Brett A. Kayzar, Gina M. Lombardi, Jeffrey J. Rhine, Stanley Scheufler, John J. Wendorff, Thomas J. Zeran