Abstract: Embodiments of the disclosure provide a circuit, chip, system, and method for eliminating random perturbation. The circuit includes a weight calculating module for receiving digital signals and random perturbation digital quantity, using least mean square error algorithm to calculate weight deviation iteration coefficient based on digital signal and digital quantity, and updating perturbation weight in real-time according to weight deviation iteration coefficient; and a perturbation eliminating module for eliminating perturbation signal in output digital signal of quantizer according to perturbation weight updated in real-time and updating perturbation weight in real-time according to weight deviation iteration coefficient, and then calculating current perturbation weight in real time to realize self-calibration of perturbation weight.

Abstract: The embodiments of the present disclosure provide a detachable anti-vibration sealing protection device for a pipe flange. The protection device includes a casing, wherein left and right end surfaces of the casing have through holes for the pipeline to pass through, and the casing has an accommodation cavity for placing the flange; a first shock absorption assembly for radial shock absorption of the flange; and a second shock absorption assembly which is installed in a one-to-one correspondence with the flange and is configured for axial shock absorption of the corresponding flange. The first shock absorption assembly and the second shock absorption assembly are installed in the accommodation cavity.

Abstract: A method for manufacturing a circuit board circuit board for transmitting high-frequency signal, including: providing a first-line circuit board (20), a second circuit board (40), at least one third circuit board (50), a fourth circuit board (60), a fifth circuit board (61), and a sixth circuit board (62); stacking the first circuit board (20), the second circuit board (40), and third circuit board (50) in that order, and stacking the fourth circuit board (60), the sixth circuit board (62), and the fifth circuit board (61) on the third circuit board (50), and pressing them together to obtain the circuit board circuit board for transmitting high-frequency signal. The method manufacturing the circuit board circuit board for transmitting high-frequency signal can reduce a width of the transmission line. The present disclosure further provides the circuit board circuit board for transmitting high-frequency signal obtained by the above method.

Abstract: Disclosed are a new AXL-targeting monoclonal antibody and antibody-drug conjugate. Also disclosed is a method for preparing said antibody and antibody-drug conjugate. The AXL antibody of the present invention can bind with purified human AXL protein and multiple AXL on tumor cell surface with high effectiveness and high specificity. Said humanized antibody also has high affinity and low immunogenicity. Said AXL antibody-drug conjugate has markable performance against tumors having high AXL expression.

Abstract: A behavior recognition device for recognizing behaviors of a semiconductor manufacturing apparatus includes a storage device and a control unit. The storage device is configured to store log data of the semiconductor manufacturing apparatus. The control unit is cooperatively connected to the storage device, and configured to build a transition state model based on the log data to analyze behaviors related to wafer transfer sequences and manufacturing operations of the semiconductor manufacturing apparatus.

Abstract: An optical system affixed to an electronic apparatus is provided, including a first optical module, a second optical module, and a third optical module. The first optical module is configured to adjust the moving direction of a first light from a first moving direction to a second moving direction, wherein the first moving direction is not parallel to the second moving direction. The second optical module is configured to receive the first light moving in the second moving direction. The first light reaches the third optical module via the first optical module and the second optical module in sequence. The third optical module includes a first photoelectric converter configured to transform the first light into a first image signal.

Abstract: An optical fiber transmission device includes a substrate, a photonic integrated circuit, and an optical fiber assembly. The photonic integrated circuit is disposed on an area of the substrate. The substrate has a protruding structure at an interface with an edge of the photonic integrated circuit. The optical fiber assembly includes an optical fiber and a ferrule that sleeves the optical fiber. The protruding structure of the substrate is configured to abut against the ferrule to limit the position of the optical fiber assembly in a vertical direction of the substrate, such that the protruding structure is a stopper for the optical fiber assembly in the vertical direction.

Abstract: A method for forming a semiconductor device structure is provided. The method includes forming an interconnect structure over a substrate. The method includes forming a first conductive pad and a mask layer over the interconnect structure. The mask layer covers a top surface of the first conductive pad. The method includes forming a metal oxide layer over a sidewall of the first conductive pad. The method includes forming a second conductive pad over the first conductive pad and passing through the mask layer. The first conductive pad and the second conductive pad are made of different materials.

Abstract: An optical fiber network device includes a fiber and a photonic integrated circuit. Fiber receives a first optical signal and transmits a second optical signal. A first wavelength of first optical signal is different from a second wavelength of second optical signal. Photonic integrated circuit includes a laser chip, a photodetector, a wavelength division multiplexing coupler, a first optical modulation element and a second optical modulation element. Laser chip is disposed on photonic integrated circuit, and is configured to generate first optical signal. Photodetector detects second optical signal. Wavelength division multiplexing coupler is configured to couple first optical signal to fiber, and receives second optical signal. First optical modulation element is coupled to wavelength division multiplexing coupler and laser chip, and is configured to modulate first optical signal.

Abstract: Certain aspects of the present disclosure provide techniques for global motion modeling. Embodiments include receiving a first image and a second image from a camera attached to a moving object. Embodiments include identifying a pixel in the first image. Embodiments include determining, based on one or more parameters associated with the camera, a vector representing a range of locations in which a real-world point corresponding to the pixel is likely to be found in the second image, wherein the parameters associated with the camera comprise: a first parameter related to a location of the camera relative to a ground surface; a second parameter related to motion of the moving object; and a third parameter related to an orientation of the camera relative to the ground surface. Embodiments include determining, using the vector, a location of the real-world point in the second image.

Abstract: An automatic target image acquisition and calibration system for application in a defect inspection system is disclosed. During the defect inspection system working normally, the automatic target image acquisition and calibration system is configured to find a recognition structure from an article under inspection, and then determines a relative position and a relative 3D coordinate if the article. Therefore, a robotic arm is controlled to carry a camera to precisely face each of a plurality of inspected surfaces of the article, such that a plurality of article images are acquired by the camera. It is worth explaining that, during the defect inspection of the article, there is no need to modulate an image acquiring height and an image acquiring angle of the camera and an illumination of a light source.

Abstract: A full-automatic detection apparatus and system for important zoonotic pathogen, and a control method therefor. The full-automatic detection apparatus for important zoonotic pathogen includes: a base capable of moving; an air collection device, configured to collect a to-be-detected sample in air along with the movement of the base; a nucleic acid detection and analysis device, configured to detect the to-be-detected sample collected by the air collection device to determine whether an infectious pathogen exists in the to-be-detected sample; an intelligent mobile device, configured to plan and control a moving path of the base; and a control device, configured to control the intelligent mobile device to plan and control the moving path of the base and to control a sampling period of the air collection device according to a control instruction of the terminal, and transmit a detection result from the nucleic acid detection and analysis device to the terminal.

Abstract: An unlocking method using augmented reality includes projecting an augmented reality setting interface after an augmented reality device obtains an unlocking authority of a lock system. The augmented reality setting interface is used to set an unlocking information. The augmented reality device projects an augmented reality unlocking interface when a wearer of the augmented reality device intends to proceed with an unlocking operation of the lock system. The augmented reality unlocking interface is used to input a real-time unlocking information. The lock system is unlocked when the real-time unlocking information matches with the unlocking information.

Abstract: A sun protection device is provided, which includes a main body and an S-type polarizer. The main body has an outer surface and an inner surface opposite to each other, and the outer surface is configured to face sunlight, and the main body has a plurality of voids disposed inside the main body, on the inner surface of the main body or a combination thereof, in which when the sunlight irradiates the outer surface of the main body, a first reflected light and a first refracted light are formed, and the first refracted light enters the main body, and when the first refracted light arrives at a surface of one of the voids facing the outer surface, a second reflected light is formed. The S-type polarizer is adjacent to the inner surface of the main body.

Abstract: A dummy gate structure may be formed for a semiconductor device. The dummy gate structure may be formed from an amorphous polysilicon layer. The amorphous polysilicon layer may be deposited in a blanket deposition operation. An annealing operation is performed for the semiconductor device to remove voids, seams, and/or other defects from the amorphous polysilicon layer. The annealing operation may cause the amorphous polysilicon layer to crystallize, thereby resulting in the amorphous polysilicon layer transitioning into a crystallized polysilicon layer. A dual radio frequency (RF) source etch technique may be performed to increase the directionality of ions and radicals in a plasma that is used to etch the crystallized polysilicon layer to form the dummy gate structure. The increased directionality of the ions increases the effectiveness of the ions in etching through the different crystal grain boundaries which increases the etch rate uniformity across the crystallized polysilicon layer.

Abstract: A method for unlocking the lock using real-time wireless power supply includes proceeding with authentication identification of a powerless lock by an electronic key after pairing. Power is wirelessly supplied from the electronic key to the lock when the authentication identification starts or the authentication identification passes. The lock obtains the power wirelessly supplied from the lock to operate. When the authentication identification is identified as being successful, the electronic key outputs an unlocking command to the lock. The lock receiving the unlocking command proceeds with an unlocking operation using the power supplied wirelessly.

Abstract: A method for operating a lock device includes installing a lock device application (lock APP) into a mobile device. A first identification information and a second identification information are inputted into the mobile device under guidance of the lock APP The lock APP can be connected with a lock device within a communication range of the mobile device. Then, a hardware serial number of the lock device is inputted into the mobile device to obtain the management authority of the lock device. A manager electronic key formed by the mobile device with the management authority of at least one lock device can grant the unlocking authority of a selected lock device to another user whose account name is provided to the manager electronic key. The unlocking procedure can be carried out based on one of a quick pass pattern, a single identification pattern, and a double identification pattern.

Abstract: A method for unlocking the lock using real-time wireless power supply includes proceeding with authentication identification of a powerless lock by an electronic key after pairing. Power is wirelessly supplied from the electronic key to the lock when the authentication identification starts or the authentication identification passes. The lock obtains the power wirelessly supplied from the lock to operate. When the authentication identification is identified as being successful, the electronic key outputs an unlocking command to the lock. The lock receiving the unlocking command proceeds with an unlocking operation using the power supplied wirelessly.

Abstract: An emergency evacuation process includes setting at least one emergency refuge area in a place and creating an electronic map based on the disposition of the place. A plurality of door locks mounted in the place is connected with a control device. A gunshot event information containing the gunshot location is sent to a server when a gunshot event is detected. The server indicates the gunshot location and the suggested emergency refuge area on the electronic map. Each person in the place can rapidly know the gunshot location and the emergency refuge area to avoid direct encounter with the gunman.

Abstract: A wafer supporting mechanism and a method for wafer dicing are provided. The wafer supporting mechanism includes a base portion and a support portion. The base portion includes a first gas channel and a first outlet connected to the first gas channel. The support portion is connected to the base portion and including a second gas channel connected to the first gas channel. An accommodation space is defined by the base portion and the support portion.