Abstract: Provided is a memory device including a substrate, a stack structure, a plurality of pads and an additional dielectric layer. The substrate has an array region and a staircase region. The stack structure is disposed on the substrate. The stack structure includes a plurality of dielectric layers and a plurality of conductive layers stacked alternately. The pads are disposed on the substrate in the staircase region. The pads are respectively connected to the conductive layers, so as to form a staircase structure. The additional dielectric layer is disposed on the stack structure to contact a topmost conductive layer of the conductive layers. A topmost pad of the pads includes a landing portion to contact a plug and an extension portion. The landing portion is laterally adjacent to the additional dielectric layer, and the extension portion extends over a top surface of the additional dielectric layer.

Abstract: The present application is directed to a cleavable polymer comprising one or more repeat units containing monomer A and one or more repeat units containing monomer B, wherein repeat unit containing monomer A and repeat unit containing monomer B are as described herein and to a process of preparing such a cleavable polymer. The present application is also directed to a cleavable polymer comprising one or more repeat units containing monomer C and one or more repeat units containing monomer D, wherein repeat unit containing monomer C and repeat unit containing monomer D are as described herein.

Abstract: A memory device includes a first stack structure, a second stack structure, a channel pillar, a storage layer, and a conductive pillar. The first stack structure includes a first insulating layer and a first conductive layer located on the first insulating layer. The second stack structure is located on the first stack structure and includes a plurality of second conductive layers and a plurality of second insulating layers which alternate with each other. The channel pillar penetrates through the second stack structure and extends to the first stack structure. The storage layer is located between the channel pillar and the first stack structure and between the channel pillar and the second stack structure. The conductive pillar is located in the first conductive layer and electrically connected to the first conductive layer and the substrate.

Abstract: A cover body for weed removing tool includes a heat dissipation port for heat dissipation. A cover sheet for regulating a size of the heat dissipation port is arranged at a position on the cover body corresponding to the heat dissipation port, and the cover sheet is connected to the cover body, and is subject to displacement relative to the cover body.

Abstract: An antenna structure and an electronic device are provided. The antenna structure includes a substrate with opposing first and second surfaces, a first radiating element with a first radiating portion and a second radiating portion, a third radiating portion, a feeding portion, and a grounding portion that are connected to the first radiating portion, a second radiating element separate from but coupling with the first radiating portion, a grounding element connected to the grounding portion, and a feeding element. The first radiating portion, the feeding portion, and the grounding portion are disposed on the first surface. The second radiating portion and the third radiating portion are disposed on the second surface. A projected area of the second radiating portion onto the first surface partially overlaps with the feeding portion. A projected area of the third radiating portion onto the first surface partially overlaps with the grounding portion.

Abstract: A gamma correction method and apparatus, electronic device and readable storage medium.

Abstract: The disclosure provides a time-lapse photographic device. The time-lapse photographic device includes a camera module, a drive module, an environment detection module, and a control unit. The drive module is connected to the camera module to drive the camera module to rotate. The environment detection module is configured to detect an external environment of the time-lapse photographic device to generate an environment detection signal. The control unit is electrically connected to the camera module, the drive module, and the environment detection module. The control unit generates, according to a shooting stop parameter, a plurality of intermittent drive signals to control the drive module, and controls the camera module to shoot at intervals of the drive signals. The control unit adjusts operation of at least one of the camera module and the drive module according to the environment detection signal.

Abstract: An integrated circuit structure includes a substrate, semiconductor devices, an inter-layer dielectric (ILD) structure, an interconnect, a dielectric layer, an etching barrier layer, a conductive layer, and memory units. The semiconductor devices are on the substrate. The ILD structure is over the semiconductor devices. The interconnect is in the ILD structure and electrically connected to the semiconductor devices. The dielectric layer is over the ILD structure. The etching barrier layer is on the first dielectric layer. The conductive layer is on the etching barrier layer. The memory units are stacked in a vertical direction over the etching barrier layer.

Abstract: The present disclosure provides use of Clostridium ghonii combined with a tumor angiogenesis inhibitor in preparing a pharmaceutical product for treating a tumor. The present disclosure further provides a drug for treating a tumor, where the drug includes active ingredients of Clostridium ghonii and a tumor angiogenesis inhibitor.

Abstract: The present disclosure relates to use of a Clostridium ghonii spore combined with pembrolizumab in cancer treatment. It is found for the first time that the Clostridium ghonii spore combined with pembrolizumab can significantly improve a curative effect of colon cancer and reduce a dose of the pembrolizumab, and thus is efficient and low-toxic. Oncolysis by Clostridium ghonii can affect immunogenicity of a tumor microenvironment (TME) by various ways, converts an immunosuppressive state of the TME into an immune-activated state, adjusts the immunosuppressive TME, and breaks an immune tolerance. An optimal combination of the Clostridium ghonii spore and the pembrolizumab thoroughly removes about 20% of mouse tumor tissues. A benefit range of patients with tumors treated by a PD-1 antibody is expanded. The combination even has an obvious curative effect on patients failed the treatment by the PD-1 antibody.

Abstract: A gamma correction method and apparatus, electronic device and readable storage medium.

Abstract: The present application is directed to a polymer comprising a moiety of formula: wherein X, Y, i, j, s, and k are as described herein and salts thereof and to a process of preparing such a polymer.

Abstract: A mobile device includes an NFC (Near Field Communication) antenna including a metal coil and a first dielectric substrate, a coupling metal element, and a second dielectric substrate. The metal coil is disposed on the first dielectric substrate. The coupling metal element is adjacent to the metal coil. The coupling metal element does not directly touch the metal coil. The coupling metal element is disposed on the second dielectric substrate. The coupling metal element is configured to adjust the operational frequency of the NFC antenna.

Abstract: An antenna structure and an electronic device are provided. The antenna structure includes a substrate with opposing first and second surfaces, a first radiating element with a first radiating portion and a second radiating portion, a third radiating portion, a feeding portion, and a grounding portion that are connected to the first radiating portion, a second radiating element separate from but coupling with the first radiating portion, a grounding element connected to the grounding portion, and a feeding element. The first radiating portion, the feeding portion, and the grounding portion are disposed on the first surface. The second radiating portion and the third radiating portion are disposed on the second surface. A projected area of the second radiating portion onto the first surface partially overlaps with the feeding portion. A projected area of the third radiating portion onto the first surface partially overlaps with the grounding portion.

Abstract: A semiconductor device includes a circuit board, a bottom plate, landing pads, a stack, support pillars, and memory pillars. The circuit board includes circuit structures and wires and has a peripheral area, an array area and a staircase area disposed between the peripheral area and the array area. The bottom plate is disposed on the circuit board, and the bottom plate includes a bottom conductive layer. The landing pads are embedded in at least a top portion of the bottom conductive layer and contact the bottom conductive layer in the staircase area. The stack is disposed on the bottom plate, and includes conductive layers and insulating layers alternately stacked along a first direction. The support pillars pass through the stack along the first direction and extend to the landing pads in the staircase area. The memory pillars pass through the stack along the first direction in the array area.

Abstract: The present disclosure provides methods for rapidly assaying the titer of an RNA viral vector such as a lentiviral vector. The method can be used to quickly evaluate the titer of intermediate products in various steps of a lentiviral vector production process.

Abstract: Provided is a memory device including a stack structure. The stack structure is in the memory array region of a substrate. The stack structure comprises a plurality of first insulating layers and a plurality of conductive layers stacked alternately on each other. A first staircase structure and a second staircase structure are located in a first staircase region and a second staircase region of the substrate respectively. The second staircase structure has steps descending from an upper layer proximal to the memory array region to a lower layer distal to the memory array region. Block slits and zone slit are disposed over the substrate in the second staircase region. The block slits divide the stack structure, the first staircase structure and the second staircase structure into memory blocks. The zone slits divide one of the memory blocks into a plurality of zones separately within the memory blocks.

Abstract: A memory device includes a substrate, a stack structure, a first staircase structure, and a first part of a second staircase structure. The substrate includes a plurality of blocks each having a staircase region, a memory array region, and a word line cutting region. The stack structure is located on the substrate in the memory array region, and includes first insulating layers and conductive layers alternately stacked on each other. The first staircase structure is located on the substrate in the staircase region, and includes first insulating layers and conductive layers alternately stacked on each other. The first part of the second staircase structure is located on the substrate in the word line cutting region, and includes first insulating layers and conductive layers alternately stacked on each other, and two first parts of two second staircase structures in two adjacent blocks are separated from each other.

Abstract: An escalator equipment alert method and an escalator equipment alert system are disclosed. The method includes: activating a camera disposed on an entrance of an escalator equipment; capturing a foot image of a passenger about to board the escalator equipment through the camera; performing an image analyzation on the foot image to detect a danger boarding behavior related to the passenger; and in response to the danger boarding behavior, issuing an alert message matched with the danger boarding behavior through an alert device.