Abstract: Described is a method for regulating a volume of liquid delivered by a peristaltic pump and a peristaltic pump system that can be used to perform the method. The method includes sensing an ambient temperature of the peristaltic pump. The peristaltic pump includes a pump motor. At least one of a motor speed and a motor operation duration is determined from the sensed temperature, a selected volume of liquid to be delivered and a predetermined correspondence of the motor speed to ambient temperature. The pump motor is operated at the determined motor speed or for the determined motor operation duration to deliver the selected volume of liquid from the peristaltic pump.

Abstract: An apparatus can include a display, a facial interface, and a connector between the display and the facial interface. The facial interface can at least translate or rotate relative to the display via the connector.

Abstract: A method and apparatus for improving accuracy of measurement of fluid pressure at a fluid port, such as at a supply port or control port of a fluid control valve, involves a closed-loop precision pressure measurement method with barometric pressure and temperature compensation.

Abstract: A replica image of a computer system is loaded to a target computer system being built. A detection program running on the target computer system detects configuration information and attached devices and provides this information to a build program. The build program provides needed program components, applications, prerequisites and device drivers for the target computer according to build rules defined for the target computer type/model. Optionally, the detection program further detects that there are updates required for the detection program and installs the updates before proceeding with the build process.

Abstract: A self-test method and system for facilitating reliable and fault-tolerant operation of a multi-peripheral-device enclosure for use in high-availability computer systems. The reliable and fault-tolerant multi-peripheral-device enclosure uses a three-tiered port bypass control strategy for diagnosing and isolating malfunctioning peripheral devices within the multi-peripheral-device enclosure, and uses a similar a three-tiered port bypass control strategy for isolation of the entire multi-peripheral-device enclosure from a communications medium that interconnects the multi-peripheral-device enclosure with one or more host computers. This three-tiered port bypass control strategy is employed by a self-test routine to isolate the multi-peripheral-device enclosure from external processing elements in order to test peripheral devices and other components within the multi-peripheral-device enclosure, and to isolate any detected defective or malfunctioning components.

Abstract: A method and system for facilitating reliable and fault-tolerant operation of a multi-peripheral-device enclosure for use in high-availability computer systems by redundant interconnection of redundant processors within the multi-peripheral-device enclosure. The redundant interconnection removes a potential single point of failure, and allows the redundant processors to share in control of other components within the multi-peripheral-device enclosure. The multi-peripheral-device enclosure can recover from failure of all but one of the redundant processors, as well as failure in all but one of the redundant busses used to interconnect the two processors.

Abstract: A parallel plate heat sink used in conjunction with an air moving device which provides an annular flow of air against the heat sink is further provided with enhanced flow deflector means which selectively block potential exhaust paths so as to redirect the flow of air to the region under a central hub of the fan. This transforms otherwise stagnant air volume in the center of the heat sink into a primary cooling region thus lowering conduction losses and electronic component junction temperatures.

Abstract: A parallel plate heat sink used in conjunction with an air moving device which provides an annular flow of air against the heat sink is further provided with enhanced flow deflector means which selectively block potential exhaust paths so as to redirect the flow of air to the region under a central hub of the fan. This transforms otherwise stagnant air volume in the center of the heat sink into a primary cooling region thus lowering conduction losses and electronic component junction temperatures.

Abstract: A parallel plate heat sink used in conjunction with an air moving device which provides an annular flow of air against the heat sink is further provided with enhanced flow deflector means which selectively block potential exhaust paths so as to redirect the flow of air to the region under a central hub of the fan. This transforms otherwise stagnant air volume in the center of the heat sink into a primary cooling region thus lowering conduction losses and electronic component junction temperatures.

Abstract: A heat exchanger, especially for use in conjunction with a wide range of computer systems ranging from work stations to massively parallel processors is employable with both air and water cooling systems. In particular, a heat exchanger is provided which is convertible from a heat sink modality to an air cooling modality and finally to a liquid cooling modality in response to either increased performance demands or an increase in the number of processors or circuit components employed. The conversion may be carried out in the field and provides a flexible and less costly upgradeability path for data processing customers.

Abstract: Cooling module geometry provides a method for controlling local condensation for liquid impingement two-phase cooling of electrical and/or electronic circuit chips. The method and apparatus described herein uses vapor condensation in the exhaust flow from each chip site within a multi-chip module which utilizes direct liquid impingement with phase change.

Abstract: A convertible cooling module, especially for use in conjunction with a wide range of computer systems ranging from workstations to massively parallel processors is employable with both air and water cooling systems. In particular, a cooling module is convertible from a heat sink modality to an air cooling modality, and finally to a liquid cooling modality in response to either increased performance demands or an increase in the number of processors or circuit components employed. The conversion may be carried out in the field and provides a flexible and less costly upgradeability path for computer customers.