Patents by Inventor Thomas Wagner

Thomas Wagner has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10420450
    Abstract: A cleaning apparatus for cleaning articles to be cleaned includes at least one cleaning chamber; at least one conveying device configured to convey the articles to be cleaned in a conveying direction through the cleaning chamber, the at least one conveying device comprising a plurality of tracks arranged side by side; at least one nozzle system configured to act upon the articles to be cleaned with at least one cleaning fluid; at least one sensor configured to detect a loading of the conveying device with articles to be cleaned; and at least one control means programmed to select at least one operating mode of the cleaning apparatus corresponding to the loading of the conveying device detected by the sensor, and to propose the selected operating mode to a user of the cleaning apparatus by providing a visual indicator on one or several tracks of the conveying device.
    Type: Grant
    Filed: February 16, 2015
    Date of Patent: September 24, 2019
    Assignee: MEIKO Maschinenbau GmbH & Co. KG
    Inventors: Klaus Engesser, Regina Höschele, Thomas Loos, Johann Wagner
  • Publication number: 20190287904
    Abstract: A system-in-package apparatus includes a semiconductive bridge that uses bare-die pillars to couple with a semiconductive device such as a processor die. The apparatus achieves a thin form factor.
    Type: Application
    Filed: December 29, 2016
    Publication date: September 19, 2019
    Inventors: Georg Seidemann, Thomas Wagner, Andreas Wolter, Bernd Waidhas
  • Publication number: 20190275732
    Abstract: A method for producing an article in which a layer with a radically cross-linkable resin is selectively crosslinked at least partially. This takes place according to a selected cross section of the article to be formed by means of selective application of a radical initiator. The at least partially crosslinked material is added on layer by layer to a carrier or to previous layers bonded to the carrier. A system that is suitable for carrying out the method according to the invention has a substrate, a control unit, an application unit for applying the resin to the substrate, an application unit for applying an initiator to the resin, an energy exposure unit and a contacting unit.
    Type: Application
    Filed: December 4, 2017
    Publication date: September 12, 2019
    Inventors: Dirk ACHTEN, Thomas BÜSGEN, Michael LUDEWIG, Roland WAGNER, Christoph TOMCZYK, Jörg TILLACK, Arnaud GENOU
  • Patent number: 10411000
    Abstract: A microelectronic package is described with an illuminated backside exterior. In one example, the package has a package substrate, a die attached to the package substrate, a cover over the die and the package substrate, a lamp, and a screen over the die, externally visible and optically coupled to the lamp so that when the lamp is illuminated the illumination is externally visible through the screen.
    Type: Grant
    Filed: March 31, 2016
    Date of Patent: September 10, 2019
    Assignee: Intel IP Corporation
    Inventors: Marc Stephan Dittes, Sven Albers, Christian Georg Geissler, Andreas Wolter, Klaus Reingruber, Georg Seidemann, Thomas Wagner, Richard Patten
  • Publication number: 20190270197
    Abstract: A method of processing objects using a programmable motion device is disclosed. The method includes the steps of providing an input conveyance system by which input bins of objects may be provided to a processing station that includes the programmable motion device that includes an end effector, perceiving at the processing station identifying indicia representative of an identity of a plurality of objects at an input area of the input conveyance system, grasping the an acquired object using the end effector, moving the acquired object toward an identified processing container using the programmable motion device, the identified processing container being associated with the identifying indicia and said identified processing container being provided as one of a plurality of processing containers at the processing station, and providing an output conveyance system in communication with the processing station, by which processing containers that contain processed objects may be provided.
    Type: Application
    Filed: June 6, 2018
    Publication date: September 5, 2019
    Inventors: Thomas WAGNER, Kevin AHEARN, Benjamin COHEN, Michael DAWSON-HAGGERTY, Christopher GEYER, Victoria HINCHEY, Thomas KOLETSCHKA, Kyle MARONEY, Matthew T. MASON, Gene Temple PRICE, Joseph ROMANO, Daniel SMITH, Siddhartha SRINIVASA, Prasanna VELAGAPUDI, Thomas ALLEN
  • Publication number: 20190270537
    Abstract: A box handling system is disclosed for use in an object processing system. The box handling system includes a box tray including a recessed area for receiving a box, and the recessed area includes a plurality of floor and edge portions for receiving the box that contains objects to be processed.
    Type: Application
    Filed: March 4, 2019
    Publication date: September 5, 2019
    Inventors: John Richard AMEND, JR., William Chu-Hyon MCMAHAN, Joseph ROMANO, Victoria HINCHEY, Jennifer Eileen KING, Thomas WAGNER
  • Patent number: 10398236
    Abstract: It is a feature of a porous body comprising a three-dimensional network of node points joined to one another by struts, and a void volume present between the struts, that the struts have an average length of ?200 ?m to ?50 mm, the struts have an average thickness of ?100 ?m to ?5 mm, and that the porous body has a compression hardness (40% compression, DIN EN ISO 3386-1: 2010-09) in at least one spatial direction of ?10 to ?100 kPa. The porous body according to the invention combines the advantages of a conventional mattress or cushion with ventilatability which results from its porous structure and is not achievable in conventional foams. The invention further relates to a method of producing such a porous body and to an apparatus comprising said body for supporting and/or bearing a person.
    Type: Grant
    Filed: September 12, 2017
    Date of Patent: September 3, 2019
    Assignee: Covestro Deutschland AG
    Inventors: Dirk Achten, Thomas Busgen, Dirk Dijkstra, Nicolas Degiorgio, Roland Wagner, Levent Akbas, Peter Reichert, Jurgen Hattig
  • Patent number: 10399236
    Abstract: A system is disclosed for providing dynamic vacuum control to an end effector of an articulated arm. The system includes a first vacuum source for providing a first vacuum pressure with a first maximum air flow rate, and a second vacuum source for providing a second vacuum pressure with a second maximum air flow rate, wherein the second vacuum pressure is higher than the first vacuum pressure and wherein the second maximum air flow rate is greater than the first maximum air flow rate.
    Type: Grant
    Filed: September 8, 2016
    Date of Patent: September 3, 2019
    Assignee: Berkshire Grey, Inc.
    Inventors: Thomas Wagner, Kevin Ahearn, Benjamin Cohen, Michael Dawson-Haggerty, Christopher Geyer, Thomas Koletschka, Kyle Maroney, Matthew T. Mason, Gene Temple Price, Joseph Romano, Daniel Smith, Siddhartha Srinivasa, Prasanna Velagapudi, Thomas Allen
  • Patent number: 10403602
    Abstract: A semiconductive device stack, includes a baseband processor die with an active surface and a backside surface, and a recess in the backside surface. A recess-seated device is disposed in the recess, and a through-silicon via in the baseband processor die couples the baseband processor die at the active surface to the recess-seated die at the recess. A processor die is disposed on the baseband processor die backside surface, and a memory die is disposed on the processor die. The several dice are coupled by through-silicon via groups.
    Type: Grant
    Filed: June 29, 2017
    Date of Patent: September 3, 2019
    Assignee: Intel IP Corporation
    Inventors: Bernd Waidhas, Georg Seidemann, Andreas Augustin, Laurent Millou, Andreas Wolter, Reinhard Mahnkopf, Stephan Stoeckl, Thomas Wagner
  • Patent number: 10403609
    Abstract: A system-in-package device includes at least three electrical device components arranged in a common package. A first electrical device component includes a first vertical dimension, a second electrical device component includes a second vertical dimension and a third electrical device component comprises a third vertical dimension. The first electrical device component and the second electrical device component are arranged side by side in the common package. Further, the third electrical device component is arranged on top of the first electrical device component in the common package. At least a part of the third electrical device component is arranged vertically between a front side level of the second electrical device component and a back side level of the second electrical device component.
    Type: Grant
    Filed: December 21, 2015
    Date of Patent: September 3, 2019
    Assignee: Intel IP Corporation
    Inventors: Christian Geissler, Sven Albers, Georg Seidemann, Andreas Wolter, Klaus Reingruber, Thomas Wagner, Marc Dittes
  • Patent number: 10403580
    Abstract: An electronic device may include a semiconductor die. The electronic device may include a first routing layer. The first routing layer may be coupled to the semiconductor die. A first plurality of routing traces may be in electrical communication with the semiconductor die. The first plurality of routing traces may be positioned within a first routing footprint. The first routing footprint may have a width greater than a width of the semiconductor die. A second routing layer may be coupled to the first routing layer. A second plurality of routing traces may be in electrical communication with the first plurality of routing traces. The second plurality of routing traces may be positioned within a second routing footprint. The second routing footprint may have a width greater than the width of the first routing footprint.
    Type: Grant
    Filed: December 29, 2017
    Date of Patent: September 3, 2019
    Assignee: Intel IP Corporation
    Inventors: Lizabeth Keser, Thomas Ort, Thomas Wagner, Bernd Waidhas
  • Publication number: 20190262868
    Abstract: A drop perception system is disclosed that includes an open housing structure having an internal volume, an open top and an open bottom, and a plurality of perception units positioned to capture perception data within the internal volume at a plurality of locations between the open top and the open bottom of the open housing.
    Type: Application
    Filed: May 9, 2019
    Publication date: August 29, 2019
    Inventors: Thomas WAGNER, Kevin AHEARN, Benjamin COHEN, Michael DAWSON-HAGGERTY, Christopher GEYER, Thomas KOLETSCHKA, Kyle MARONEY, Matthew T. MASON, Gene Temple PRICE, Joseph ROMANO, Daniel SMITH, Siddhartha SRINIVASA, Prasanna VELAGAPUDI, Thomas ALLEN
  • Publication number: 20190254439
    Abstract: The invention relates to a method for producing a visco-elastic damping element comprising at least one visco-elastic spring element, characterized in that the visco-elastic spring element is structured from at least one visco-elastic material having a tan ? of at least 0.5, determined according to DIN 53535: 1982-03, and produced by means of a 3D printing method. The invention further relates to a visco-elastic damping element, which is produced or can be produced according to said method, and to a solid body comprising or consisting of a plurality of damping elements.
    Type: Application
    Filed: November 2, 2017
    Publication date: August 22, 2019
    Inventors: Dirk ACHTEN, Thomas BÜSGEN, Dirk DIJKSTRA, Roland WAGNER, Bettina METTMANN, Nicolas DEGIORGIO, Peter REICHERT
  • Publication number: 20190248023
    Abstract: An end effector system is disclosed for a robotic system that includes a primary acquisition system that includes a primary end effector, and a secondary retention system that substantially surrounds at least a portion of the primary acquisition system, wherein at least a portion of the primary acquisition system may be drawn up within at least a portion of the secondary retention system such that the primary end effector system may be used to select an object from a plurality of objects, and the secondary retention system may be used to secure the object for rapid transport to an output destination.
    Type: Application
    Filed: April 22, 2019
    Publication date: August 15, 2019
    Inventors: Thomas WAGNER, Kevin AHEARN, Benjamin COHEN, Michael DAWSON-HAGGERTY, Christopher GEYER, Thomas KOLETSCHKA, Kyle MARONEY, Matthew T. MASON, Gene Temple PRICE, Joseph ROMANO, Daniel SMITH, Siddhartha SRINIVASA, Prasanna VELAGAPUDI, Thomas ALLEN
  • Publication number: 20190248025
    Abstract: An end effector is disclosed for an articulated arm. The end effector includes a valve assembly including a plurality of supply channels, each supply channel including a supply conduit, a pressure sensor in fluid communication with the supply conduit, and a supply conduit plug. The supply conduit is in fluid communication with a vacuum source. During use, each supply conduit is either at vacuum such that the pressure within the supply conduit is substantially at a vacuum pressure, or is at a pressure that is substantially higher than vacuum pressure because the supply conduit plug has moved to block a portion of the supply conduit. The pressure sensor of each supply conduit provides a pressure sensor signal responsive to whether the pressure in the conduit is either substantially at vacuum or is at a pressure that is substantially higher than vacuum.
    Type: Application
    Filed: April 23, 2019
    Publication date: August 15, 2019
    Inventors: Thomas WAGNER, Kevin AHEARN, Michael DAWSON-HAGGERTY, Christopher GEYER, Thomas KOLETSCHKA, Kyle MARONEY, Matthew T. MASON, Gene Temple PRICE, Joseph ROMANO, Daniel SMITH, Siddhartha SRINIVASA, Prasanna VELAGAPUDI, Thomas ALLEN
  • Publication number: 20190248067
    Abstract: A process is described for producing a three dimensional structure, the process including the following steps a) applying of at least a first material M1 onto a substrate to build a first layer L1 on the substrate; b) layering of at least one further layer Ly of the first material M1 or of a further material Mx onto the first layer L1, wherein the at least one further layer Ly covers the first layer L1 and/or previous layer Ly?1 at least partially to build a precursor of the three dimensional structure; c) curing the precursor to achieve the three dimensional structure; wherein at least one of the materials M1 or Mx provides a Mooney viscosity of >10 ME at 60° C. and of <200 ME at 100° C. before curing and wherein at least one of the first material Mi or of the further material Mx is a powder. Also, a three dimensional structure is described which is available according to the process according to the invention.
    Type: Application
    Filed: September 15, 2017
    Publication date: August 15, 2019
    Applicant: Covestro Deutschland AG
    Inventors: Dirk ACHTEN, Thomas BÜSGEN, Dirk DIJKSTRA, Bettina METTMANN, Levent AKBAS, Roland WAGNER, Michael KESSLER
  • Patent number: 10381168
    Abstract: A hybrid supercapacitor has two electrodes, one of which functions as a cathode, and the other as an anode. The hybrid supercapacitor further includes an electrolyte arranged between the cathode and the anode. The electrolyte contains a solvent selected from the group consisting of methanol, 1-propanol, 1-heptanol, ethyl acetoacetate, ethylene glycol, diethylene glycol, glycerol, benzyl alcohol, di-n-butyl phthalate and mixtures thereof.
    Type: Grant
    Filed: September 23, 2016
    Date of Patent: August 13, 2019
    Assignee: Robert Bosch GmbH
    Inventors: Elisabeth Buehler, Frederik Golks, Mathias Widmaier, Pallavi Verma, Thomas Wagner
  • Publication number: 20190240896
    Abstract: A process is described for producing a three dimensional structure, the process including the following steps a) applying of at least a first material M1 onto a substrate to build a first layer L1 on the substrate; b) layering of at least one further layer Ly of the first material M1 or of a further material Mx onto the first layer L1, wherein the at least one further layer Ly covers the first layer L1 and/or previous layer Ly-1 at least partially to build a precursor of the three dimensional structure; c) curing the precursor to achieve the three dimensional structure; wherein at least one of the materials M1 or Mx provides a Mooney viscosity of >10 ME at 60° C. and of <200 ME at 100° C. before curing. Also, a three dimensional structure is described which is available according to the process according to the invention.
    Type: Application
    Filed: July 7, 2017
    Publication date: August 8, 2019
    Inventors: Dirk ACHTEN, Thomas BÜSGEN, Dirk DIJKSTRA, Roland WAGNER
  • Publication number: 20190234364
    Abstract: The present application concerns a fuel-injection metering device for a motor vehicle. The fuel-injection device include a main body with at least one through-hole, whereby the main body forms a valve seat on its inner face that is provided to interact with a valve body, whereby the inner face of the main body is electrochemically machined. The application also concerns a mould, a production method, and a fuel-injection nozzle.
    Type: Application
    Filed: March 28, 2019
    Publication date: August 1, 2019
    Inventors: Oliver GÜNTHER, Markus GÜNTHER, Thomas HÖG, Hans-Joachim KONIETZNI, Matthias LEICHTLE, Klaus PFENDTNER, Ulrich WAGNER
  • Patent number: 10366968
    Abstract: A microelectronic package with two semiconductor die coupled on opposite sides of a redistribution layer 108, and at least partially overlapping with one another. At least a first of the semiconductor die includes two sets of contacts, the first group of contacts arranged at a lesser pitch relative to one another than are a second group of contacts. The first group of contacts at the larger pitch are placed to engage contacts in a redistribution layer 108. The second group of contacts at the lesser pitch are placed to engage respective contacts at the same pitch on the second semiconductor die.
    Type: Grant
    Filed: September 30, 2016
    Date of Patent: July 30, 2019
    Assignee: Intel IP Corporation
    Inventors: Klaus Reingruber, Andreas Wolter, Georg Seidemann, Thomas Wagner, Bernd Waidhas