Abstract: A microwave antenna apparatus comprises a semiconductor package module comprising a mold layer, a semiconductor element, a coupling element and a redistribution layer, and an antenna module mounted on top of the semiconductor package module, said antenna module comprising an antenna substrate, one or more antenna elements, an antenna feed layer and an antenna ground layer. The footprint of the antenna module is larger than the footprint of the semiconductor package module.

Abstract: A synthesizer comprises a first two-point modulation phase locked loop, TPM PLL, circuit that receives a first reference clock signal at a first reference frequency and a feedback signal at a feedback frequency and generates a first chirp signal by applying a two-point modulation PLL on the first reference clock signal, a second integer-n TPM PLL circuit that receives a second reference clock signal at a second reference frequency lower than the first reference frequency and generates a second chirp signal by applying a TPM PLL on the second reference clock signal, a mixer that downconverts the first chirp signal by the second chirp signal to obtain the feedback signal at the feedback frequency corresponding to the difference of the frequency of the first chirp signal and the second chirp signal, and a feedback path that feeds back the feedback signal to the first TPM PLL circuit.

Abstract: A wind park comprising at least two wind turbines that produce electrical power by means of a wind rotor and a generator and delivers this to an accumulating network, and comprising a park master that is configured to control said wind turbines and has a power regulator whose input is supplied with a target power signal and, at whose output, power control signals are emitted for the wind turbines, said power regulator comprising a feed-forward control module that imposes a value for the target power onto the output of said power regulator by means of a multiplication element.

Abstract: A synthesizer comprises a two-point modulation phase locked tow, TPM PLL, circuit configured to receive a frequency tuning signal and to generate a stepped chirp signal in an intermediate frequency range by applying a two-point modulation PLL on the frequency tuning signal, and a subsampling PLL circuit configured to receive the stepped chirp signal in a mm-wave frequency range and to generate a smoothened chirp signal in a mm-wave frequency range by applying a subsampling PLL on the stepped chirp signal.

Abstract: A microwave antenna apparatus comprises a semiconductor element and an antenna element embedded into a mold layer, which is covered by a redistribution layer. The antenna element is preferably configured as SMD component so that it can be handled by a standard pick and place process. The coupling between semiconductor element and antenna element is provided either by a metal layer or aperture coupling within the redistribution layer. The microwave antenna apparatus may be coupled to a PCB arrangement thus forming an embedded wafer-level ball grid array (eWLB) or embedded micro-wafer-level-packaging (emWLP) package.

Abstract: A household appliance includes a plurality of walls which delimit a treatment compartment. At least one of the walls, e.g. a rear wall of the treatment compartment, is configured predominantly or entirely with a luminous surface element. The luminous surface element can be sized to occupy at least 50% of a surface of the at least one wall and formed by a plate-shaped or panel-type element.

Abstract: A microwave antenna coupling apparatus forming an eWLB package, comprises an antenna coupling element comprising a coupling unit, a coupling feed line arranged on a first surface of the coupling unit and an internal coupling component to provide signal coupling between the coupling feed line and the second surface of the coupling unit, wherein the antenna coupling element is arranged within the mold layer separate from the semiconductor element and such that an outer surface of the coupling feed line is not covered by mold material. Different multi-layer antenna structures can be placed on top of eWLB package. By this type of integration Package-on-Package (PoP) antenna are constructed.

Abstract: A planar antenna array comprises two or more linear arrays of radiation elements, said linear arrays being substantially arranged in parallel, a first connecting unit connecting first ends of said two or more linear arrays, a second connecting unit connecting second ends of said two or more linear arrays, and a feed port at least at one end of each one of said first and second connecting units for reception of a feed signal.

Abstract: A lower rack for a domestic dishwasher is constructed for being liftable and includes a fixed lower rack element, and a removable lower rack element connectable to the fixed lower rack element and constructed for removal from the fixed lower rack element to thereby unblock access to a bottom area of a washing container of the domestic dishwasher.

Abstract: A microwave antenna apparatus includes: a redistribution layer including a carrier layer, a ground plane arranged on a first or second surface of the carrier layer, and a microstrip line arranged on the other one of the first or second surface of the carrier layer; a semiconductor element mounted on the first surface of the carrier layer and coupled to the ground plane and the microstrip line; a mold layer that covers the semiconductor element and the first surface of the carrier layer; and a waveguide arranged within the mold layer and on the first surface of the carrier layer and coupled to the semiconductor element by the microstrip line, wherein a solid state filling material is arranged within the waveguide. Further, integrated antennas and transitions are presented within eWLB packages.