Patents by Inventor Tien Heng Lem

Tien Heng Lem has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electrical interconnect structure with radial spokes for improved solder void control
    Patent number: 11355429
    Abstract: An electrical interconnect structure includes a bond pad having a substantially planar bonding surface, and a solder enhancing structure that is disposed on the bonding surface and includes a plurality of raised spokes that are each elevated from the bonding surface. Each of the raised spokes has a lower wettability relative to a liquefied solder material than the bonding surface. Each of the raised spokes extend radially outward from a center of the solder enhancing structure.
    Type: Grant
    Filed: January 28, 2020
    Date of Patent: June 7, 2022
    Assignee: Infineon Technologies AG
    Inventors: Paul Armand Asentista Calo, Tek Keong Gan, Ser Yee Keh, Tien Heng Lem, Fong Lim, Michael Stadler, Mei Qi Tay
  • Electrical Interconnect Structure with Radial Spokes for Improved Solder Void Control
    Publication number: 20210233839
    Abstract: An electrical interconnect structure includes a bond pad having a substantially planar bonding surface, and a solder enhancing structure that is disposed on the bonding surface and includes a plurality of raised spokes that are each elevated from the bonding surface. Each of the raised spokes has a lower wettability relative to a liquefied solder material than the bonding surface. Each of the raised spokes extend radially outward from a center of the solder enhancing structure.
    Type: Application
    Filed: January 28, 2020
    Publication date: July 29, 2021
    Inventors: Paul Armand Asentista Calo, Tek Keong Gan, Ser Yee Keh, Tien Heng Lem, Fong Lim, Michael Stadler, Mei Qi Tay