Patents by Inventor Thomas Wiesa
Thomas Wiesa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 11076486Abstract: The invention relates to an electronic unit (100, 100?) comprising at least one printed circuit board (10, 10?, 20) which is populated with a plurality of electric and/or electronic components (50, 50.1, 50.2) on one side or on both sides and which is incorporated into at least one protective housing (90) made of a solidified potting compound (80?). In the process, the electronic unit overall forms a volume body (200) in which the solidified potting compound takes up a filling volume (70). In order to minimize the filling volume, the electronic unit additionally comprises a separate insert molding part (60) which is arranged at least adjacently to a populated side of the at least one printed circuit board and which takes up a spatially closed displacement volume in the volume body with respect to a flowable potting compound for forming the protective housing in a solidified state (80?).Type: GrantFiled: June 1, 2017Date of Patent: July 27, 2021Assignee: Robert Bosch GmbHInventors: Thomas Wiesa, Stefan Doehren, Udo Hennel
-
Patent number: 11071203Abstract: The present invention relates to a circuit substrate arrangement comprising a base layer (2) made from aluminium, a circuit layer (3) made from copper, a dielectric layer (4) arranged between the base layer (2) and the circuit layer (3), an opening (5) passing through the base layer (2), the circuit layer (3) and the dielectric layer (4) and an electrical contact (6) between the base layer (2) and the circuit layer (3), wherein the electrical contact (6) comprises a rivet (7), wherein a frictionally connected joint (8) is formed between the rivet (7) and the base layer (2) and wherein an integrally bonded joint (9) is formed between the rivet (7) and the circuit layer (3).Type: GrantFiled: December 5, 2018Date of Patent: July 20, 2021Assignee: Robert Bosch GmbHInventors: Thomas Wiesa, Andreas Meier, Stefan Huehner
-
Publication number: 20210076497Abstract: The present invention relates to a circuit substrate arrangement comprising a base layer (2) made from aluminium, a circuit layer (3) made from copper, a dielectric layer (4) arranged between the base layer (2) and the circuit layer (3), an opening (5) passing through the base layer (2), the circuit layer (3) and the dielectric layer (4) and an electrical contact (6) between the base layer (2) and the circuit layer (3), wherein the electrical contact (6) comprises a rivet (7), wherein a frictionally connected joint (8) is formed between the rivet (7) and the base layer (2) and wherein an integrally bonded joint (9) is formed between the rivet (7) and the circuit layer (3).Type: ApplicationFiled: December 5, 2018Publication date: March 11, 2021Inventors: Thomas Wiesa, Andreas Meier, Stefan Huehner
-
Publication number: 20200296834Abstract: The invention relates to an electronic unit (100, 100?) comprising at least one printed circuit board (10, 10?, 20) which is populated with a plurality of electric and/or electronic components (50, 50.1, 50.2) on one side or on both sides and which is incorporated into at least one protective housing (90) made of a solidified potting compound (80?). In the process, the electronic unit overall forms a volume body (200) in which the solidified potting compound takes up a filling volume (70). In order to minimize the filling volume, the electronic unit additionally comprises a separate insert molding part (60) which is arranged at least adjacently to a populated side of the at least one printed circuit board and which takes up a spatially closed displacement volume in the volume body with respect to a flowable potting compound for forming the protective housing in a solidified state (80?).Type: ApplicationFiled: June 1, 2017Publication date: September 17, 2020Inventors: Thomas Wiesa, Stefan Doehren, Udo Hennel
-
Patent number: 10271431Abstract: The present invention relates to a contact arrangement (1), preferably for a power electronics system, comprising a printed circuit board (2) with a fastening hole (5), comprising a metal sleeve (8) which is inserted into the fastening hole (5), wherein the sleeve (8) makes contact with, preferably is soldered to, the printed circuit board (2), comprising a base (15) on which the sleeve (8) lies in order to make electrical contact, and comprising a fastening element (11) which protrudes through the sleeve (8), wherein one end of the fastening element (11) is fixedly connected to the base (15) and a head (12) is formed or arranged at the other end, wherein the head (12) of the fastening element (11) lies only on the sleeve (8) and not on the printed circuit board (2), and wherein the sleeve (8) projects beyond the printed circuit board (2) by way of a first projection (10) on that side which faces the base (15), wherein the first projection spaces apart the printed circuit board (2) and the base (15).Type: GrantFiled: March 11, 2016Date of Patent: April 23, 2019Assignee: Robert Bosch GmbHInventors: Andreas Meier, David Tastekin, Sebastian Goepfert, Thomas Wiesa, Hao Jin, Qiang Hou, Zhenzhong Shi
-
Patent number: 10117323Abstract: The arrangement relates to a circuit board having at least one electrically insulating layer and at least one electrically conductive layer. The circuit board has at least one heat-conducting element which is embedded in the electrically insulating layer and which is of thermally conductive form. The heat-conducting element is designed to transport heat losses transversely with respect to an areal extent of the circuit board. According to the arrangement, the heat-conducting element has at least two sub-elements formed in each case by a metal body. The heat-conducting element has an electrically insulating connecting layer which is arranged between the sub-elements and which is designed to electrically insulate the sub-elements with respect to one another and connect the sub-elements to one another in thermally conductive fashion.Type: GrantFiled: June 23, 2015Date of Patent: October 30, 2018Assignee: Robert Bosch GmbHInventor: Thomas Wiesa
-
Publication number: 20180124919Abstract: The present invention relates to a contact arrangement (1), preferably for a power electronics system, comprising a printed circuit board (2) with a fastening hole (5), comprising a metal sleeve (8) which is inserted into the fastening hole (5), wherein the sleeve (8) makes contact with, preferably is soldered to, the printed circuit board (2), comprising a base (15) on which the sleeve (8) lies in order to make electrical contact, and comprising a fastening element (11) which protrudes through the sleeve (8), wherein one end of the fastening element (11) is fixedly connected to the base (15) and a head (12) is formed or arranged at the other end, wherein the head (12) of the fastening element (11) lies only on the sleeve (8) and not on the printed circuit board (2), and wherein the sleeve (8) projects beyond the printed circuit board (2) by way of a first projection (10) on that side which faces the base (15), wherein the first projection spaces apart the printed circuit board (2) and the base (15).Type: ApplicationFiled: March 11, 2016Publication date: May 3, 2018Applicant: Robert Bosch GmbHInventors: Andreas Meier, David Tastekin, Sebastian Goepfert, Thomas Wiesa, Hao Jin, Qiang Hou, Zhenzhong Shi
-
Publication number: 20170280552Abstract: The invention relates to a circuit board having at least one electrically insulating layer and at least one electrically conductive layer. The circuit board has at least one heat-conducting element which is embedded in the electrically insulating layer and which is of thermally conductive form. The heat-conducting element is designed to transport heat losses transversely with respect to an areal extent of the circuit board. According to the invention, the heat-conducting element has at least two sub- elements formed in each case by a metal body. The heat-conducting element has an electrically insulating connecting layer which is arranged between the sub-elements and which is designed to electrically insulate the sub-elements with respect to one another and connect the sub-elements to one another in thermally conductive fashion.Type: ApplicationFiled: June 23, 2015Publication date: September 28, 2017Inventor: Thomas Wiesa
-
Patent number: 9484643Abstract: The invention relates to a contact element for connecting to a circuit board. The circuit board has at least one substrate layer, particularly an electrically insulating substrate layer. The circuit board also has at least one electrically conductive layer. The contact element is designed for connecting to the electrically conductive layer. According to the invention, the contact element is designed to be pushed onto a circuit board edge of the circuit board. The contact element is designed to reach over the circuit board edge and has at least one cutting blade with a cutting edge, the cutting edge having a harder metal in the area of a severing section than in an adjoining contact section alongside the cutting edge. The cutting edge is designed to cut through the substrate layer with the severing section when pushed onto the circuit board edge and to contact the electrically conductive layer electrically with the contact section.Type: GrantFiled: April 29, 2013Date of Patent: November 1, 2016Assignee: Robert Bosch GmbHInventors: Rainer Schaefer, Thomas Wiesa, Christian Klein
-
Patent number: 9345139Abstract: The use of a control module having at least one housing part and a multi-layer printed circuit board as the electrical connection between the inner space of the housing and components that are situated outside of the housing part is described. The multi-layer printed circuit board is the carrier for the electrical components of an electronic circuit, and is at the same time the thermal contacting to a housing part and/or a cooling element, particularly a hydraulic plate of the transmission, for a transmission control installed in an automatic transmission.Type: GrantFiled: June 6, 2012Date of Patent: May 17, 2016Assignee: ROBERT BOSCH GMBHInventors: Rolf Becker, Christian Lammers, Juergen Jerg, Joachim Wolff, Volker Hochholzer, Ulrich Trescher, Helmut Bubeck, Klaus Voigtlaender, Jan Benzler, Thomas Raica, Willi Kuehn, Thomas Wiesa, Michael Krapp
-
Publication number: 20150162669Abstract: The invention relates to a contact element for connecting to a circuit board. The circuit board has at least one substrate layer, particularly an electrically insulating substrate layer. The circuit board also has at least one electrically conductive layer. The contact element is designed for connecting to the electrically conductive layer. According to the invention, the contact element is designed to be pushed onto a circuit board edge of the circuit board. The contact element is designed to reach over the circuit board edge and has at least one cutting blade with a cutting edge, the cutting edge having a harder metal in the area of a severing section than in an adjoining contact section alongside the cutting edge. The cutting edge is designed to cut through the substrate layer with the severing section when pushed onto the circuit board edge and to contact the electrically conductive layer electrically with the contact section.Type: ApplicationFiled: April 29, 2013Publication date: June 11, 2015Inventors: Rainer Schaefer, Thomas Wiesa, Christian Klein
-
Patent number: 8885343Abstract: A control unit, in particular for a motor vehicle, the control unit having a housing, which has at least one heat dissipating area in which at least one electrical and/or electronic module having at least one heat dissipating element is situated, it being provided that the heat dissipating element is heat conductively connected to the heat dissipating area via a heat conducting medium which is introduced into the interior of the housing through at least one housing opening and which has a paste-like consistency, at least when introduced. A corresponding method for manufacturing a control unit is also described.Type: GrantFiled: June 17, 2009Date of Patent: November 11, 2014Assignee: Robert Bosch GmbHInventors: Andre Lischeck, Thomas Wiesa
-
Patent number: 8488324Abstract: An electrical control unit has a printed circuit board substrate, on which an electronic circuit is situated, which circuit includes multiple electrical components which are interconnected via printed conductors of the printed circuit board substrate, as well as housing parts for covering the electrical components on the printed circuit board substrate, and at least one device plug connector part situated on the printed circuit board substrate outside the section of the printed circuit board substrate covered by the housing parts. Outside the section covered by the at least one housing part and outside the section of the printed circuit board substrate provided with the device plug connector part, at least one contact point for an additional electrical component is situated on the printed circuit board substrate.Type: GrantFiled: May 13, 2008Date of Patent: July 16, 2013Assignee: Robert Bosch GmbHInventors: Rolf Becker, Christian Lammers, Juergen Jerg, Joachim Wolff, Volker Hochholzer, Ulrich Trescher, Helmut Bubeck, Klaus Voigtlaender, Jan Benzler, Thomas Raica, Willi Kuehn, Thomas Wiesa, Michael Krapp
-
Publication number: 20120240396Abstract: The use of a control module having at least one housing part and a multi-layer printed circuit board as the electrical connection between the inner space of the housing and components that are situated outside of the housing part is described. The multi-layer printed circuit board is the carrier for the electrical components of an electronic circuit, and is at the same time the thermal contacting to a housing part and/or a cooling element, particularly a hydraulic plate of the transmission, for a transmission control installed in an automatic transmission.Type: ApplicationFiled: June 6, 2012Publication date: September 27, 2012Inventors: Rolf BECKER, Christian Lammers, Juergen Jerg, Joachim Wolff, Volker Hochholzer, Ulrich Trescher, Helmut Bubeck, Klaus Voigtlaender, Jan Benzler, Thomas Raica, Willi Kuehn, Thomas Wiesa, Michael Krapp
-
Publication number: 20110205711Abstract: A control unit, in particular for a motor vehicle, the control unit having a housing, which has at least one heat dissipating area in which at least one electrical and/or electronic module having at least one heat dissipating element is situated, it being provided that the heat dissipating element is heat conductively connected to the heat dissipating area via a heat conducting medium which is introduced into the interior of the housing through at least one housing opening and which has a paste-like consistency, at least when introduced. A corresponding method for manufacturing a control unit is also described.Type: ApplicationFiled: June 17, 2009Publication date: August 25, 2011Inventors: Andre Lischeck, Thomas Wiesa
-
Publication number: 20100202110Abstract: Electric control units are known having a printed circuit board substrate 2 on which an electronic circuit 9 is situated which includes multiple electrical components 11 which are interconnected via printed conductors 12 of the printed circuit board substrate, housing parts 3, 4 for covering the electrical components on the printed circuit board substrate and at least one device plug connector part 6 which is electrically connected to the components and situated on the printed circuit board substrate outside the section of the printed circuit board substrate 2 covered by the housing parts 3, 4, the electrical connections between the components and the device plug connector part being established via printed conductors 14 of the printed circuit board substrate.Type: ApplicationFiled: May 13, 2008Publication date: August 12, 2010Inventors: Rolf Becker, Christian Lammers, Juergen Jerg, Joachim Wolff, Volker Hochholzer, Ulrich Trescher, Helmut Bubeck, Klaus Voigtlaender, Jan Benzler, Thomas Raica, Willi Kuehn, Thomas Wiesa, Michael Krapp
-
Patent number: 6666721Abstract: An easily producible and easily installable ignition mechanism for restraint devices in a vehicle includes an ignition capsule, in which at least one ignition element and its contact pins are fixed. Into the ignition capsule a pedestal can be set, in which a carrier arrangement having circuit elements is arranged. Spring elements are present, by which contact is established between circuit elements and contact pins of the ignition element when the pedestal is set into the ignition capsule.Type: GrantFiled: July 9, 2001Date of Patent: December 23, 2003Assignee: Robert Bosch GmbHInventors: Gert Jakob, Werner Nitschke, Thomas Wiesa, Ulrich Goebel, Albert-Andreas Hoebel, Stefan Rupprecht, Martin Zywietz, Peter Schaedler
-
Patent number: 6197208Abstract: A method for contacting at least one printed circuit board or at least one punched grid and at least one hybrid includes the steps of: forming contact elements in a contacting foil, positioning the contacting foil over the hybrid in such a way that the contact elements are arranged at preselected positions between the printed circuit traces of the hybrid and the printed circuit traces of the printed circuit board, and etching away at least a portion of the contacting foil, such that the contact elements are at least partially freely accessible.Type: GrantFiled: January 7, 1999Date of Patent: March 6, 2001Assignee: Robert Bosch GmbHInventor: Thomas Wiesa
-
Patent number: 5925210Abstract: In a method for manufacturing a composite arrangement, at least one printed circuit board substrate is joined with a support under the influence of an applied pressure exerted by a press die over a weave layer (prepreg) impregnated with resin, such that the resin in the region of an opening of the printed circuit board substrate does not flow into this opening. The applied pressure is, therefore, at least partially reduced in the region of the opening of the printed circuit board substrate.Type: GrantFiled: February 21, 1997Date of Patent: July 20, 1999Assignee: Robert Bosch GmbHInventors: Walter Wagenbrenner, Thomas Wiesa, Ralph Schimitzek
-
Patent number: 5880935Abstract: A device, in particular for use in an electronic controller, includes a card rack and a subassembly. The device is manufactured by soldering over a large area the unpopulated back side of the subassembly to this card rack. The soldering can be performed using a reflow soldering process and can be automated, and thus suitable for mass production. The electrical connections of the subassembly are led spatially and electrically separately from the mechanical attachment of the subassembly to the card rack. The subassembly can be an additional component mounted on the card rack with a new additional function, so that the controller can be flexibly adapted to a given requirement profile in a simple manner by combining, in a flexible manner, a plurality of subassemblies with different layouts and modes of operation on the card rack.Type: GrantFiled: February 14, 1997Date of Patent: March 9, 1999Assignee: Robert Bosch GmbHInventors: Thomas Wiesa, Ralph Schimitzek, Dieter Karr