Abstract: The electronic device includes a folding apparatus and a flexible display. The folding apparatus is configured to bear the flexible display. An elastic component of the folding apparatus may transfer an elastic force to the flexible display by using a housing of the folding apparatus. A force that is away from a main shaft and that is applied to the flexible display when the electronic device is in a flattened state is greater than a force that is away from the main shaft and that is applied to the flexible display when the electronic device is in a closed state.

Abstract: Aspects of the present disclosure provide a method for training a predictor that predicts performance of a plurality of machine learning (ML) models on platforms. For example, the method can include converting each of the ML models into a plurality of instructions or the instructions and a plurality of intermediate representations (IRs). The method can also include simulating execution of the instructions corresponding to each of the ML models on a platform and generating instruction performance reports. Each of the instruction performance reports can be associated with performance of the instructions corresponding to one of the ML models that are executed on the platform. The method can also include training the predictor with the instructions or the IRs as learning features and the instruction performance reports as learning labels, compiling the predictor into a library file, and storing the library file in a storage device.

Abstract: The present invention relates to the field of medical biology, and discloses a single domain antibody and derivative proteins thereof against CTLA4. In particular, the present invention discloses a CTLA4 binding protein and the use thereof, especially the use for treating and/or preventing CTLA4 relevant diseases such as tumor.

Abstract: This application provides a live streaming processing method performed by an electronic device. The method includes: displaying a live streaming room, the live stream room having a host account, a host sub-account and multiple viewer accounts, the host sub-account being used for assisting the host account of the live streaming room in operation; receiving real-time live streaming data of the live streaming room, and displaying a live streaming content on a live streaming room page according to the real-time live streaming data, the real-time live streaming data collected from the host account and the viewer accounts; and displaying, in response to a live streaming room operation of the host sub-account, an operation result of the live streaming room operation of the host sub-account in the live streaming room, wherein the operation result of the live streaming room operation updates the live streaming content on the live streaming room page.

Abstract: An antenna supports a first working mode and a second working mode. The antenna includes a first antenna subarray group, a second antenna subarray group, and a third antenna subarray group. The first antenna subarray group and the second antenna subarray group are used in the first working mode, and the first antenna subarray group and the third antenna subarray group are used in the second working mode.

Abstract: A dual-cation metal battery and a charging and discharging method thereof are disclosed to reduce the cost of materials, maintain the long-term service life and provide multiple varied applications. The dual-cation metal battery includes a positive electrode, a negative electrode, an electrolyte solution and a separator. The positive electrode includes a positive-electrode material selected from the group consisting of heterosite (FePO4), lithium iron phosphate (LiFePO4) and LixNa1-xFePO4, and 0<x<1. The negative electrode includes a metal mixture consisting of lithium metal and sodium metal, and the weight ratio of lithium metal to sodium metal is 1:3. The electrolyte solution is disposed between the positive electrode and the negative electrode. The separator is disposed in the electrolyte solution, and the positive electrode and the negative electrode are separated from each other by the separator.

Abstract: A method, computer system, and computer program product for data monitoring management are provided. A first invalid zero value candidate from a data stream is received. A memory location for the first invalid zero value candidate is received. At a first time an access connection to the memory location is established. At a second time subsequent to the first time the access connection to the memory location is checked. Based on the checking, a determination is made whether the first invalid zero value candidate contains an invalid zero value.

Abstract: A chip structure is provided. The chip structure includes a substrate. The chip structure includes a conductive line over the substrate. The chip structure includes a first passivation layer over the substrate and the conductive line. The chip structure includes a conductive pad over the first passivation layer covering the conductive line. The conductive pad is thicker and wider than the conductive line. The chip structure includes a first conductive via structure and a second conductive via structure passing through the first passivation layer and directly connected between the conductive pad and the conductive line. The chip structure includes a conductive pillar over the conductive pad.

Abstract: A method for forming a semiconductor device structure is provided. The method includes providing a chip structure including a substrate and a wiring structure over a first surface of the substrate. The method includes removing a first portion of the wiring structure adjacent to the hole to widen a second portion of the hole in the wiring structure. The second portion has a first width increasing in a first direction away from the substrate. The method includes forming a first seed layer over the wiring structure and in the hole. The method includes thinning the substrate from a second surface of the substrate until the first seed layer in the hole is exposed. The method includes forming a second seed layer over the second surface of the substrate and the first seed layer in the hole.

Abstract: First graph structure data indicating connectivity relationships mined for N object nodes is generated based on node representation parameters. The first graph structure data and node traffic data including T traffic values of each object node at T time points is processed to obtain N first embedded representations of the N object nodes. Second graph structure data indicating original connectivity relationships pre-generated for N object nodes and the node traffic data are processed to obtain N second embedded representations of the N object nodes. Fusion processing is performed on the N first embedded representations and the N second embedded representations to obtain a fused representation matrix, which is processed with the T traffic values. A predicted traffic value of each object node after the T time points is determined. Parameters are updated in a traffic prediction system based on the predicted traffic value and a corresponding actual traffic value.

Abstract: The present invention relates to compositions comprising one or more compounds and/or extracts which induce, promote and/or improve production/release/delivery/excretion of mucin from and/or in the cornea, and methods of using the compositions to treat the eye.

Abstract: The present invention relates to compositions comprising one or more compounds and/or extracts which induce, promote and/or improve production/release/delivery/excretion of hyaluronic acid from and/or in the cornea, and methods of using the compositions to treat the eye.

Abstract: The present application discloses a composition, an adhesive film including the composition and a chip packaging structure. The composition includes epoxy resin, a surfactant, a curing agent and filler, wherein the surfactant is selected from a modified hexafluoropropylene compound. The surfactant in the composition is the modified hexafluoropropylene compound, the modified hexafluoropropylene compound is lower in surface energy, good in water resistance and oil resistance and capable of effectively lowering the surface tension of the composition, and therefore, when being used for preparing the adhesive film, the composition is higher in coating wettability. In, addition, the composition has stronger chemical cleaning resistance, and in a process that a residual solder flux obtained in a soldering process of a chip is cleaned, a chip protection film prepared from the composition has stronger cleaning resistance to an alkaline solution so as not to be easy to fall off.

Abstract: Provided are an electrode plate and a secondary battery having the same. The electrode plate comprises a current collector and an active material layer, wherein the current collector comprises a main body portion and tabs, the active material layer is coated on the surface of the main body portion, and the tabs extend from one end of the main body portion along the first direction; a first insulating portion is formed on the end face of the main body portion that is provided with the tabs, and a second insulating portion different from the first insulating portion is formed on the end faces of the main body portion that are not provided with the tabs. The electrode plate of the present application has a good end-face insulation protection and can improve the safety performance of the secondary battery.

Abstract: Semiconductor structures and methods of forming the same are provided. A semiconductor structure according to the present disclosure includes an active region having a channel region and a source/drain region, a gate structure over the channel region, a gate spacer layer disposed over the channel region and extending along a sidewall of the gate structure, an epitaxial source/drain feature over the source/drain region, a contact etch stop layer (CESL) disposed on the epitaxial source/drain feature and extending along a sidewall of the gate spacer layer, a source/drain contact disposed over the epitaxial source/drain feature, and a dielectric cap layer disposed over the gate structure, the gate spacer layer and at least a portion of the CESL. A sidewall of the source/drain contact is in direct contact with a sidewall of the CESL.

Abstract: The present application discloses a composition, an adhesive film including the composition and a chip packaging structure. The composition includes epoxy resin, a surfactant, a curing agent and filler, wherein the surfactant is selected from a modified hexafluoropropylene compound. The surfactant in the composition is the modified hexafluoropropylene compound, the modified hexafluoropropylene compound is lower in surface energy, good in water resistance and oil resistance and capable of effectively lowering the surface tension of the composition, and therefore, when being used for preparing the adhesive film, the composition is higher in coating wettability. In addition, the composition has stronger chemical cleaning resistance, and in a process that a residual solder flux obtained in a soldering process of a chip is cleaned, a chip protection film prepared from the composition has stronger cleaning resistance to an alkaline solution so as not to be easy to fall off.

Abstract: A multi-signal fluorescent probe, represented by: A method for preparing the multi-signal fluorescent probe includes: (a) adding 2-methoxyphenothiazine and ethyl iodide into a mixture of dichloromethane (DCM) and acetonitrile followed by a first reaction and a first post-treatment to obtain 10-ethyl-2-methoxy-10H-phenothiazine; (b) adding boron tribromide into the 10-ethyl-2-methoxy-10H-phenothiazine under an inert gas followed by a second reaction under an ice bath and a second post-treatment to obtain 10-ethyl-10H-phenothiazin-2-ol; and (c) mixing the 10-ethyl-10H-phenothiazin-2-ol, malonic acid, zinc chloride and phosphorus oxychloride followed by a third reaction and a third post-treatment to obtain the multi-signal fluorescent probe. A use of the multi-signal fluorescent probe in the detection of intracellular ONOO? and Na2S2 is also provided.

Abstract: In an embodiment, a device includes: a passivation layer on a semiconductor substrate; a first redistribution line on and extending along the passivation layer; a second redistribution line on and extending along the passivation layer; a first dielectric layer on the first redistribution line, the second redistribution line, and the passivation layer; and an under bump metallization having a bump portion and a first via portion, the bump portion disposed on and extending along the first dielectric layer, the bump portion overlapping the first redistribution line and the second redistribution line, the first via portion extending through the first dielectric layer to be physically and electrically coupled to the first redistribution line.

Abstract: Disclosed is a preservation method for fresh wet rice noodles or fresh wet brown rice noodles, belonging to the technical field of food. According to the present disclosure, ?-polylysine hydrochloride, pyrophosphate, glycerol, sodium chloride, a highly water-soluble starch-dextrin complex, rice flour and water are mixed together, and the obtained mixture is stirred evenly to obtain a mixed system; and extrusion forming, first-stage aging, re-steaming, second-stage aging and rehydration are performed on the mixed system to obtain the fresh wet rice noodles or fresh wet brown rice noodles. Furthermore, the present disclosure employs a combination of thermodynamic sterilization and chemical preservation to preserve the fresh wet rice noodles, thereby prolonging the shelf life of the fresh wet rice noodles or fresh wet brown rice noodles to 2 months or more and keeping the quality thereof good.

Abstract: A micro electro mechanical system (MEMS) includes a circuit substrate comprising electronic circuitry, a support substrate having a recess, a bonding layer disposed between the circuit substrate and the support substrate, through holes passing through the circuit substrate to the recess, a first conductive layer disposed on a front side of the circuit substrate, and a second conductive layer disposed on an inner wall of the recess. The first conductive layer extends into the through holes and the second conductive layer extends into the through holes and coupled to the first conductive layer.