Patents by Inventor Ting-Chen Hu

Ting-Chen Hu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11480729
    Abstract: A photonic integrated circuit includes a slot optical waveguide having an optical core with sub-wavelength slot therein that is partially filled with a first lower-index material having a negative thermo-optic coefficient. The slot may also include a second lower-index material having a positive thermo-optic coefficient. The relative volume of the first lower-index material within the slot may be configured to provide athermal or nearly-athermal operation. Example applications include integrated AWG MUX/DEMUX devices, Mach-Zehnder modulators, and micro-ring resonators or modulators implemented with silicon-based or silicon-nitride based slot waveguides with reduced sensitivity to temperature changes.
    Type: Grant
    Filed: October 30, 2020
    Date of Patent: October 25, 2022
    Assignee: Nokia Solutions and Networks Oy
    Inventors: Stefano Grillanda, Ting-Chen Hu
  • Patent number: 11372157
    Abstract: Photonic integrated circuits utilizing interferometric effects, such as wavelength multiplexers/demultiplexers, include a free-space coupling region having two core layers that have thermo-optic coefficients of opposite sign. The two core layers are configured to provide athermal or nearly-athermal operation. Described examples include integrated array waveguide grating devices and integrated echelle grating devices. Example material systems include LNOI and SOI.
    Type: Grant
    Filed: September 30, 2020
    Date of Patent: June 28, 2022
    Assignee: Nokia Solutions and Networks Oy
    Inventors: Stefano Grillanda, Ting-Chen Hu
  • Publication number: 20220137295
    Abstract: A photonic integrated circuit includes a slot optical waveguide having an optical core with sub-wavelength slot therein that is partially filled with a first lower-index material having a negative thermo-optic coefficient. The slot may also include a second lower-index material having a positive thermo-optic coefficient. The relative volume of the first lower-index material within the slot may be configured to provide athermal or nearly-athermal operation. Example applications include integrated AWG MUX/DEMUX devices, Mach-Zehnder modulators, and micro-ring resonators or modulators implemented with silicon-based or silicon-nitride based slot waveguides with reduced sensitivity to temperature changes.
    Type: Application
    Filed: October 30, 2020
    Publication date: May 5, 2022
    Inventors: Stefano GRILLANDA, Ting-Chen HU
  • Publication number: 20220099890
    Abstract: Photonic integrated circuits utilizing interferometric effects, such as wavelength multiplexers/demultiplexers, include a free-space coupling region having two core layers that have thermo-optic coefficients of opposite sign. The two core layers are configured to provide athermal or nearly-athermal operation. Described examples include integrated array waveguide grating devices and integrated echelle grating devices. Example material systems include LNOI and SOI.
    Type: Application
    Filed: September 30, 2020
    Publication date: March 31, 2022
    Inventors: Stefano GRILLANDA, Ting-Chen HU
  • Publication number: 20210226409
    Abstract: The temperature sensitivity of a reflective electro-absorption modulator can be reduced through the use, e.g., in the optical cavity thereof, of optical materials having positive and negative thermo-optic coefficients (TOCs). In some embodiments, a multiple-quantum-well structure of the modulator comprises positive-TOC materials, and a Bragg reflector bounding the optical cavity comprises one or more negative-TOC materials. In some embodiments, the thicknesses of the layers of positive- and negative-TOC materials are selected such that the average refractive index along the optical path through the modulator is approximately temperature independent. In some embodiments, the optical length of the optical cavity is an integer multiple of a nominal operating wavelength.
    Type: Application
    Filed: January 17, 2020
    Publication date: July 22, 2021
    Applicant: Nokia Solutions and Networks OY
    Inventors: Stefano Grillanda, Ting-Chen Hu
  • Patent number: 10727948
    Abstract: Optical transmitters, receivers, and transceivers implemented using a plurality of surface-coupled optical devices that can be manufactured on the same planar substrate and then post-processed to provide some of the devices with different respective partially transparent front mirrors compatible with and/or customized for different respective optical functions. When appropriately electrically biased and driven, different subsets of such devices can operate as lasers, optical modulators, optical amplifiers, and photodetectors, respectively. In this manner, an integrated array of such devices can be customized to provide the optical functions needed for the intended product. For example, an optical transmitter can be constructed using an integrated array that comprises three surface-coupled optical devices configured to operate as a laser, an optical modulator, and an optical amplifier, respectively.
    Type: Grant
    Filed: April 5, 2018
    Date of Patent: July 28, 2020
    Assignee: Nokia Solutions and Networks OY
    Inventors: Ting-Chen Hu, Stefano Grillanda
  • Publication number: 20190312644
    Abstract: Optical transmitters, receivers, and transceivers implemented using a plurality of surface-coupled optical devices that can be manufactured on the same planar substrate and then post-processed to provide some of the devices with different respective partially transparent front mirrors compatible with and/or customized for different respective optical functions. When appropriately electrically biased and driven, different subsets of such devices can operate as lasers, optical modulators, optical amplifiers, and photodetectors, respectively. In this manner, an integrated array of such devices can be customized to provide the optical functions needed for the intended product. For example, an optical transmitter can be constructed using an integrated array that comprises three surface-coupled optical devices configured to operate as a laser, an optical modulator, and an optical amplifier, respectively.
    Type: Application
    Filed: April 5, 2018
    Publication date: October 10, 2019
    Applicant: Nokia Solutions and Networks OY
    Inventors: Ting-Chen Hu, Stefano Grillanda
  • Publication number: 20190312642
    Abstract: A reflective optical data modulator includes a layer of optical material, a front partial optical reflector on a major surface of the layer of optical material, a back optical reflector, and at least two electrodes. The back optical reflector is at or near a portion of a second surface of the layer of optical material and faces the front partial optical reflector. The at least two, electrodes are located to enable application of a voltage across a portion of the layer of optical material. The layer of optical material has an optical absorption dependent on the voltage applied across the electrodes. The front partial optical reflector is an unburied layer structure.
    Type: Application
    Filed: April 4, 2019
    Publication date: October 10, 2019
    Inventors: David Thomas Neilson, Mark P. Earnshaw, Ting-Chen Hu
  • Patent number: 8238017
    Abstract: An optical path is configured to propagate an input optical signal. A plurality of electrodes are configured to produce a plurality of discrete phase shifts on the optical signal. An output optical signal is phase-shifted with respect to the input optical signal by a sum of the plurality of discrete phase shifts.
    Type: Grant
    Filed: December 18, 2009
    Date of Patent: August 7, 2012
    Assignee: Alcatel Lucent
    Inventors: Kun-Yii Tu, Ting-Chen Hu, Young-Kai Chen
  • Patent number: 8164819
    Abstract: In a radio frequency (RF)-photonic arbitrary waveform generator (AWG), an optical carrier signal is phase-modulated using an arbitrary waveform optical phase generator (AWPOG), which may include, e.g., sequential optical phase modulators. The phase-modulated optical signal is combined with a version of the optical carrier signal to yield an optical waveform, whose amplitude varies with a phase shift introduced by the AWPOG to the optical carrier signal. By manipulating electrical inputs to the AWPOG which control the phase shift, the optical waveform can be arbitrary shaped. The optical waveform may then be converted to an electrical waveform having a radio frequency.
    Type: Grant
    Filed: May 10, 2010
    Date of Patent: April 24, 2012
    Assignee: Alcatel Lucent
    Inventors: Kun-Yii Tu, Ting-Chen Hu, Young-Kai Chen
  • Publication number: 20110149369
    Abstract: An optical path is configured to propagate an input optical signal. A plurality of electrodes are configured to produce a plurality of discrete phase shifts on the optical signal. An output optical signal is phase-shifted with respect to the input optical signal by a sum of the plurality of discrete phase shifts.
    Type: Application
    Filed: December 18, 2009
    Publication date: June 23, 2011
    Applicant: Alcatel-Lucent USA, Incorporated
    Inventors: Kun-Yii Tu, Ting-Chen Hu, Y. K. Chen
  • Publication number: 20110149370
    Abstract: In a radio frequency (RF)-photonic arbitrary waveform generator (AWG), an optical carrier signal is phase-modulated using an arbitrary waveform optical phase generator (AWPOG), which may include, e.g., sequential optical phase modulators. The phase-modulated optical signal is combined with a version of the optical carrier signal to yield an optical waveform, whose amplitude varies with a phase shift introduced by the AWPOG to the optical carrier signal. By manipulating electrical inputs to the AWPOG which control the phase shift, the optical waveform can be arbitrary shaped. The optical waveform may then be converted to an electrical waveform having a radio frequency.
    Type: Application
    Filed: May 10, 2010
    Publication date: June 23, 2011
    Applicant: Alcatel-Lucent USA Inc.
    Inventors: Kun-Yii Tu, Ting-Chen Hu, Young-Kai Chen
  • Publication number: 20100054761
    Abstract: An optical receiver has a monolithically integrated electrical and optical circuit that includes a substrate with a planar surface. Along the planar surface, the monolithically integrated electrical and optical circuit has an optical hybrid, one or more variable optical attenuators, and photodetectors. The optical hybrid is connected to receive light beams, to interfere light of said received light beams with a plurality of relative phases and to output said interfered light via optical outputs thereof. Each of the one or more variable optical attenuators connects between a corresponding one of the optical outputs and a corresponding one of the photodetectors.
    Type: Application
    Filed: August 28, 2008
    Publication date: March 4, 2010
    Inventors: Young-Kai Chen, Christopher Richard Doerr, Vincent Etienne Houtsma, Ting-Chen Hu, Andreas Bertold Leven, David Thomas Neilson, Nils Guenter Weimann, Liming Zhang
  • Publication number: 20090324250
    Abstract: A wireless transmitter includes an optical modulator, an optical power splitter, a plurality of electrical drivers, and a plurality of antennas. The optical power splitter has a plurality of optical outputs and has an optical input connected to receive a modulated optical carrier from the optical modulator. Each driver is configured to detect a portion of the modulated optical carrier output by one of the optical outputs of the optical power splitter. Each antenna is connected to be driven by one of the electrical drivers.
    Type: Application
    Filed: December 19, 2008
    Publication date: December 31, 2009
    Inventors: Young-Kai Chen, Vincent Etienne Houtsma, Ting-Chen Hu, Nils Guenter Weimann
  • Patent number: 6440857
    Abstract: The present invention discloses a two-step CMP method and employed polishing compositions. In the first step, a first polishing slurry is provided to selectively polish the Al-alloy layer. Next, a second polishing slurry is provided to selectively polish the barrier layer. Accordingly, undesired surface non-planarity after the CMP process, such as metal dishing and corrosion of dielectric layers with complicated pattern geometry, can be avoided, and thus the planarization of wafer surfaces can be achieved.
    Type: Grant
    Filed: January 25, 2001
    Date of Patent: August 27, 2002
    Assignee: Everlight USA, Inc.
    Inventors: Yuan-Hsin Li, Ming-Shin Tsai, Chien-Hua Chiu, Bau-Tong Dai, Ting-Chen Hu