Abstract: A method and apparatus for recovering and stabilizing photovoltaic performance of a thin-film solar module after lamination. The method includes a LED light soaking treatment prior to a forward biasing treatment of the thin-film photovoltaic material formed on a glass panel. The apparatus for implementing the method comprises an in-line system for loading the laminated solar panel on a conveyor to pass through a first process station to allow a brief LED light illumination followed by disposing the same laminated glass panel in a second process station to receive a forward bias treatment including applying multiple short electrical pulses with a constant current through the thin-film solar module. The photovoltaic performance of the laminated thin-film solar module after these treatments is recovered to substantially a same level obtained in a bare-circuit configuration and is stabilized substantially free from being affected by any further long-time light soaking.

Abstract: An apparatus for mounting a frameless solar module includes a top member made by a solid material including two contact pads and a bottom member made by a rubber material including two upward rounded end bumps. The top member and the bottom member are operably fixed by a screw set in a symmetric mounting configuration. The contact pad is also made from the rubber material for pressing onto a top cover glass panel near an edge region. The upward rounded end bump is for supporting a portion of a bottom substrate glass panel at a first offset distance away from the top cover glass panel and a horizontal offset distance away from the edge region. The first offset distance is adjusted to a thickness of the frameless solar module and the second distance is predetermined for providing adequate support of the frameless solar module to allow uninhibited flexion under load.

Abstract: An apparatus for mounting a frameless solar module includes a top member made by a solid material including two contact pads and a bottom member made by a rubber material including two upward rounded end bumps. The top member and the bottom member are operably fixed by a screw set in a symmetric mounting configuration. The contact pad is also made from the rubber material for pressing onto a top cover glass panel near an edge region. The upward rounded end bump is for supporting a portion of a bottom substrate glass panel at a first offset distance away from the top cover glass panel and a horizontal offset distance away from the edge region. The first offset distance is adjusted to a thickness of the frameless solar module and the second distance is predetermined for providing adequate support of the frameless solar module to allow uninhibited flexion under load.

Abstract: A microwave circuit has an electrical prong for external circuit connection, a ground and a dipole antenna. A circuit board supports the microwave circuit. A heat sink is mounted on the circuit board and has high thermal and electrical conductivity for conducting heat from the electrical circuit and conducting electricity relative to the circuit ground. The heat sink includes a cylindrical boss extending away from the circuit board and having a reduced diameter upper rim and a threaded internal bore having a partially closed bottom. The circuit prong extends into the bore through the bore bottom and is electrically isolated from the heat sink. A cover encloses the circuit, circuit board and heat sink. It has low electrical and thermal conductivity and has an opening into which the reduced diameter upper rim of the heat sink boss extends. An outer sleeve is sized to receive the cover and has high thermal and electrical conductivity and an opening.