Patents by Inventor Tino Karczeweski

Tino Karczeweski has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic module
    Patent number: 8836113
    Abstract: An electronic module. One embodiment includes a carrier. A first transistor is attached to the carrier. A second transistor is attached to the carrier. A first connection element includes a first planar region. The first connection element electrically connects the first transistor to the carrier. A second connection element includes a second planar region. The second connection element electrically connects the second transistor to the carrier. In one embodiment, a distance between the first planar region and the second planar region is smaller than 100 ?m.
    Type: Grant
    Filed: August 14, 2012
    Date of Patent: September 16, 2014
    Assignee: Infineon Technologies AG
    Inventors: Stefan Landau, Erwin Huber, Josef Hoeglauer, Joachim Mahler, Tino Karczeweski
  • ELECTRONIC MODULE
    Publication number: 20120306069
    Abstract: An electronic module. One embodiment includes a carrier. A first transistor is attached to the carrier. A second transistor is attached to the carrier. A first connection element includes a first planar region. The first connection element electrically connects the first transistor to the carrier. A second connection element includes a second planar region. The second connection element electrically connects the second transistor to the carrier. In one embodiment, a distance between the first planar region and the second planar region is smaller than 100 ?m.
    Type: Application
    Filed: August 14, 2012
    Publication date: December 6, 2012
    Applicant: INFINEON TECHNOLOGIES AG
    Inventors: Stefan Landau, Erwin Huber, Josef Hoeglauer, Joachim Mahler, Tino Karczeweski
  • Electronic module
    Patent number: 8253241
    Abstract: An electronic module. One embodiment includes a carrier. A first transistor is attached to the carrier. A second transistor is attached to the carrier. A first connection element includes a first planar region. The first connection element electrically connects the first transistor to the carrier. A second connection element includes a second planar region. The second connection element electrically connects the second transistor to the carrier. In one embodiment, a distance between the first planar region and the second planar region is smaller than 100 ?m.
    Type: Grant
    Filed: May 20, 2008
    Date of Patent: August 28, 2012
    Assignee: Infineon Technologies AG
    Inventors: Stefan Landau, Erwin Huber, Josef Hoeglauer, Joachim Mahler, Tino Karczeweski
  • ELECTRONIC MODULE
    Publication number: 20090289354
    Abstract: An electronic module. One embodiment includes a carrier. A first transistor is attached to the carrier. A second transistor is attached to the carrier. A first connection element includes a first planar region. The first connection element electrically connects the first transistor to the carrier. A second connection element includes a second planar region. The second connection element electrically connects the second transistor to the carrier. In one embodiment, a distance between the first planar region and the second planar region is smaller than 100 ?m.
    Type: Application
    Filed: May 20, 2008
    Publication date: November 26, 2009
    Applicant: INFINEON TECHNOLOGIES AG
    Inventors: Stefan Landau, Erwin Huber, Josef Hoeglauer, Joachim Mahler, Tino Karczeweski