Abstract: A power semiconductor module includes one or more power semiconductor dies attached to a first main face of a substrate, a plastic housing attached to the substrate, which together with the substrate encloses the one or more power semiconductor dies, a plurality of power terminals attached to the first main face of the substrate at a first end, and extending through the plastic housing at a second end to provide a point of external electrical connection for the one or more power semiconductor dies, a potting compound embedding the one or more power semiconductor dies, the first main face of the substrate and at least part of the first end of the plurality of power terminals, and an insulative coating applied only to parts of the plurality of power terminals disposed inside the plastic housing and in contact with just air. A corresponding method of manufacture also is provided.

Abstract: A power semiconductor module includes one or more power semiconductor dies attached to a first main face of a substrate, a plastic housing attached to the substrate, which together with the substrate encloses the one or more power semiconductor dies, a plurality of power terminals attached to the first main face of the substrate at a first end, and extending through the plastic housing at a second end to provide a point of external electrical connection for the one or more power semiconductor dies, a potting compound embedding the one or more power semiconductor dies, the first main face of the substrate and at least part of the first end of the plurality of power terminals, and an insulative coating applied only to parts of the plurality of power terminals disposed inside the plastic housing and in contact with just air. A corresponding method of manufacture also is provided.

Abstract: One aspect of the invention relates to a method for producing a circuit carrier. For this purpose, an electrically insulating carrier is provided, having an upper side and also an underside opposite from the upper side. A first metal foil and a hardening material are likewise provided. Then, an upper metallization layer, which is arranged on the upper side and has a hardening area, is produced. In this case, at least one contiguous portion of the hardening area is created by at least part of the hardening material being diffused into the first metal foil.

Abstract: One aspect of the invention relates to a method for producing a circuit carrier. For this purpose, an electrically insulating carrier is provided, having an upper side and also an underside opposite from the upper side. A first metal foil and a hardening material are likewise provided. Then, an upper metallization layer, which is arranged on the upper side and has a hardening area, is produced. In this case, at least one contiguous portion of the hardening area is created by at least part of the hardening material being diffused into the first metal foil.

Abstract: The invention relates to a cosmetic formulation with improved effectiveness and reduced stickiness, comprising at least one activated aluminum antiperspirant active ingredient, at least one alpha-hydroxycarboxylic acid and water.

Abstract: Glycopyrronium bromide, derivatives and/or isomers thereof in combination with one or more active substances selected from a list of substances as recited in the claims and/or in the form of a W/Si emulsion, an O/W gel, a soap gel stick, and/or a surfactant-containing cleansing formula, and corresponding cosmetic preparations, in particular deodorant/antiperspirant preparations.

Abstract: A method for reducing variations in the bending of rolled metal base plates for semiconductor modules is disclosed. In this method, the base plates are rolled in their longitudinal direction in a specific manner.

Abstract: The power semiconductor module (1) has a heat-conducting base plate (11) on which at least three substrates (2, 3, 4, 5, 6, 7) are placed, each substrate supporting at least one power semiconductor component (8, 9) that gives off heat generated during operation. In order to optimize a power semiconductor module of this type with regard to mechanical load and heat dissipation, the substrates (2, 3, 4, 5, 6, 7) are placed on the base plate (11) while being arranged in a single row (12), and pressing devices (15, 16), which are situated close to the substrate, are provided on both longitudinal sides (11a, 11b) of the base plate (11) while being arranged parallel to the row (12). The base plate can be pressed against a cooling surface by the pressing devices.

Abstract: A header trailer for transporting a header for a combine harvester has a chassis (1-4) and a support saddle (12) which is shaped so as to support stably a header (16) placed on the support saddle (12). The support saddle is mounted pivotably on the chassis (1-4).

Abstract: Kit for applying a fluid onto a surface and method using the kit. The kit includes a fluid having a yield point, a fluid container having at least one opening, and an applicator element having one or more porous areas for applying the fluid to a surface. The applicator element is located on the at least one opening of the container. The at least one porous area of the applicator element is in contact with the fluid. The fluid wets the at least one porous area of the applicator element but does not leak out of it as long as the porous area is not in contact with the surface. A porosity of the at least one porous area of the applicator element is related to the yield point of the fluid or vice versa.

Abstract: Glycopyrronium bromide, derivatives and/or isomers thereof in combination with one or more active substances selected from a list of substances as recited in the claims and/or in the form of a W/Si emulsion, an O/W gel, a soap gel stick, and/or a surfactant-containing cleansing formula, and corresponding cosmetic preparations, in particular deodorant/antiperspirant preparations.

Abstract: A kit for applying a fluid onto a surface. The kit comprises (i) a fluid having a yield point, (ii) a container having at least one opening, and (iii) an applicator for applying the fluid to a surface. The applicator comprises a porous area, whereby when the applicator is disposed on the opening of the container and the porous area is in contact with the fluid, the fluid wets the porous area of the applicator without leaking out of it, as long as the porous area is not in contact with the surface. This Abstract is neither intended to define the invention disclosed in this specification nor intended to limit the scope of the invention in any way.

Abstract: The invention relates to a cosmetic formulation with improved effectiveness and reduced stickiness, comprising at least one activated aluminum antiperspirant active ingredient, at least one alpha-hydroxycarboxylic acid and water.

Abstract: The power semiconductor module (1) has a heat-conducting base plate (11) on which at least three substrates (2, 3, 4, 5, 6, 7) are placed, each substrate supporting at least one power semiconductor component (8, 9) that gives off heat generated during operation. In order to optimize a power semiconductor module of this type with regard to mechanical load and heat dissipation, the substrates (2, 3, 4, 5, 6, 7) are placed on the base plate (11) while being arranged in a single row (12), and pressing devices (15, 16), which are situated close to the substrate, are provided on both longitudinal sides (11a, 11b) of the base plate (11) while being arranged parallel to the row (12). The base plate can be pressed against a cooling surface by the pressing devices.

Abstract: A method for reducing variations in the bending of rolled metal base plates for semiconductor modules is disclosed. In this method, the base plates are rolled in their longitudinal direction in a specific manner.