Patents by Inventor Thomas Martin Zwick

Thomas Martin Zwick has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Apparatus and methods for constructing antennas using vias as radiating elements formed in a substrate
    Patent number: 7999753
    Abstract: Antennas are provided which are constructed using one or more conductive via stubs as radiating elements formed in a substrate. The antennas can be integrally packaged with IC chips (e.g., IC transceivers, receivers, transmitters, etc.) to build integrated wireless or RF (radio frequency) communications systems.
    Type: Grant
    Filed: July 21, 2008
    Date of Patent: August 16, 2011
    Assignee: International Business Machines Corporation
    Inventors: Brian Paul Gaucher, Duixian Liu, Ullrich Richard Rudolf Pfeiffer, Thomas Martin Zwick
  • Apparatus and methods for constructing and packaging printed antenna devices
    Patent number: 7545329
    Abstract: Printed antenna devices are provided, which can operate at RF and microwave frequencies, for example, while simultaneously providing antenna performance characteristics such as high gain/directivity/radiation efficiency, high bandwidth, hemispherical radiation patterns, impedance, etc., that render the antennas suitable for voice communication, data communication or radar applications, for example. Further, apparatus are provided for integrally packaging such printed antenna devices with IC (integrated circuit) chips (e.g., transceiver) to construct IC packages for, e.g., wireless communications applications.
    Type: Grant
    Filed: September 21, 2006
    Date of Patent: June 9, 2009
    Assignee: International Business Machines Corporation
    Inventors: Brian Paul Gaucher, Duixian Liu, Ullrich Richard Rudolf Pfeiffer, Thomas Martin Zwick
  • Apparatus and Methods for Constructing Antennas Using Vias as Radiating Elements Formed in a Substrate
    Publication number: 20080272977
    Abstract: Antennas are provided which are constructed using one or more conductive via stubs as radiating elements formed in a substrate. The antennas can be integrally packaged with IC chips (e.g., IC transceivers, receivers, transmitters, etc.) to build integrated wireless or RF (radio frequency) communications systems.
    Type: Application
    Filed: July 21, 2008
    Publication date: November 6, 2008
    Inventors: Brian Paul Gaucher, Duixian Liu, Ullrich Richard Rudolf Pfeiffer, Thomas Martin Zwick
  • Apparatus and methods for constructing antennas using vias as radiating elements formed in a substrate
    Patent number: 7444734
    Abstract: Antennas are provided which are constructed using one or more conductive via stubs as radiating elements formed in a substrate. The antennas can be integrally packaged with IC chips (e.g., IC transceivers, receivers, transmitters, etc.) to build integrated wireless or RF (radio frequency) communications systems.
    Type: Grant
    Filed: December 9, 2003
    Date of Patent: November 4, 2008
    Assignee: International Business Machines Corporation
    Inventors: Brian Paul Gaucher, Duixian Liu, Ullrich Richard Rudolf Pfeiffer, Thomas Martin Zwick
  • Integrated millimeter-wave quadrature generator
    Patent number: 7386291
    Abstract: An off-chip signal is provided to a differential branch-line directional coupler implemented entirely on-chip. The coupler produces differential quadrature signals, which are then buffered and applied to a quadrature mixer. The coupler is implemented entirely on-chip using microstrip transmission lines. The coupler is made up of a plurality of rings and a plurality of underpasses connecting ports of the rings, wherein each of the plurality of rings is made up of four branch lines, and each branch line having an electrical length of one-quarter wavelength at the center design frequency. Coupling between the plurality of branch lines of the rings may be varied.
    Type: Grant
    Filed: September 2, 2003
    Date of Patent: June 10, 2008
    Assignee: International Business Machines Corporation
    Inventors: Brian Allan Floyd, Ullrich Richard Pfeiffer, Scott Kevin Reynolds, Thomas Martin Zwick
  • Apparatus and methods for constructing antennas using wire bonds as radiating elements
    Patent number: 7295161
    Abstract: Antennas are provided which are constructed using one or more wires as radiating elements attached to a substrate or chip, wherein wire bonding methods can be used to attach and form loop profiles for the wires. The antennas can be integrally packaged with IC chips (e.g., IC transceivers, receivers, transmitters, etc.) to build integrated wireless or RF (radio frequency) communications systems.
    Type: Grant
    Filed: August 6, 2004
    Date of Patent: November 13, 2007
    Assignee: International Business Machines Corporation
    Inventors: Brian Paul Gaucher, Duixian Liu, Ullrich Richard Rudolf Pfeiffer, Thomas Martin Zwick
  • Apparatus and method for constructing and packaging printed antenna devices
    Patent number: 7119745
    Abstract: Printed antenna devices are provided, which can operate at RF and microwave frequencies, for example, while simultaneously providing antenna performance characteristics such as high gain/directivity/radiation efficiency, high bandwidth, hemispherical radiation patterns, impedance, etc., that render the antennas suitable for voice communication, data communication or radar applications, for example. Further, apparatus are provided for integrally packaging such printed antenna devices with IC (integrated circuit) chips (e.g., transceiver) to construct IC packages for, e.g., wireless communications applications.
    Type: Grant
    Filed: June 30, 2004
    Date of Patent: October 10, 2006
    Assignee: International Business Machines Corporation
    Inventors: Brian Paul Gaucher, Duixian Liu, Ullrich Richard Rudolf Pfeiffer, Thomas Martin Zwick