Patents by Inventor Tokihiko Mori

Tokihiko Mori has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11184978
    Abstract: An object to provide an electric device easy to manufacture, extensible and of high quality. The electric device comprises a plurality of module boards 51, the module boards 51 piled up on one another, each of the module boards 51 provided with an electrode 53 on its surface, the electrodes 53 on the piled-up module boards 51 generally positioned along a vertical straight line; and a connector 11 connecting the module boards 51, the connector 11 including a body portion 21, the body portion 21 electrically connecting the electrodes 53 positioned along the vertical straight line, and a holder 12 holding the body portion 21, the holder 12 including a board engagement portion and a holder connecting portion, the board engagement portion engaging with the module board 51 so that the connector 11 is mounted on the module board 51, and the holder connecting portion engaging with another holder connecting portion so that the connector 11 is coupled to another vertically adjacent connector 11.
    Type: Grant
    Filed: February 12, 2019
    Date of Patent: November 23, 2021
    Assignee: THE FOUNDATION FOR THE PROMOTION OF INDUSTRIAL SCIENCE
    Inventors: Takayasu Sakurai, Makoto Takamiya, Tokihiko Mori
  • Publication number: 20210337668
    Abstract: An object to provide an electric device easy to manufacture, extensible and of high quality. The electric device comprises a plurality of module boards 51, the module boards 51 piled up on one another, each of the module boards 51 provided with an electrode 53 on its surface, the electrodes 53 on the piled-up module boards 51 generally positioned along a vertical straight line; and a connector 11 connecting the module boards 51, the connector 11 including a body portion 21, the body portion 21 electrically connecting the electrodes 53 positioned along the vertical straight line, and a holder 12 holding the body portion 21, the holder 12 including a board engagement portion and a holder connecting portion, the board engagement portion engaging with the module board 51 so that the connector 11 is mounted on the module board 51, and the holder connecting portion engaging with another holder connecting portion so that the connector 11 is coupled to another vertically adjacent connector 11.
    Type: Application
    Filed: February 12, 2019
    Publication date: October 28, 2021
    Applicant: THE FOUNDATION FOR THE PROMOTION OF INDUSTRIAL SCIENCE
    Inventors: TAKAYASU SAKURAI, MAKOTO TAKAMIYA, TOKIHIKO MORI
  • Publication number: 20210328417
    Abstract: A wiring sheet includes one or more carbon wires each of which is one of a signal line and a power supply line, and which are conductors including carbon as a main material and have flexibility; and an insulation sheet that encloses substantially an entirety of the one or more carbon wires, includes an electrical insulator as a main material, and has flexibility.
    Type: Application
    Filed: July 25, 2017
    Publication date: October 21, 2021
    Inventors: Tsuyoshi SEKITANI, Takafumi UEMURA, Shusuke YOSHIMOTO, Teppei ARAKI, Yuki NODA, Takayasu SAKURAI, Tokihiko MORI, Makoto TAKAMIYA
  • Patent number: 7491102
    Abstract: According to one embodiment, a printed circuit wiring board includes: a substrate having a conductor pattern thereon; a flexible flat cable including a connection section; and a connector including a contact section, a fitting port section and a housing. The contact section includes a first area and a second area provided on the first area. The first area contains copper. The second area has a surface containing tin and copper. The fitting port section is fitted to the connection section to connect with the contact section. The flexible flat cable includes a pair of insulating sheets and a plurality of conductors arranged therebetween. The conductors contain tin and copper and have the connection section on end portions. The connection section includes a first region and a second region provided on the first region. The first region contains copper. The second region has a surface containing tin and copper.
    Type: Grant
    Filed: July 26, 2006
    Date of Patent: February 17, 2009
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Tokihiko Mori, Masaya Hirashima
  • Patent number: 7320602
    Abstract: According to one embodiment, there is provided a substrate structure including a printed-wiring board. A micro-contact sheet is soldered to the printed-wiring board, and includes a spiral terminal on a first surface thereof and a pad on a second surface thereof. The pad is electrically connected to the spiral terminal. A holding jig presses the micro-contact sheet against the printed-wiring board such that the second surface of the micro-contact sheet contacts with the printed-wiring board.
    Type: Grant
    Filed: December 7, 2006
    Date of Patent: January 22, 2008
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Tokihiko Mori, Sadao Makita
  • Publication number: 20070149025
    Abstract: According to one embodiment, there is provided a substrate structure including a printed-wiring board. A micro-contact sheet is soldered to the printed-wiring board, and includes a spiral terminal on a first surface thereof and a pad on a second surface thereof. The pad is electrically connected to the spiral terminal. A holding jig presses the micro-contact sheet against the printed-wiring board such that the second surface of the micro-contact sheet contacts with the printed-wiring board.
    Type: Application
    Filed: December 7, 2006
    Publication date: June 28, 2007
    Inventors: Tokihiko Mori, Sadao Makita
  • Publication number: 20070076395
    Abstract: According to one embodiment, a component-fixing device having a flexible substrate, a positioning member and a socket unit. The flexible substrate includes a plurality of connection terminals that connect a circuit component to a printed wiring board. The positioning member holds the flexible substrate, positions the flexible substrate on the printed wiring board, and makes the flexible substrate tightly contact the printed wiring board when the flexible substrate is soldered to the printed wiring board. The socket unit secured to the printed wiring board, in place of the positioning member, holds the circuit component on the flexible substrate.
    Type: Application
    Filed: August 30, 2006
    Publication date: April 5, 2007
    Inventors: Tokihiko Mori, Sadao Makita
  • Publication number: 20070026724
    Abstract: According to one embodiment, a printed circuit wiring board includes: a substrate having a conductor pattern thereon; a flexible flat cable including a connection section; and a connector including a contact section, a fitting port section and a housing. The contact section includes a first area and a second area provided on the first area. The first area contains copper. The second area has a surface containing tin and copper. The fitting port section is fitted to the connection section to connect with the contact section. The flexible flat cable includes a pair of insulating sheets and a plurality of conductors arranged therebetween. The conductors contain tin and copper and have the connection section on end portions. The connection section includes a first region and a second region provided on the first region. The first region contains copper. The second region has a surface containing tin and copper.
    Type: Application
    Filed: July 26, 2006
    Publication date: February 1, 2007
    Inventors: Tokihiko Mori, Masaya Hirashima
  • Publication number: 20060266548
    Abstract: According to one embodiment, a connecting portion of conductors has a first region containing copper as main component, and a second region provided on the first region and containing tin and copper as main components. At least part of a surface region of the second region is formed of a tin-copper alloy.
    Type: Application
    Filed: May 26, 2006
    Publication date: November 30, 2006
    Inventors: Masaya Hirashima, Tokihiko Mori
  • Patent number: 6301458
    Abstract: An image forming apparatus according to the present invention comprises a photoconductor drum rotatable around a drum shaft, an exposure unit for forming an image on the drum, a developing unit for supplying a developing agent to the image formed by the exposure unit, thereby forming a developing agent image, a transfer belt for transferring the developing agent image formed by the developing unit to paper, a drive motor having a drive shaft mounted with a coupling into which the distal end portion of the drum shaft is inserted such that the drive shaft and the drum shaft are coaxially connected to each other by means of the coupling, and a plurality of split pieces formed on the drum shaft and/or the coupling and adapted to be elastically deformed in a direction such that the split pieces contract or expand when the drum shaft is inserted into the coupling.
    Type: Grant
    Filed: August 3, 2000
    Date of Patent: October 9, 2001
    Assignee: Toshiba Tec Kabushiki Kaisha
    Inventors: Tokihiko Mori, Toshiaki Tanaka
  • Patent number: D471582
    Type: Grant
    Filed: March 19, 2002
    Date of Patent: March 11, 2003
    Assignee: Toshiba Tec Kabushiki Kaisha
    Inventor: Tokihiko Mori