Abstract: A system for batch forming a sheet of spring elements in three dimensions is described. A spring element sheet containing spring elements defined in two dimensions is arranged between two mating die press plates. A force is applied to the mating die press plates to form the two-dimensional spring contact elements into three dimensions. Alternatively, configurable die press plates are used to selectively form a two-dimensional spring element sheet into three-dimensional spring contacts.

Abstract: The present invention provides a clamp with spring contact elements to receive and secure a flat flex cable with exposed electrical traces to an electrical circuit such as on a printed circuit board. The clamp of the present invention has features for enhanced registration and alignment of exposed electrical traces on the flat flex cable to the spring contact elements in the clamp. Another aspect of the invention is the ability to connect high density contact arrays within the clamp to a circuit board via an array of contact pads on the opposite side of the substrate on which the spring contact elements are disposed. One exemplary application of the present invention is to connect a camera module in a cell phone to a printed circuit board or like electrical device in the phone.

Abstract: A system for batch forming a sheet of spring elements in three dimensions is described. A spring element sheet containing spring elements defined in two dimensions is arranged between two mating die press plates. A force is applied to the mating die press plates to form the two-dimensional spring contact elements into three dimensions. Alternatively, configurable die press plates are used to selectively form a two-dimensional spring element sheet into three-dimensional spring contacts.

Abstract: The current existing interconnect technologies, for example, spring probes, bent metals, fuzz buttons, etc. have the characteristics that combine the two major functions of electrical connectivity and mechanical compliance into one component. That makes it extremely difficult to improve electrical performance without sacrificing the mechanical compliance, or vice versa, especially when the pitch of the contact array becomes smaller and smaller as well as the signal speed of the electronics devices becomes higher and higher. The present invention separates the above mentioned two major functions of electrical connectivity and mechanical compliance from one component and integrates these functions into one interconnect cartridge. The present invention makes it possible to enhance both electrical performance and mechanical compliance at the same time.